JP6610105B2 - 電子部品の搬送装置及び電子部品連の製造方法 - Google Patents

電子部品の搬送装置及び電子部品連の製造方法 Download PDF

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Publication number
JP6610105B2
JP6610105B2 JP2015178798A JP2015178798A JP6610105B2 JP 6610105 B2 JP6610105 B2 JP 6610105B2 JP 2015178798 A JP2015178798 A JP 2015178798A JP 2015178798 A JP2015178798 A JP 2015178798A JP 6610105 B2 JP6610105 B2 JP 6610105B2
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JP
Japan
Prior art keywords
electronic component
magnetic force
path
rotation path
force generator
Prior art date
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Active
Application number
JP2015178798A
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English (en)
Japanese (ja)
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JP2017054980A (ja
Inventor
勝 角方
尚登 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2015178798A priority Critical patent/JP6610105B2/ja
Priority to US15/256,821 priority patent/US9919880B2/en
Priority to CN201610808416.5A priority patent/CN106516757B/zh
Priority to CN201910307629.3A priority patent/CN110077856B/zh
Priority to KR1020160116148A priority patent/KR102045350B1/ko
Publication of JP2017054980A publication Critical patent/JP2017054980A/ja
Priority to US15/885,854 priority patent/US10472187B2/en
Priority to JP2019197659A priority patent/JP6927269B2/ja
Priority to KR1020190143298A priority patent/KR102365913B1/ko
Application granted granted Critical
Publication of JP6610105B2 publication Critical patent/JP6610105B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/029—Feeding axial lead components, e.g. using vibrating bowls, magnetic fields
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
    • B65G47/24—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles
    • B65G47/248—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles by turning over or inverting them
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G54/00—Non-mechanical conveyors not otherwise provided for
    • B65G54/02—Non-mechanical conveyors not otherwise provided for electrostatic, electric, or magnetic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/003—Placing of components on belts holding the terminals
    • H05K13/0038—Placing of components on belts holding the terminals placing the components in a predetermined order
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Packaging Frangible Articles (AREA)
JP2015178798A 2015-09-10 2015-09-10 電子部品の搬送装置及び電子部品連の製造方法 Active JP6610105B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2015178798A JP6610105B2 (ja) 2015-09-10 2015-09-10 電子部品の搬送装置及び電子部品連の製造方法
US15/256,821 US9919880B2 (en) 2015-09-10 2016-09-06 Electronic component transportation device and method for manufacturing electronic component array
CN201910307629.3A CN110077856B (zh) 2015-09-10 2016-09-07 电子部件的输送装置
CN201610808416.5A CN106516757B (zh) 2015-09-10 2016-09-07 电子部件的输送装置以及电子部件串的制造方法
KR1020160116148A KR102045350B1 (ko) 2015-09-10 2016-09-09 전자부품의 반송 장치 및 일련의 전자부품의 제조 방법
US15/885,854 US10472187B2 (en) 2015-09-10 2018-02-01 Electronic component transportation device and method for manufacturing electronic component array
JP2019197659A JP6927269B2 (ja) 2015-09-10 2019-10-30 電子部品の搬送装置
KR1020190143298A KR102365913B1 (ko) 2015-09-10 2019-11-11 전자부품의 반송 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015178798A JP6610105B2 (ja) 2015-09-10 2015-09-10 電子部品の搬送装置及び電子部品連の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019197659A Division JP6927269B2 (ja) 2015-09-10 2019-10-30 電子部品の搬送装置

Publications (2)

Publication Number Publication Date
JP2017054980A JP2017054980A (ja) 2017-03-16
JP6610105B2 true JP6610105B2 (ja) 2019-11-27

Family

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Family Applications (1)

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JP2015178798A Active JP6610105B2 (ja) 2015-09-10 2015-09-10 電子部品の搬送装置及び電子部品連の製造方法

Country Status (4)

Country Link
US (2) US9919880B2 (ko)
JP (1) JP6610105B2 (ko)
KR (2) KR102045350B1 (ko)
CN (2) CN106516757B (ko)

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* Cited by examiner, † Cited by third party
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JP6610105B2 (ja) * 2015-09-10 2019-11-27 株式会社村田製作所 電子部品の搬送装置及び電子部品連の製造方法
JP7205846B2 (ja) * 2017-11-07 2023-01-17 株式会社 東京ウエルズ 搬送装置、搬送方法、及び外観検査装置
WO2019132017A1 (ja) 2017-12-29 2019-07-04 株式会社村田製作所 積層セラミックコンデンサ、積層セラミックコンデンサの実装構造体および電子部品連
JP7122135B2 (ja) * 2018-03-27 2022-08-19 太陽誘電株式会社 チップ部品の整列方法
WO2019188056A1 (ja) 2018-03-29 2019-10-03 株式会社Ｇｓユアサ 鉛蓄電池
JP6798528B2 (ja) * 2018-05-28 2020-12-09 株式会社村田製作所 チップ部品の整列方法
EP4100345A1 (en) 2020-02-04 2022-12-14 1188511 Canada Ltd. Performing operations on a workpiece using electromagnetic forces
CA3171857A1 (en) * 2020-02-19 2021-08-26 11886894 Canada Ltd. Field programmable analog array
JP7279673B2 (ja) * 2020-03-24 2023-05-23 株式会社村田製作所 搬送装置および搬送方法
CN111697787B (zh) * 2020-06-11 2021-11-30 广东电网有限责任公司 一种磁动力系统及磁动力运输设备
JP7306352B2 (ja) * 2020-08-28 2023-07-11 トヨタ自動車株式会社 フランジナット姿勢制御装置
JP7507395B2 (ja) 2020-11-30 2024-06-28 パナソニックＩｐマネジメント株式会社 フィーダ及びキャリアテープの搬送方法
CN117465753B (zh) * 2023-12-08 2024-10-22 广东微容电子科技有限公司 振动上料机构及编带机

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US3732967A (en) * 1971-12-03 1973-05-15 T Francis Orientation apparatus
DE2427755C2 (de) * 1974-06-08 1984-01-05 Deutsche Itt Industries Gmbh, 7800 Freiburg Vorrichtung zum Messen oder Bearbeiten von teilweise aus ferromagnetischem Material bestehenden elektronischen Bauelementen
SU520742A1 (ru) * 1975-07-14 1978-04-25 Курганское Проектно-Конструкторское Бюро Устройство дл отсекани ферромагнитных деталей
JPS63178704A (ja) * 1987-01-19 1988-07-22 Seiko Seiki Co Ltd 磁気浮上型搬送装置
JP3430854B2 (ja) * 1997-04-09 2003-07-28 株式会社村田製作所 電子部品の整列装置及び整列方法
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JP2001150249A (ja) * 1999-11-26 2001-06-05 Matsushita Electric Ind Co Ltd 電子部品の整列方法および整列装置並びに電子部品の製造方法
JP3653630B2 (ja) * 2001-06-25 2005-06-02 Ｔｄｋ株式会社 チップ部品の向き整列方法
JP2003069285A (ja) * 2001-08-24 2003-03-07 Rohm Co Ltd チップ型電子部品の方向揃え方法及びその装置
JP2005217136A (ja) * 2004-01-29 2005-08-11 Tdk Corp 積層電子部品の整列方法及び装置
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JP4951796B2 (ja) 2009-07-07 2012-06-13 株式会社村田製作所 電子部品搬送装置
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JP5626311B2 (ja) * 2012-10-23 2014-11-19 株式会社村田製作所 キャリアテープの製造方法
JP5987812B2 (ja) * 2013-01-25 2016-09-07 株式会社村田製作所 積層コンデンサ、テーピング積層コンデンサ連及び積層コンデンサの実装構造
JP6131933B2 (ja) * 2014-01-10 2017-05-24 株式会社村田製作所 テーピング電子部品連の製造装置、テーピング電子部品連の製造方法、電子部品の搬送装置、電子部品の搬送方法及びテーピング電子部品連
JP6610105B2 (ja) * 2015-09-10 2019-11-27 株式会社村田製作所 電子部品の搬送装置及び電子部品連の製造方法

Also Published As

Publication number Publication date
KR20170031064A (ko) 2017-03-20
CN110077856B (zh) 2021-03-12
JP2017054980A (ja) 2017-03-16
US9919880B2 (en) 2018-03-20
US10472187B2 (en) 2019-11-12
KR20190129787A (ko) 2019-11-20
CN110077856A (zh) 2019-08-02
KR102045350B1 (ko) 2019-11-15
US20170073170A1 (en) 2017-03-16
KR102365913B1 (ko) 2022-02-22
CN106516757B (zh) 2019-05-07
CN106516757A (zh) 2017-03-22
US20180155138A1 (en) 2018-06-07

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