JP6654922B2 - 導電フィラー用粉末 - Google Patents
導電フィラー用粉末 Download PDFInfo
- Publication number
- JP6654922B2 JP6654922B2 JP2016026525A JP2016026525A JP6654922B2 JP 6654922 B2 JP6654922 B2 JP 6654922B2 JP 2016026525 A JP2016026525 A JP 2016026525A JP 2016026525 A JP2016026525 A JP 2016026525A JP 6654922 B2 JP6654922 B2 JP 6654922B2
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- JP
- Japan
- Prior art keywords
- powder
- alloy
- mass
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- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000843 powder Substances 0.000 title claims description 55
- 239000011231 conductive filler Substances 0.000 title claims description 17
- 229910045601 alloy Inorganic materials 0.000 claims description 44
- 239000000956 alloy Substances 0.000 claims description 44
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims description 23
- 229910021332 silicide Inorganic materials 0.000 claims description 15
- 239000012535 impurity Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 229910052796 boron Inorganic materials 0.000 claims description 3
- 229910052791 calcium Inorganic materials 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 229910052748 manganese Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052708 sodium Inorganic materials 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 229910052720 vanadium Inorganic materials 0.000 claims description 3
- 238000000034 method Methods 0.000 description 12
- 229910000510 noble metal Inorganic materials 0.000 description 12
- 239000002245 particle Substances 0.000 description 12
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 10
- 229910052709 silver Inorganic materials 0.000 description 9
- 239000002994 raw material Substances 0.000 description 8
- 239000007789 gas Substances 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 229910052786 argon Inorganic materials 0.000 description 5
- 238000009689 gas atomisation Methods 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910000765 intermetallic Inorganic materials 0.000 description 4
- 239000011148 porous material Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000000889 atomisation Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 239000010970 precious metal Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003701 mechanical milling Methods 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 150000003377 silicon compounds Chemical class 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000013081 microcrystal Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000009692 water atomization Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Description
(I)Ag相
(II)Si及び元素X1を含有するシリサイド相
並びに
(III)Si相
を有する。この粉末の密度は、2.0Mg/m3以上6.0Mg/m3以下である。
(1)0.1質量%以上20質量%以下のAg
並びに
(2)40質量%以上50質量%以下のSi
を含み、かつ、残部は元素X1及び不可避的不純物である。合金が、積極的に添加された他の元素を含んでもよい。他の元素として、Au及びCuが例示される。
(I)Ag相
(II)Si及び元素X1を含有するシリサイド相
並びに
(III)Si相
を有する。この合金は、混相組織を有する。
G.A.:ガスアトマイズ法
D.A.:ディスクアトマイズ法
Claims (3)
- その材質が、0.1質量%以上20質量%のAg、40質量%以上50質量%未満のSi、及び導電性の元素X1を含み、残部が不可避的不純物である合金であり、
上記元素X1が、B、Na、Mg、Ca、Ti、V、Cr、Mn、Fe、Co及びNiからなる群から選択された1種又は2種以上であり、
上記合金が、
(I)Ag相
(II)上記Si及び上記元素X1を含有するシリサイド相
並びに
(III)Si相
を有しており、
密度が2.0Mg/m3以上6.0Mg/m3以下である導電フィラー用粉末。 - 上記合金における上記Agの含有率が5質量%以上20質量%以下である請求項1に記載の粉末。
- 上記合金における上記元素X1の含有率が20質量%以上60質量%未満である請求項1又は2に記載の粉末。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016026525A JP6654922B2 (ja) | 2016-02-16 | 2016-02-16 | 導電フィラー用粉末 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016026525A JP6654922B2 (ja) | 2016-02-16 | 2016-02-16 | 導電フィラー用粉末 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017145440A JP2017145440A (ja) | 2017-08-24 |
JP6654922B2 true JP6654922B2 (ja) | 2020-02-26 |
Family
ID=59682201
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016026525A Active JP6654922B2 (ja) | 2016-02-16 | 2016-02-16 | 導電フィラー用粉末 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6654922B2 (ja) |
-
2016
- 2016-02-16 JP JP2016026525A patent/JP6654922B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2017145440A (ja) | 2017-08-24 |
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