JP6653065B2 - 樹脂シート及びプリント配線板 - Google Patents

樹脂シート及びプリント配線板 Download PDF

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Publication number
JP6653065B2
JP6653065B2 JP2016562628A JP2016562628A JP6653065B2 JP 6653065 B2 JP6653065 B2 JP 6653065B2 JP 2016562628 A JP2016562628 A JP 2016562628A JP 2016562628 A JP2016562628 A JP 2016562628A JP 6653065 B2 JP6653065 B2 JP 6653065B2
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JP
Japan
Prior art keywords
insulating layer
mass
resin sheet
printed wiring
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
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JP2016562628A
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English (en)
Japanese (ja)
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JPWO2016088743A1 (ja
Inventor
秀和 出井
秀和 出井
誠司 四家
誠司 四家
恵一 長谷部
恵一 長谷部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
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Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of JPWO2016088743A1 publication Critical patent/JPWO2016088743A1/ja
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
JP2016562628A 2014-12-01 2015-12-01 樹脂シート及びプリント配線板 Active JP6653065B2 (ja)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP2014242919 2014-12-01
JP2014242919 2014-12-01
JP2014264482 2014-12-26
JP2014264482 2014-12-26
JP2015016966 2015-01-30
JP2015016966 2015-01-30
JP2015039902 2015-03-02
JP2015039902 2015-03-02
PCT/JP2015/083710 WO2016088743A1 (ja) 2014-12-01 2015-12-01 樹脂シート及びプリント配線板

Publications (2)

Publication Number Publication Date
JPWO2016088743A1 JPWO2016088743A1 (ja) 2017-09-07
JP6653065B2 true JP6653065B2 (ja) 2020-02-26

Family

ID=56091685

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016562628A Active JP6653065B2 (ja) 2014-12-01 2015-12-01 樹脂シート及びプリント配線板

Country Status (3)

Country Link
JP (1) JP6653065B2 (zh)
TW (1) TWI689418B (zh)
WO (1) WO2016088743A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI678393B (zh) * 2017-09-07 2019-12-01 台燿科技股份有限公司 樹脂組成物、以及使用該樹脂組成物所製得之預浸漬片、金屬箔積層板及印刷電路板
CN115348921A (zh) * 2020-04-03 2022-11-15 信越聚合物株式会社 覆金属层叠板

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3824101B2 (ja) * 1996-09-10 2006-09-20 日立化成工業株式会社 多層配線板及びその製造法
JPH10146917A (ja) * 1996-11-15 1998-06-02 Sumitomo Bakelite Co Ltd 印刷回路用積層板
JP5149917B2 (ja) * 2009-03-27 2013-02-20 日立化成工業株式会社 熱硬化性樹脂組成物、並びにこれを用いたプリプレグ、積層板及び多層プリント配線板
WO2011010672A1 (ja) * 2009-07-24 2011-01-27 住友ベークライト株式会社 樹脂組成物、樹脂シート、プリプレグ、金属張積層板、プリント配線板及び半導体装置
JP2012153752A (ja) * 2011-01-24 2012-08-16 Sumitomo Bakelite Co Ltd 樹脂組成物、プリプレグ、積層板、樹脂シート、プリント配線板及び半導体装置
CN103444276A (zh) * 2011-03-14 2013-12-11 住友电木株式会社 积层用预浸料
KR101877089B1 (ko) * 2011-05-27 2018-07-10 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 프리프레그 및 적층판
WO2013008684A1 (ja) * 2011-07-14 2013-01-17 三菱瓦斯化学株式会社 プリント配線板用樹脂組成物
JP5751063B2 (ja) * 2011-07-22 2015-07-22 住友ベークライト株式会社 積層シート連続体の製造方法および積層シート連続体
JP6480650B2 (ja) * 2011-09-29 2019-03-13 住友ベークライト株式会社 金属張積層板、プリント配線基板、半導体パッケージ、半導体装置および金属張積層板の製造方法
JP2014062150A (ja) * 2012-09-20 2014-04-10 Sekisui Chem Co Ltd 絶縁樹脂フィルム、絶縁樹脂フィルムの製造方法、予備硬化物、積層体及び多層基板
JP2016060881A (ja) * 2014-09-19 2016-04-25 日立化成株式会社 層間絶縁層用樹脂組成物、層間絶縁層用樹脂フィルム及び多層プリント配線板

Also Published As

Publication number Publication date
WO2016088743A1 (ja) 2016-06-09
TWI689418B (zh) 2020-04-01
TW201636205A (zh) 2016-10-16
JPWO2016088743A1 (ja) 2017-09-07

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