JP6622610B2 - 研削装置 - Google Patents

研削装置 Download PDF

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Publication number
JP6622610B2
JP6622610B2 JP2016022554A JP2016022554A JP6622610B2 JP 6622610 B2 JP6622610 B2 JP 6622610B2 JP 2016022554 A JP2016022554 A JP 2016022554A JP 2016022554 A JP2016022554 A JP 2016022554A JP 6622610 B2 JP6622610 B2 JP 6622610B2
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JP
Japan
Prior art keywords
grinding
wafer
holding
cleaning
crack
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016022554A
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English (en)
Japanese (ja)
Other versions
JP2017140663A (ja
Inventor
真司 吉田
真司 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2016022554A priority Critical patent/JP6622610B2/ja
Priority to TW105143901A priority patent/TWI695424B/zh
Priority to CN201710057507.4A priority patent/CN107042433B/zh
Priority to KR1020170016142A priority patent/KR102513203B1/ko
Publication of JP2017140663A publication Critical patent/JP2017140663A/ja
Application granted granted Critical
Publication of JP6622610B2 publication Critical patent/JP6622610B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02013—Grinding, lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning In General (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
JP2016022554A 2016-02-09 2016-02-09 研削装置 Active JP6622610B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016022554A JP6622610B2 (ja) 2016-02-09 2016-02-09 研削装置
TW105143901A TWI695424B (zh) 2016-02-09 2016-12-29 磨削裝置
CN201710057507.4A CN107042433B (zh) 2016-02-09 2017-01-26 磨削装置
KR1020170016142A KR102513203B1 (ko) 2016-02-09 2017-02-06 연삭 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016022554A JP6622610B2 (ja) 2016-02-09 2016-02-09 研削装置

Publications (2)

Publication Number Publication Date
JP2017140663A JP2017140663A (ja) 2017-08-17
JP6622610B2 true JP6622610B2 (ja) 2019-12-18

Family

ID=59543656

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016022554A Active JP6622610B2 (ja) 2016-02-09 2016-02-09 研削装置

Country Status (4)

Country Link
JP (1) JP6622610B2 (ko)
KR (1) KR102513203B1 (ko)
CN (1) CN107042433B (ko)
TW (1) TWI695424B (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6920141B2 (ja) * 2017-09-05 2021-08-18 株式会社ディスコ 研磨装置
CN108000324A (zh) * 2017-12-15 2018-05-08 大连理工常州研究院有限公司 一种用于机械制造的双驱动打磨装置
KR102037747B1 (ko) 2018-01-08 2019-10-29 에스케이실트론 주식회사 웨이퍼 연마 장치
JP2019169608A (ja) * 2018-03-23 2019-10-03 株式会社ディスコ 研削装置
US20200411338A1 (en) * 2018-04-09 2020-12-31 Tokyo Electron Limited Laser processing device, laser processing system and laser processing method
CN109015333A (zh) * 2018-09-06 2018-12-18 国家电网有限公司 一种发电机碳刷弧面研磨装置
CN109434671A (zh) * 2018-10-11 2019-03-08 德淮半导体有限公司 一种晶圆加工设备及加工方法
US11400563B2 (en) * 2018-12-07 2022-08-02 Disco Corporation Processing method for disk-shaped workpiece
JP7364338B2 (ja) * 2019-01-22 2023-10-18 株式会社ディスコ 保持面洗浄装置
JP2021074825A (ja) * 2019-11-11 2021-05-20 株式会社ディスコ 保持面洗浄装置
CN113770883A (zh) * 2021-09-08 2021-12-10 国网福建省电力有限公司营销服务中心 电能表回收处理线及其工作方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3708440A (en) 1972-02-14 1973-01-02 Upjohn Co Reclaiming scrap polyisocyanurate foam with an aliphatic diol and a dialkanolamine
JPH01171762A (ja) * 1987-12-28 1989-07-06 Shibayama Kikai Kk 半導体のウエハ研削盤の吸着チャック洗浄装置
JPH01205950A (ja) * 1988-02-12 1989-08-18 Disco Abrasive Syst Ltd ポーラスチャックテーブルの洗浄方法およびその装置
JP3155861B2 (ja) * 1993-05-18 2001-04-16 ローム株式会社 薄板状基板の移送装置
JP4079289B2 (ja) 1998-02-18 2008-04-23 株式会社ディスコ チャックテーブル洗浄装置
JP3504543B2 (ja) * 1999-03-03 2004-03-08 株式会社日立製作所 半導体素子の分離方法およびその装置並びに半導体素子の搭載方法
US6817057B2 (en) * 2001-08-30 2004-11-16 Micron Technology, Inc. Spindle chuck cleaner
US6910956B1 (en) * 2003-12-22 2005-06-28 Powerchip Semiconductor Corp. Wafer grinding apparatus
JP5164559B2 (ja) * 2007-12-27 2013-03-21 株式会社ディスコ 研削装置
JP5180661B2 (ja) * 2008-04-18 2013-04-10 株式会社ディスコ スピンナ洗浄装置および加工装置
JP2013122956A (ja) * 2011-12-09 2013-06-20 Disco Abrasive Syst Ltd 加工装置
JP6074154B2 (ja) * 2012-04-12 2017-02-01 株式会社ディスコ 加工装置
JP2014053510A (ja) * 2012-09-07 2014-03-20 Toshiba Corp 端面加工方法及び端面加工装置
JP2014075379A (ja) * 2012-10-02 2014-04-24 Nikon Corp 異物除去方法、異物除去用の工具、並びに露光方法及び装置
JP6109010B2 (ja) * 2013-08-14 2017-04-05 株式会社ディスコ 研削装置
JP2015079072A (ja) * 2013-10-16 2015-04-23 キヤノン株式会社 基板割れ処理システムを搭載した露光装置

Also Published As

Publication number Publication date
TW201729277A (zh) 2017-08-16
KR20170094497A (ko) 2017-08-18
JP2017140663A (ja) 2017-08-17
CN107042433B (zh) 2020-10-09
KR102513203B1 (ko) 2023-03-23
TWI695424B (zh) 2020-06-01
CN107042433A (zh) 2017-08-15

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