JP6620859B2 - 錫又は錫合金めっき堆積層の形成方法 - Google Patents

錫又は錫合金めっき堆積層の形成方法 Download PDF

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Publication number
JP6620859B2
JP6620859B2 JP2018197082A JP2018197082A JP6620859B2 JP 6620859 B2 JP6620859 B2 JP 6620859B2 JP 2018197082 A JP2018197082 A JP 2018197082A JP 2018197082 A JP2018197082 A JP 2018197082A JP 6620859 B2 JP6620859 B2 JP 6620859B2
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Japan
Prior art keywords
tin
acid
leveling agent
surfactant
alloy plating
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JP2018197082A
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English (en)
Japanese (ja)
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JP2019077949A5 (https=
JP2019077949A (ja
Inventor
眞美 渡邉
眞美 渡邉
京佳 薄
京佳 薄
中矢　清隆
清隆 中矢
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Mitsubishi Materials Corp
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Mitsubishi Materials Corp
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Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to KR1020207011532A priority Critical patent/KR102221566B1/ko
Priority to CN201880068798.XA priority patent/CN111279020B/zh
Priority to TW107137317A priority patent/TWI707065B/zh
Priority to PCT/JP2018/039332 priority patent/WO2019082884A1/ja
Priority to EP18871709.4A priority patent/EP3702493A4/en
Priority to US16/757,855 priority patent/US11162182B2/en
Publication of JP2019077949A publication Critical patent/JP2019077949A/ja
Publication of JP2019077949A5 publication Critical patent/JP2019077949A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/346—Solder materials or compositions specially adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3473—Plating of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
    • H10W72/227—Multiple bumps having different sizes

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2018197082A 2017-10-24 2018-10-19 錫又は錫合金めっき堆積層の形成方法 Active JP6620859B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CN201880068798.XA CN111279020B (zh) 2017-10-24 2018-10-23 锡或锡合金电镀液
TW107137317A TWI707065B (zh) 2017-10-24 2018-10-23 錫或錫合金鍍敷堆積層之形成方法
PCT/JP2018/039332 WO2019082884A1 (ja) 2017-10-24 2018-10-23 錫又は錫合金めっき液
EP18871709.4A EP3702493A4 (en) 2017-10-24 2018-10-23 TIN OR TIN ALLOY PLATING SOLUTION
KR1020207011532A KR102221566B1 (ko) 2017-10-24 2018-10-23 주석 또는 주석 합금 도금액
US16/757,855 US11162182B2 (en) 2017-10-24 2018-10-23 Tin or tin alloy plating solution

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017205203 2017-10-24
JP2017205203 2017-10-24

Publications (3)

Publication Number Publication Date
JP2019077949A JP2019077949A (ja) 2019-05-23
JP2019077949A5 JP2019077949A5 (https=) 2019-06-27
JP6620859B2 true JP6620859B2 (ja) 2019-12-18

Family

ID=66627357

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018197082A Active JP6620859B2 (ja) 2017-10-24 2018-10-19 錫又は錫合金めっき堆積層の形成方法

Country Status (6)

Country Link
US (1) US11162182B2 (https=)
EP (1) EP3702493A4 (https=)
JP (1) JP6620859B2 (https=)
KR (1) KR102221566B1 (https=)
CN (1) CN111279020B (https=)
TW (1) TWI707065B (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111690958B (zh) * 2019-03-15 2023-07-28 上海新阳半导体材料股份有限公司 一种锡镀液、其制备方法和应用
JP7140176B2 (ja) 2020-11-25 2022-09-21 三菱マテリアル株式会社 錫合金めっき液

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3261701B2 (ja) * 1991-02-05 2002-03-04 ミノルタ株式会社 画像表示方式及び装置
JP4296358B2 (ja) * 1998-01-21 2009-07-15 石原薬品株式会社 銀及び銀合金メッキ浴
JP4249292B2 (ja) * 1998-07-10 2009-04-02 株式会社大和化成研究所 錫及び錫合金メッキ浴
JP2001089894A (ja) * 1999-09-22 2001-04-03 Ishihara Chem Co Ltd スズ合金メッキを施した表面被覆材料、並びに当該被覆材料を利用した電子部品
JP2001262391A (ja) * 2000-03-14 2001-09-26 Ishihara Chem Co Ltd スズ−銅系合金メッキ浴並びに当該皮膜を形成した電子部品
EP1260614B1 (en) * 2001-05-24 2008-04-23 Shipley Co. L.L.C. Tin plating
JP4632027B2 (ja) * 2004-11-19 2011-02-16 石原薬品株式会社 鉛フリーのスズ−銀系合金又はスズ−銅系合金電気メッキ浴
JP2008028336A (ja) * 2006-07-25 2008-02-07 Shinko Electric Ind Co Ltd 電子部品の製造方法
JP6133056B2 (ja) 2012-12-27 2017-05-24 ローム・アンド・ハース電子材料株式会社 スズまたはスズ合金めっき液
JP6006683B2 (ja) 2013-06-26 2016-10-12 株式会社Ｊｃｕ スズまたはスズ合金用電気メッキ液およびその用途
US20150122662A1 (en) 2013-11-05 2015-05-07 Rohm And Haas Electronic Materials Llc Plating bath and method
US20150122661A1 (en) * 2013-11-05 2015-05-07 Rohm And Haas Electronic Materials Llc Plating bath and method
JP2015193916A (ja) * 2014-03-18 2015-11-05 上村工業株式会社 錫または錫合金の電気めっき浴、およびバンプの製造方法
JP6442722B2 (ja) 2014-10-08 2018-12-26 石原ケミカル株式会社 電気メッキ式の突起電極形成方法
JP7009679B2 (ja) * 2015-07-29 2022-01-26 石原ケミカル株式会社 電気スズ及び電気スズ合金メッキ浴、当該メッキ浴を用いた電着物の形成方法
JP2017179515A (ja) * 2016-03-31 2017-10-05 三菱マテリアル株式会社 めっき液
JP6834070B2 (ja) * 2016-06-13 2021-02-24 石原ケミカル株式会社 電気スズ及びスズ合金メッキ浴、当該メッキ浴を用いて電着物を形成した電子部品の製造方法
WO2018142776A1 (ja) * 2017-01-31 2018-08-09 三菱マテリアル株式会社 錫合金めっき液

Also Published As

Publication number Publication date
CN111279020B (zh) 2021-04-16
TWI707065B (zh) 2020-10-11
KR102221566B1 (ko) 2021-02-26
EP3702493A1 (en) 2020-09-02
CN111279020A (zh) 2020-06-12
KR20200051034A (ko) 2020-05-12
TW201930652A (zh) 2019-08-01
JP2019077949A (ja) 2019-05-23
US20200378024A1 (en) 2020-12-03
EP3702493A4 (en) 2021-08-11
US11162182B2 (en) 2021-11-02

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