JP6578385B2 - 光硬化性組成物及びそれから形成された光硬化膜 - Google Patents

光硬化性組成物及びそれから形成された光硬化膜 Download PDF

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JP6578385B2
JP6578385B2 JP2018003292A JP2018003292A JP6578385B2 JP 6578385 B2 JP6578385 B2 JP 6578385B2 JP 2018003292 A JP2018003292 A JP 2018003292A JP 2018003292 A JP2018003292 A JP 2018003292A JP 6578385 B2 JP6578385 B2 JP 6578385B2
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photocurable composition
compound
meth
acrylate
carbon atoms
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Japanese (ja)
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JP2018141137A (ja
Inventor
庸桓 趙
庸桓 趙
▲聖▼彬 金
▲聖▼彬 金
▲漢▼雨 朴
▲漢▼雨 朴
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Dongwoo Fine Chem Co Ltd
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Dongwoo Fine Chem Co Ltd
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Epoxy Resins (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Paints Or Removers (AREA)
JP2018003292A 2017-01-18 2018-01-12 光硬化性組成物及びそれから形成された光硬化膜 Active JP6578385B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2017-0008505 2017-01-18
KR1020170008505A KR102554568B1 (ko) 2017-01-18 2017-01-18 광경화성 조성물 및 이로부터 형성된 광경화 막

Publications (2)

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JP2018141137A JP2018141137A (ja) 2018-09-13
JP6578385B2 true JP6578385B2 (ja) 2019-09-18

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JP (1) JP6578385B2 (ko)
KR (1) KR102554568B1 (ko)
CN (1) CN108329436B (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7479785B2 (ja) * 2017-08-02 2024-05-09 積水化学工業株式会社 有機ｅｌ表示素子用封止剤
JP7213675B2 (ja) * 2018-12-21 2023-01-27 東京応化工業株式会社 ネガ型感光性樹脂組成物、感光性レジストフィルム、パターン形成方法
JP7236672B2 (ja) * 2018-12-25 2023-03-10 パナソニックＩｐマネジメント株式会社 封止材の製造方法、及び発光装置の製造方法
KR20220118230A (ko) * 2021-02-18 2022-08-25 동우 화인켐 주식회사 광경화성 잉크 조성물, 봉지층 및 화상표시장치
WO2024106337A1 (ja) * 2022-11-14 2024-05-23 株式会社レゾナック 重合性組成物

Family Cites Families (12)

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Publication number Priority date Publication date Assignee Title
CA1274048A (en) * 1986-07-15 1990-09-11 Linda A. Domeier Bismaleimide formulations containing olefinic ether modifiers
JP3350975B2 (ja) * 1992-10-22 2002-11-25 松下電工株式会社 液状エポキシ樹脂組成物
JPH0841173A (ja) * 1994-07-27 1996-02-13 Matsushita Electric Works Ltd 液状エポキシ樹脂組成物、その製造方法及びその硬化方法
JP3887373B2 (ja) * 2003-12-12 2007-02-28 株式会社クラレ アリルエーテル化合物
JP2008202022A (ja) * 2007-01-23 2008-09-04 Fujifilm Corp 光ナノインプリントリソグラフィ用硬化性組成物およびそれを用いたパターン形成方法
JP5269449B2 (ja) * 2007-03-24 2013-08-21 株式会社ダイセル ナノインプリント用硬化性樹脂組成物
JP5402419B2 (ja) * 2009-09-04 2014-01-29 東洋インキＳｃホールディングス株式会社 紫外線硬化性組成物、それを用いた偏光板及びその製造方法
KR20110109944A (ko) * 2010-03-29 2011-10-06 가부시키가이샤 닛폰 쇼쿠바이 컬러 필터용 감광성 수지 조성물
KR101359470B1 (ko) * 2013-03-08 2014-02-12 동우 화인켐 주식회사 감광성 수지 조성물 및 이로부터 제조된 스페이서
JP6171573B2 (ja) * 2013-05-29 2017-08-02 東洋インキＳｃホールディングス株式会社 感光性樹脂組成物および硬化膜
JP6391491B2 (ja) * 2014-02-18 2018-09-19 積水化学工業株式会社 静電塗布用有機薄膜素子封止剤、樹脂保護膜、電子デバイス、及び、電子デバイスの製造方法
KR101798450B1 (ko) * 2017-01-10 2017-11-16 동우 화인켐 주식회사 광경화성 조성물 및 이로부터 형성된 광경화 막

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Publication number Publication date
KR102554568B1 (ko) 2023-07-11
CN108329436A (zh) 2018-07-27
KR20180085182A (ko) 2018-07-26
JP2018141137A (ja) 2018-09-13
CN108329436B (zh) 2020-10-13

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