JP6654861B2 - 樹脂封止装置及び樹脂封止方法 - Google Patents

樹脂封止装置及び樹脂封止方法 Download PDF

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Publication number
JP6654861B2
JP6654861B2 JP2015219976A JP2015219976A JP6654861B2 JP 6654861 B2 JP6654861 B2 JP 6654861B2 JP 2015219976 A JP2015219976 A JP 2015219976A JP 2015219976 A JP2015219976 A JP 2015219976A JP 6654861 B2 JP6654861 B2 JP 6654861B2
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Japan
Prior art keywords
resin
substrate
resin sealing
lower mold
mold
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Active
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JP2015219976A
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English (en)
Japanese (ja)
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JP2017092220A (ja
Inventor
高瀬　慎二
慎二 高瀬
大西　洋平
洋平 大西
丈明 高
丈明 高
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Towa Corp
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Towa Corp
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Publication date
Application filed by Towa Corp filed Critical Towa Corp
Priority to JP2015219976A priority Critical patent/JP6654861B2/ja
Priority to PCT/JP2016/069184 priority patent/WO2017081881A1/ja
Priority to CN201680054205.5A priority patent/CN108028236B/zh
Priority to KR1020187016325A priority patent/KR102157944B1/ko
Priority to TW105127120A priority patent/TWI623068B/zh
Publication of JP2017092220A publication Critical patent/JP2017092220A/ja
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Publication of JP6654861B2 publication Critical patent/JP6654861B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/315—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the encapsulation having a cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP2015219976A 2015-11-09 2015-11-09 樹脂封止装置及び樹脂封止方法 Active JP6654861B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2015219976A JP6654861B2 (ja) 2015-11-09 2015-11-09 樹脂封止装置及び樹脂封止方法
PCT/JP2016/069184 WO2017081881A1 (ja) 2015-11-09 2016-06-28 樹脂封止装置及び樹脂封止方法
CN201680054205.5A CN108028236B (zh) 2015-11-09 2016-06-28 树脂封装装置以及树脂封装方法
KR1020187016325A KR102157944B1 (ko) 2015-11-09 2016-06-28 수지 밀봉 방법
TW105127120A TWI623068B (zh) 2015-11-09 2016-08-24 Resin packaging device and resin packaging method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015219976A JP6654861B2 (ja) 2015-11-09 2015-11-09 樹脂封止装置及び樹脂封止方法

Publications (2)

Publication Number Publication Date
JP2017092220A JP2017092220A (ja) 2017-05-25
JP6654861B2 true JP6654861B2 (ja) 2020-02-26

Family

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JP2015219976A Active JP6654861B2 (ja) 2015-11-09 2015-11-09 樹脂封止装置及び樹脂封止方法

Country Status (5)

Country Link
JP (1) JP6654861B2 (zh)
KR (1) KR102157944B1 (zh)
CN (1) CN108028236B (zh)
TW (1) TWI623068B (zh)
WO (1) WO2017081881A1 (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110010559B (zh) * 2017-12-08 2024-09-06 英飞凌科技股份有限公司 具有空气腔体的半导体封装件
JP6845822B2 (ja) * 2018-03-13 2021-03-24 Ｔｏｗａ株式会社 樹脂成形装置および樹脂成形品の製造方法
JP7084247B2 (ja) 2018-08-02 2022-06-14 Ｔｏｗａ株式会社 樹脂成形装置、成形型、及び樹脂成形品の製造方法
US12044962B2 (en) * 2019-04-19 2024-07-23 Canon Kabushiki Kaisha Forming apparatus, forming method, and article manufacturing method
CN112873810A (zh) * 2019-11-29 2021-06-01 复盛应用科技股份有限公司 高尔夫球杆头盖片制造方法及模具
JP7240339B2 (ja) * 2020-01-20 2023-03-15 Ｔｏｗａ株式会社 樹脂成形品の製造方法及び樹脂成形装置
JP7203778B2 (ja) * 2020-01-21 2023-01-13 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
JP7530772B2 (ja) * 2020-08-26 2024-08-08 Ｔｏｗａ株式会社 樹脂漏れ防止用部材、樹脂漏れ防止用部材供給機構、樹脂成形装置及び樹脂成形品の製造方法
CN113078070A (zh) * 2021-03-30 2021-07-06 无锡闻泰信息技术有限公司 器件塑封方法
JP2024004609A (ja) * 2022-06-29 2024-01-17 Ｔｏｗａ株式会社 成形型、樹脂成形装置、及び樹脂成形品の製造方法

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Publication number Priority date Publication date Assignee Title
JPH091596A (ja) * 1995-06-20 1997-01-07 Hitachi Ltd モールド装置
EP1189271A3 (en) * 1996-07-12 2003-07-16 Fujitsu Limited Wiring boards and mounting of semiconductor devices thereon
JP3194917B2 (ja) 1999-08-10 2001-08-06 トーワ株式会社 樹脂封止方法
JP4215593B2 (ja) * 2003-08-06 2009-01-28 アピックヤマダ株式会社 樹脂モールド装置
JP2008201055A (ja) * 2007-02-22 2008-09-04 Matsushita Electric Ind Co Ltd 樹脂成形用金型
JP2010016137A (ja) * 2008-07-03 2010-01-21 Panasonic Corp 半導体装置及び半導体装置の封止成形方法
JP5419070B2 (ja) * 2009-03-13 2014-02-19 アピックヤマダ株式会社 樹脂封止装置
JP6039198B2 (ja) * 2012-03-07 2016-12-07 Ｔｏｗａ株式会社 樹脂封止電子部品の製造方法及び樹脂封止電子部品の製造装置
JP5934138B2 (ja) * 2013-04-12 2016-06-15 Ｔｏｗａ株式会社 電子部品の圧縮樹脂封止方法及び圧縮樹脂封止装置
SG11201508166RA (en) * 2013-05-29 2015-12-30 Apic Yamada Corp Resin molding apparatus and resin molding method
JP6180206B2 (ja) * 2013-07-03 2017-08-16 アピックヤマダ株式会社 樹脂封止方法および圧縮成形装置
JP5944866B2 (ja) * 2013-06-20 2016-07-05 Ｔｏｗａ株式会社 電子部品の圧縮樹脂封止方法及び圧縮樹脂封止装置
JP6270571B2 (ja) * 2014-03-19 2018-01-31 Ｔｏｗａ株式会社 シート樹脂の供給方法と半導体封止方法及び半導体封止装置
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Also Published As

Publication number Publication date
WO2017081881A1 (ja) 2017-05-18
JP2017092220A (ja) 2017-05-25
KR20180081792A (ko) 2018-07-17
TWI623068B (zh) 2018-05-01
CN108028236A (zh) 2018-05-11
TW201717337A (zh) 2017-05-16
KR102157944B1 (ko) 2020-09-18
CN108028236B (zh) 2021-03-30

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