JP6580119B2 - ポリイミド樹脂上への金属皮膜形成方法 - Google Patents

ポリイミド樹脂上への金属皮膜形成方法 Download PDF

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Publication number
JP6580119B2
JP6580119B2 JP2017253795A JP2017253795A JP6580119B2 JP 6580119 B2 JP6580119 B2 JP 6580119B2 JP 2017253795 A JP2017253795 A JP 2017253795A JP 2017253795 A JP2017253795 A JP 2017253795A JP 6580119 B2 JP6580119 B2 JP 6580119B2
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Japan
Prior art keywords
metal
film
polyimide resin
nickel
copper
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JP2017253795A
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English (en)
Japanese (ja)
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JP2019119901A (ja
Inventor
康二 田中
康二 田中
武 一文字
武 一文字
哲生 ▲クン▼
哲生 ▲クン▼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NAGASE(TAIWAN) CO., LTD.
Ishihara Chemical Co Ltd
Original Assignee
NAGASE(TAIWAN) CO., LTD.
Ishihara Chemical Co Ltd
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Priority to JP2017253795A priority Critical patent/JP6580119B2/ja
Priority to TW107146826A priority patent/TWI767101B/zh
Priority to KR1020207021127A priority patent/KR102474143B1/ko
Priority to CN201880083282.2A priority patent/CN111542647B/zh
Priority to PCT/JP2018/047554 priority patent/WO2019131627A1/ja
Publication of JP2019119901A publication Critical patent/JP2019119901A/ja
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641—Organic substrates, e.g. resin, plastic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
    • C23C18/2033—Heat
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics

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  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP2017253795A 2017-12-28 2017-12-28 ポリイミド樹脂上への金属皮膜形成方法 Active JP6580119B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2017253795A JP6580119B2 (ja) 2017-12-28 2017-12-28 ポリイミド樹脂上への金属皮膜形成方法
TW107146826A TWI767101B (zh) 2017-12-28 2018-12-24 聚醯亞胺樹脂上的金屬皮膜形成方法
KR1020207021127A KR102474143B1 (ko) 2017-12-28 2018-12-25 폴리이미드 수지 상의 금속 피막 형성 방법
CN201880083282.2A CN111542647B (zh) 2017-12-28 2018-12-25 聚酰亚胺树脂上的金属皮膜形成方法
PCT/JP2018/047554 WO2019131627A1 (ja) 2017-12-28 2018-12-25 ポリイミド樹脂上への金属皮膜形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017253795A JP6580119B2 (ja) 2017-12-28 2017-12-28 ポリイミド樹脂上への金属皮膜形成方法

Publications (2)

Publication Number Publication Date
JP2019119901A JP2019119901A (ja) 2019-07-22
JP6580119B2 true JP6580119B2 (ja) 2019-09-25

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JP2017253795A Active JP6580119B2 (ja) 2017-12-28 2017-12-28 ポリイミド樹脂上への金属皮膜形成方法

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Country Link
JP (1) JP6580119B2 (ko)
KR (1) KR102474143B1 (ko)
CN (1) CN111542647B (ko)
TW (1) TWI767101B (ko)
WO (1) WO2019131627A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102329838B1 (ko) * 2019-04-30 2021-11-22 도레이첨단소재 주식회사 연성 금속박 적층 필름, 이를 포함하는 물품 및 상기 연성 금속박 적층 필름의 제조방법
CN113445033B (zh) * 2021-06-28 2022-12-02 广东硕成科技股份有限公司 一种还原液及其使用方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07321457A (ja) 1994-05-24 1995-12-08 Toray Eng Co Ltd ポリイミド基板の製造方法
JP2001073159A (ja) 1999-09-01 2001-03-21 Nippon Riironaaru Kk ポリイミド樹脂表面への導電性皮膜の形成方法
JP2002256443A (ja) * 2001-02-27 2002-09-11 Japan Science & Technology Corp メッキ方法
US6645557B2 (en) 2001-10-17 2003-11-11 Atotech Deutschland Gmbh Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions
JP2005029735A (ja) 2003-07-10 2005-02-03 Mitsuboshi Belting Ltd ポリイミド樹脂の無機薄膜形成方法及び表面改質した無機薄膜形成用ポリイミド樹脂の製造方法
JP2006104504A (ja) 2004-10-01 2006-04-20 Yoichi Haruta ポリイミド樹脂材の無電解めっき前処理方法および表面金属化方法、並びにフレキシブルプリント配線板およびその製造方法
JP4708920B2 (ja) 2005-08-26 2011-06-22 荏原ユージライト株式会社 ポリイミド樹脂上の金属めっき皮膜形成方法
JP2008091456A (ja) 2006-09-29 2008-04-17 Mitsuboshi Belting Ltd ポリイミド樹脂表面の無機薄膜形成方法
CN101688308B (zh) * 2007-07-02 2012-10-10 荏原优莱特科技股份有限公司 金属层叠聚酰亚胺底座及其制造方法
JP5101623B2 (ja) * 2007-09-11 2012-12-19 新日鉄住金化学株式会社 導体層の形成方法、回路基板の製造方法、導電性微粒子の製造方法および導体層形成用組成物
CN101736329B (zh) * 2008-11-21 2012-02-22 比亚迪股份有限公司 一种聚酰亚胺膜活化液及聚酰亚胺膜金属化的方法
TW201300572A (zh) * 2011-06-28 2013-01-01 Ebara Udylite Kk 金屬膜形成方法
JP5808042B2 (ja) 2011-07-14 2015-11-10 東レエンジニアリング株式会社 パラジウムアンミン錯塩水溶液からなるパラジウム触媒付与液およびそれを用いた銅配線基板の無電解ニッケルめっき方法
JP6522425B2 (ja) * 2015-05-28 2019-05-29 石原ケミカル株式会社 銅表面処理用の置換ニッケルメッキ浴、当該メッキ浴を用いた銅張り部品の製造方法並びに当該銅張り部品

Also Published As

Publication number Publication date
TWI767101B (zh) 2022-06-11
WO2019131627A1 (ja) 2019-07-04
KR102474143B1 (ko) 2022-12-06
KR20200104346A (ko) 2020-09-03
JP2019119901A (ja) 2019-07-22
CN111542647B (zh) 2022-05-27
TW201934802A (zh) 2019-09-01
CN111542647A (zh) 2020-08-14

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