JP6582155B2 - 配線基板及び配線基板の製造方法 - Google Patents

配線基板及び配線基板の製造方法 Download PDF

Info

Publication number
JP6582155B2
JP6582155B2 JP2019519357A JP2019519357A JP6582155B2 JP 6582155 B2 JP6582155 B2 JP 6582155B2 JP 2019519357 A JP2019519357 A JP 2019519357A JP 2019519357 A JP2019519357 A JP 2019519357A JP 6582155 B2 JP6582155 B2 JP 6582155B2
Authority
JP
Japan
Prior art keywords
base material
wiring
wiring board
reinforcing member
support substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019519357A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2019074115A1 (ja
Inventor
小川　健一
健一 小川
隆夫 染谷
隆夫 染谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
University of Tokyo NUC
Original Assignee
Dai Nippon Printing Co Ltd
University of Tokyo NUC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd, University of Tokyo NUC filed Critical Dai Nippon Printing Co Ltd
Application granted granted Critical
Publication of JP6582155B2 publication Critical patent/JP6582155B2/ja
Publication of JPWO2019074115A1 publication Critical patent/JPWO2019074115A1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0271—Mechanical force other than pressure, e.g. shearing or pulling

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Insulated Conductors (AREA)
  • Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
JP2019519357A 2017-10-12 2018-10-12 配線基板及び配線基板の製造方法 Active JP6582155B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017198758 2017-10-12
JP2017198758 2017-10-12
PCT/JP2018/038196 WO2019074115A1 (ja) 2017-10-12 2018-10-12 配線基板及び配線基板の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019158380A Division JP7154508B2 (ja) 2017-10-12 2019-08-30 配線基板及び配線基板の製造方法

Publications (2)

Publication Number Publication Date
JP6582155B2 true JP6582155B2 (ja) 2019-09-25
JPWO2019074115A1 JPWO2019074115A1 (ja) 2019-11-14

Family

ID=66100782

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2019519357A Active JP6582155B2 (ja) 2017-10-12 2018-10-12 配線基板及び配線基板の製造方法
JP2019158380A Active JP7154508B2 (ja) 2017-10-12 2019-08-30 配線基板及び配線基板の製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2019158380A Active JP7154508B2 (ja) 2017-10-12 2019-08-30 配線基板及び配線基板の製造方法

Country Status (6)

Country Link
US (2) US11284507B2 (https=)
EP (1) EP3697180A4 (https=)
JP (2) JP6582155B2 (https=)
CN (1) CN111213435B (https=)
TW (1) TWI762729B (https=)
WO (1) WO2019074115A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6582155B2 (ja) * 2017-10-12 2019-09-25 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP7249512B2 (ja) * 2018-11-30 2023-03-31 大日本印刷株式会社 配線基板及び配線基板の製造方法
CN113170576B (zh) * 2019-01-21 2024-10-01 株式会社村田制作所 伸缩性布线基板
US20220142834A1 (en) * 2019-02-28 2022-05-12 Loop Plus Pty Ltd A sensing device, system and method
KR102311148B1 (ko) * 2019-11-20 2021-10-13 (주) 시큐라인 Led 보호를 위한 플렉시블 조명장치 및 그 구성 방법
JP7380158B2 (ja) * 2019-12-06 2023-11-15 大日本印刷株式会社 伸縮性回路基板および伸縮性デバイス
EP4122351A4 (en) 2020-03-19 2024-04-10 Mitsui Chemicals, Inc. SELF-ADHESIVE SHEET
KR102905931B1 (ko) * 2020-07-27 2025-12-29 삼성전자주식회사 연신 소자, 표시 패널, 센서 및 전자 장치
KR20230070808A (ko) 2021-11-15 2023-05-23 삼성전자주식회사 반도체 패키지 및 제조방법
JP7518395B2 (ja) * 2021-12-20 2024-07-18 日亜化学工業株式会社 回路基板、発光装置及びそれらの製造方法
KR102732578B1 (ko) * 2022-11-18 2024-11-21 한국생산기술연구원 부분 수직 주름 박형 평판 케이블의 연속 절연막 코팅방법, 및 이에 의해 제조된 부분 수직 주름 박형 평판 케이블

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5224265A (en) * 1991-10-29 1993-07-06 International Business Machines Corporation Fabrication of discrete thin film wiring structures
JP3261119B2 (ja) 2000-05-16 2002-02-25 三井金属鉱業株式会社 プリント配線板の製造方法
US7491892B2 (en) * 2003-03-28 2009-02-17 Princeton University Stretchable and elastic interconnects
US7265298B2 (en) * 2003-05-30 2007-09-04 The Regents Of The University Of California Serpentine and corduroy circuits to enhance the stretchability of a stretchable electronic device
US8217381B2 (en) * 2004-06-04 2012-07-10 The Board Of Trustees Of The University Of Illinois Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
JP4536430B2 (ja) * 2004-06-10 2010-09-01 イビデン株式会社 フレックスリジッド配線板
MY151572A (en) 2005-06-02 2014-06-13 Univ Illinois Printable semiconductor structures and related methods of making and assembling
US7880371B2 (en) * 2006-11-03 2011-02-01 Danfoss A/S Dielectric composite and a method of manufacturing a dielectric composite
JP5096855B2 (ja) * 2007-09-27 2012-12-12 新光電気工業株式会社 配線基板の製造方法及び配線基板
KR100967362B1 (ko) * 2008-02-28 2010-07-05 재단법인서울대학교산학협력재단 스트레칭 및 벤딩이 가능한 배선구조체 및 이의 제조방법
US8207473B2 (en) * 2008-06-24 2012-06-26 Imec Method for manufacturing a stretchable electronic device
JP4538069B2 (ja) * 2008-11-28 2010-09-08 株式会社東芝 プリント配線板
EP2392196B1 (en) * 2009-01-30 2018-08-22 IMEC vzw Stretchable electronic device
WO2010086033A1 (en) * 2009-01-30 2010-08-05 Interuniversitair Microelektronica Centrum Vzw Stretchable electronic device
JP5570353B2 (ja) 2010-09-03 2014-08-13 バイエル マテリアルサイエンス株式会社 伸縮性配線を有する導電部材
JP5640854B2 (ja) * 2011-03-25 2014-12-17 ソニー株式会社 導電性素子およびその製造方法、配線素子、情報入力装置、表示装置、電子機器、ならびに原盤
US9226402B2 (en) 2012-06-11 2015-12-29 Mc10, Inc. Strain isolation structures for stretchable electronics
KR101466795B1 (ko) * 2012-11-06 2014-11-28 재단법인대구경북과학기술원 신축성 기판 및 그 제조방법
KR20140100299A (ko) * 2013-02-06 2014-08-14 한국전자통신연구원 전자회로 및 그 제조방법
US20140299362A1 (en) * 2013-04-04 2014-10-09 Electronics And Telecommunications Research Institute Stretchable electric device and manufacturing method thereof
US9788789B2 (en) * 2013-08-30 2017-10-17 Thalmic Labs Inc. Systems, articles, and methods for stretchable printed circuit boards
KR20150069079A (ko) * 2013-12-12 2015-06-23 한국전자통신연구원 신축성 소자 및 그의 제조방법
JP6191991B2 (ja) * 2014-03-31 2017-09-06 パナソニックＩｐマネジメント株式会社 伸縮性フレキシブル基板およびその製造方法
KR102042137B1 (ko) * 2014-05-30 2019-11-28 한국전자통신연구원 전자장치 및 그 제조 방법
JP6574576B2 (ja) 2015-02-02 2019-09-11 株式会社フジクラ 伸縮性配線基板
JP6506653B2 (ja) * 2015-07-30 2019-04-24 日本メクトロン株式会社 伸縮性配線基板
JP6793510B2 (ja) * 2016-09-28 2020-12-02 日本メクトロン株式会社 伸縮性配線基板及び伸縮性配線基板の製造方法
US20180192520A1 (en) * 2016-12-29 2018-07-05 Intel Corporation Stretchable electronic system based on controlled buckled flexible printed circuit board (pcb)
JP6582155B2 (ja) * 2017-10-12 2019-09-25 大日本印刷株式会社 配線基板及び配線基板の製造方法
WO2019093069A1 (ja) * 2017-11-07 2019-05-16 大日本印刷株式会社 伸縮性回路基板および物品

Also Published As

Publication number Publication date
TW201923979A (zh) 2019-06-16
US20220210912A1 (en) 2022-06-30
EP3697180A4 (en) 2021-06-30
CN111213435A (zh) 2020-05-29
US11968777B2 (en) 2024-04-23
JP7154508B2 (ja) 2022-10-18
JPWO2019074115A1 (ja) 2019-11-14
JP2020010052A (ja) 2020-01-16
WO2019074115A1 (ja) 2019-04-18
CN111213435B (zh) 2023-07-14
US11284507B2 (en) 2022-03-22
EP3697180A1 (en) 2020-08-19
US20200260573A1 (en) 2020-08-13
TWI762729B (zh) 2022-05-01

Similar Documents

Publication Publication Date Title
JP6582155B2 (ja) 配線基板及び配線基板の製造方法
JP2020010052A5 (https=)
JP6585323B2 (ja) 配線基板及び配線基板の製造方法
JP6567795B1 (ja) 配線基板及び配線基板の製造方法
JP6774657B1 (ja) 配線基板及び配線基板の製造方法
JP7249514B2 (ja) 配線基板及び配線基板の製造方法
JP7400510B2 (ja) 配線基板およびその製造方法
JP7251165B2 (ja) 配線基板及び配線基板の製造方法
JP7480489B2 (ja) 配線基板及び配線基板の製造方法
JP7486042B2 (ja) 配線基板及び配線基板の製造方法
JP7279399B2 (ja) 配線基板及び配線基板の製造方法
JP7269544B2 (ja) 配線基板及び配線基板の製造方法
JP2020088337A (ja) 配線基板及び配線基板の製造方法
JP7272074B2 (ja) 配線基板及び配線基板の製造方法
JP7272065B2 (ja) 配線基板及び配線基板の製造方法
JP7216912B2 (ja) 配線基板及び配線基板の製造方法
JP7216911B2 (ja) 配線基板及び配線基板の製造方法
JP2020167224A (ja) 配線基板及び配線基板の製造方法
JP2020167319A (ja) 配線基板及び配線基板の製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20190410

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20190410

AA64 Notification of invalidation of claim of internal priority (with term)

Free format text: JAPANESE INTERMEDIATE CODE: A241764

Effective date: 20190419

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190508

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190529

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20190611

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20190614

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190724

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20190802

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20190902

R150 Certificate of patent or registration of utility model

Ref document number: 6582155

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250