JP6590309B2 - 導電層付プラスチック基板及びその製造方法 - Google Patents

導電層付プラスチック基板及びその製造方法 Download PDF

Info

Publication number
JP6590309B2
JP6590309B2 JP2015151597A JP2015151597A JP6590309B2 JP 6590309 B2 JP6590309 B2 JP 6590309B2 JP 2015151597 A JP2015151597 A JP 2015151597A JP 2015151597 A JP2015151597 A JP 2015151597A JP 6590309 B2 JP6590309 B2 JP 6590309B2
Authority
JP
Japan
Prior art keywords
gold
layer
plastic substrate
solution
nanoparticle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015151597A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017031458A (ja
JP2017031458A5 (enrdf_load_stackoverflow
Inventor
宣彦 里見
宣彦 里見
泰望 山本
泰望 山本
高井 治
治 高井
本間 英夫
英夫 本間
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanto Gakuin University Surface Engineering Research Institute
Original Assignee
Kanto Gakuin University Surface Engineering Research Institute
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanto Gakuin University Surface Engineering Research Institute filed Critical Kanto Gakuin University Surface Engineering Research Institute
Priority to JP2015151597A priority Critical patent/JP6590309B2/ja
Publication of JP2017031458A publication Critical patent/JP2017031458A/ja
Publication of JP2017031458A5 publication Critical patent/JP2017031458A5/ja
Application granted granted Critical
Publication of JP6590309B2 publication Critical patent/JP6590309B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
  • Chemically Coating (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2015151597A 2015-07-31 2015-07-31 導電層付プラスチック基板及びその製造方法 Active JP6590309B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015151597A JP6590309B2 (ja) 2015-07-31 2015-07-31 導電層付プラスチック基板及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015151597A JP6590309B2 (ja) 2015-07-31 2015-07-31 導電層付プラスチック基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2017031458A JP2017031458A (ja) 2017-02-09
JP2017031458A5 JP2017031458A5 (enrdf_load_stackoverflow) 2018-07-19
JP6590309B2 true JP6590309B2 (ja) 2019-10-16

Family

ID=57985644

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015151597A Active JP6590309B2 (ja) 2015-07-31 2015-07-31 導電層付プラスチック基板及びその製造方法

Country Status (1)

Country Link
JP (1) JP6590309B2 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6923351B2 (ja) * 2017-04-26 2021-08-18 株式会社C−Ink 積層体
KR102031294B1 (ko) * 2018-01-08 2019-11-08 한국기초과학지원연구원 액체 플라즈마 연속 코팅장치 및 방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004186661A (ja) * 2002-10-07 2004-07-02 Tokai Rubber Ind Ltd フレキシブルプリント基板の製法
JP2006111922A (ja) * 2004-10-14 2006-04-27 Nippon Valqua Ind Ltd フッ素系高分子材料表面への金皮膜の形成方法及び該方法により得られた金皮膜付きフッ素系高分子材料
JP5487538B2 (ja) * 2007-10-22 2014-05-07 コニカミノルタ株式会社 めっき方法及び導電性パターンシート
WO2010029635A1 (ja) * 2008-09-11 2010-03-18 パイオニア株式会社 金属配線の形成方法、及び金属配線を備えた電子部品
AU2010271298B2 (en) * 2009-07-08 2015-12-17 Clene Nanomedicine, Inc. Novel gold-based nanocrystals for medical treatments and electrochemical manufacturing processes therefor
JP5694265B2 (ja) * 2012-10-02 2015-04-01 学校法人関東学院 無電解めっき方法及び無電解めっき膜

Also Published As

Publication number Publication date
JP2017031458A (ja) 2017-02-09

Similar Documents

Publication Publication Date Title
JP4738308B2 (ja) 金属皮膜付シクロオレフィンポリマー材の製造方法及びその製造方法を用いて得られる金属皮膜付シクロオレフィンポリマー材
JP5843123B2 (ja) 導電性パターン、電子回路及び積層体の製造方法
JP2019526711A (ja) ポリマー物品表面に導電性トレースを形成する方法
CN105121700B (zh) 立体导电图案结构体的制造方法及用于其的立体成型用材料
Wang et al. Adhesion improvement of electroless copper to a polyimide film substrate by combining surface microroughening and imide ring cleavage
JP2018172788A (ja) 多孔性銅箔の製造方法及びこれを用いた多孔性銅箔
US10076032B2 (en) Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board
Kim et al. A simple, highly efficient route to electroless gold plating on complex 3D printed polyacrylate plastics
TWI764362B (zh) 附導電性圖案之構造體及其製造方法
JP6590309B2 (ja) 導電層付プラスチック基板及びその製造方法
JP6466110B2 (ja) プリント配線板用基板、プリント配線板及びプリント配線板用基板の製造方法
Xu et al. Environmentally friendly copper metallization of ABS by Cu-catalysed electroless process
JP5579160B2 (ja) 金属膜を有する積層体の製造方法
JP2008231459A (ja) ポリイミド樹脂上への導電性皮膜の形成方法
JP2016528388A (ja) 高速無電解めっきを用いる電導性イメージの形成
JP5756444B2 (ja) 積層体およびその製造方法、並びに、下地層形成用組成物
KR100906317B1 (ko) 폴리이미드 수지의 무기 박막 형성방법 및 표면 개질된무기 박막 형성용 폴리이미드 수지의 제조방법
Möbius et al. Plasma-printing and galvanic metallization hand in hand—A new technology for the cost-efficient manufacture of flexible printed circuits
KR20140049782A (ko) 플랙서블 패턴 형성 방법
JP2024132457A (ja) 無電解めっき方法
JP4427262B2 (ja) 薄膜回路の形成方法
US11164684B2 (en) Linear shape member and producing method therefor
JP2006253424A (ja) プリント配線板の製造方法
Kim et al. Study of palladium catalyzation for electroless copper plating on polyimide film
JP2005146330A (ja) 非導体材料への表面処理方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180605

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20180709

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20190410

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20190416

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190612

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20190820

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20190909

R150 Certificate of patent or registration of utility model

Ref document number: 6590309

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250