JP6611817B2 - レーザーパターニングを用いたシャドーマスクの製造装置およびレーザーパターニングを用いたシャドーマスクの製造方法 - Google Patents

レーザーパターニングを用いたシャドーマスクの製造装置およびレーザーパターニングを用いたシャドーマスクの製造方法 Download PDF

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JP6611817B2
JP6611817B2 JP2017548446A JP2017548446A JP6611817B2 JP 6611817 B2 JP6611817 B2 JP 6611817B2 JP 2017548446 A JP2017548446 A JP 2017548446A JP 2017548446 A JP2017548446 A JP 2017548446A JP 6611817 B2 JP6611817 B2 JP 6611817B2
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masking
laser beam
pattern
laser
shadow mask
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JP2018511829A (ja
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パク，ジョン‐カブ
キム，ドー‐ホオン
キム，ボム‐サン
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AP Systems Inc
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AP Systems Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H01L21/0275—Photolithographic processes using lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
    • H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/621—Providing a shape to conductive layers, e.g. patterning or selective deposition

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Laser Beam Processing (AREA)
  • Physical Vapour Deposition (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electroluminescent Light Sources (AREA)
JP2017548446A 2015-03-17 2015-12-22 レーザーパターニングを用いたシャドーマスクの製造装置およびレーザーパターニングを用いたシャドーマスクの製造方法 Active JP6611817B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2015-0036810 2015-03-17
KR1020150036810A KR101582175B1 (ko) 2015-03-17 2015-03-17 레이저 패터닝을 이용한 섀도우 마스크의 제조 장치 및 레이저 패터닝을 이용한 섀도우 마스크의 제조 방법
PCT/KR2015/014069 WO2016148380A1 (ko) 2015-03-17 2015-12-22 레이저 패터닝을 이용한 섀도우 마스크의 제조 장치 및 레이저 패터닝을 이용한 섀도우 마스크의 제조 방법

Publications (2)

Publication Number Publication Date
JP2018511829A JP2018511829A (ja) 2018-04-26
JP6611817B2 true JP6611817B2 (ja) 2019-11-27

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JP (1) JP6611817B2 (ko)
KR (1) KR101582175B1 (ko)
CN (1) CN107427964B (ko)
TW (1) TWI616262B (ko)
WO (1) WO2016148380A1 (ko)

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KR102411536B1 (ko) * 2017-10-11 2022-06-22 삼성디스플레이 주식회사 증착 마스크 제조방법 및 제조장치
KR20190055295A (ko) * 2017-11-14 2019-05-23 삼성디스플레이 주식회사 마스크 제조 장치 및 마스크 제조 방법
KR102100361B1 (ko) * 2018-08-22 2020-04-13 주식회사 코윈디에스티 금속 마스크 생산 장치
KR102236541B1 (ko) * 2018-10-22 2021-04-07 주식회사 오럼머티리얼 마스크의 제조 방법, 마스크 지지 템플릿의 제조 방법 및 프레임 일체형 마스크의 제조 방법
KR20200055871A (ko) 2018-11-13 2020-05-22 삼성디스플레이 주식회사 기판 식각 방법
CN109702329A (zh) * 2019-03-06 2019-05-03 广东工业大学 一种阵列式激光加工方法
KR20210102523A (ko) * 2020-02-10 2021-08-20 삼성디스플레이 주식회사 전자 장치 제조 방법
CN111618443A (zh) * 2020-05-06 2020-09-04 湖北工业大学 碳纤维树脂基复合材料绿光超快激光加工系统及方法
KR20210142049A (ko) 2020-05-15 2021-11-24 삼성디스플레이 주식회사 표시 장치, 마스크 조립체, 표시 장치의 제조장치 및 표시 장치의 제조방법
CN113463045B (zh) * 2021-06-11 2022-10-14 华中科技大学 一种激光脉冲沉积系统及加工方法
CN113399829B (zh) * 2021-07-09 2022-11-11 东莞市中麒光电技术有限公司 焊接装置及使用该焊接装置的焊接方法
CN114161003B (zh) * 2021-11-10 2024-06-21 成都拓米电子装备制造有限公司 一种utg激光钻孔装置及其钻孔方法
WO2023084681A1 (ja) * 2021-11-11 2023-05-19 ギガフォトン株式会社 レーザ加工システム、レーザ加工方法、及び電子デバイスの製造方法
CN114758942B (zh) * 2022-03-24 2023-05-30 中国科学院光电技术研究所 一种反应离子刻蚀掩膜
CN116967613A (zh) * 2023-09-21 2023-10-31 上海传芯半导体有限公司 去除废掩模表面金属薄膜的装置及方法

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Also Published As

Publication number Publication date
KR101582175B1 (ko) 2016-01-05
TWI616262B (zh) 2018-03-01
TW201639651A (zh) 2016-11-16
JP2018511829A (ja) 2018-04-26
WO2016148380A1 (ko) 2016-09-22
CN107427964B (zh) 2019-06-25
CN107427964A (zh) 2017-12-01

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