JP6573853B2 - 弾性波デバイスおよびその製造方法 - Google Patents
弾性波デバイスおよびその製造方法 Download PDFInfo
- Publication number
- JP6573853B2 JP6573853B2 JP2016158253A JP2016158253A JP6573853B2 JP 6573853 B2 JP6573853 B2 JP 6573853B2 JP 2016158253 A JP2016158253 A JP 2016158253A JP 2016158253 A JP2016158253 A JP 2016158253A JP 6573853 B2 JP6573853 B2 JP 6573853B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- upper electrode
- lower electrode
- dielectric film
- piezoelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 239000010408 film Substances 0.000 claims description 256
- 239000003990 capacitor Substances 0.000 claims description 56
- 239000000758 substrate Substances 0.000 claims description 46
- 239000010409 thin film Substances 0.000 claims description 42
- 238000000034 method Methods 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 19
- 239000010410 layer Substances 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 13
- 238000003780 insertion Methods 0.000 description 13
- 230000037431 insertion Effects 0.000 description 13
- 238000005530 etching Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 7
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 6
- 239000011651 chromium Substances 0.000 description 6
- 229910052814 silicon oxide Inorganic materials 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- 239000010936 titanium Substances 0.000 description 4
- 230000007704 transition Effects 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 238000001771 vacuum deposition Methods 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 2
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/173—Air-gaps
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
- H03H9/542—Filters comprising resonators of piezoelectric or electrostrictive material including passive elements
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
- H03H9/56—Monolithic crystal filters
- H03H9/566—Electric coupling means therefor
- H03H9/568—Electric coupling means therefor consisting of a ladder configuration
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H2003/021—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks the resonators or networks being of the air-gap type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H2003/023—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks the resonators or networks being of the membrane type
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016158253A JP6573853B2 (ja) | 2016-08-10 | 2016-08-10 | 弾性波デバイスおよびその製造方法 |
| US15/649,483 US10491191B2 (en) | 2016-08-10 | 2017-07-13 | Acoustic wave device and method of fabricating the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016158253A JP6573853B2 (ja) | 2016-08-10 | 2016-08-10 | 弾性波デバイスおよびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018026735A JP2018026735A (ja) | 2018-02-15 |
| JP2018026735A5 JP2018026735A5 (enExample) | 2018-04-19 |
| JP6573853B2 true JP6573853B2 (ja) | 2019-09-11 |
Family
ID=61160402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016158253A Expired - Fee Related JP6573853B2 (ja) | 2016-08-10 | 2016-08-10 | 弾性波デバイスおよびその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US10491191B2 (enExample) |
| JP (1) | JP6573853B2 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6889423B2 (ja) * | 2018-02-05 | 2021-06-18 | 株式会社村田製作所 | フィルタ装置、高周波フロントエンド回路、および通信装置 |
| JP7302981B2 (ja) * | 2019-02-07 | 2023-07-04 | 太陽誘電株式会社 | フィルタおよびマルチプレクサ |
| JP7288307B2 (ja) * | 2019-02-07 | 2023-06-07 | 太陽誘電株式会社 | 弾性波デバイスおよびその製造方法、フィルタ並びにマルチプレクサ |
| JP7215413B2 (ja) | 2019-12-27 | 2023-01-31 | 株式会社村田製作所 | 弾性波フィルタ |
| JP7485479B2 (ja) * | 2020-03-17 | 2024-05-16 | 太陽誘電株式会社 | フィルタ |
| KR102463862B1 (ko) | 2020-08-20 | 2022-11-04 | (주)와이솔 | 개선된 온도계수를 갖는 fbar 칩 및 패키지 |
| US11515247B2 (en) * | 2021-01-14 | 2022-11-29 | Qualcomm Incorporated | Capacitance fine tuning by fin capacitor design |
| US12047744B2 (en) * | 2021-04-26 | 2024-07-23 | Rf360 Singapore Pte. Ltd. | Etch stop and protection layer for capacitor processing in electroacoustic devices |
| US12483226B2 (en) | 2021-12-29 | 2025-11-25 | Skyworks Solutions, Inc. | Acoustic wave device with tilted multilayer interdigital transducer electrode |
| US20230223910A1 (en) | 2022-01-13 | 2023-07-13 | Skyworks Solutions, Inc. | Method of making acoustic wave device with vertically mass loaded multi-layer interdigital transducer electrode for transverse mode suppression |
| US20230320227A1 (en) * | 2022-03-29 | 2023-10-05 | Taiwan Semiconductor Manufacturing Company Ltd. | Method for manufacturing semiconductor structure and semiconductor structure thereof |
| CN119054201A (zh) * | 2022-04-20 | 2024-11-29 | 株式会社村田制作所 | 弹性波装置以及其制造方法 |
| CN117134739B (zh) * | 2022-05-20 | 2024-05-28 | 锐石创芯(重庆)科技有限公司 | 滤波器、多工器、射频前端模组及滤波器的制备方法 |
| CN115001440B (zh) * | 2022-07-19 | 2022-10-21 | 深圳新声半导体有限公司 | 电子器件和电容结构 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63187713A (ja) * | 1987-01-29 | 1988-08-03 | Toshiba Corp | 集積型圧電薄膜機能素子 |
| JPH07221587A (ja) * | 1994-01-31 | 1995-08-18 | Murata Mfg Co Ltd | 共振子装置 |
| EP1290790B1 (en) * | 2000-04-06 | 2009-04-01 | Nxp B.V. | Tunable filter arrangement |
| TW540173B (en) * | 2002-05-03 | 2003-07-01 | Asia Pacific Microsystems Inc | Bulk acoustic device having integrated fine-tuning and trimming devices |
| JP2005093465A (ja) * | 2003-09-12 | 2005-04-07 | Murata Mfg Co Ltd | 薄膜キャパシタ、圧電フィルタおよびその製造方法、ならびに分波器、通信機 |
| JP2008054046A (ja) * | 2006-08-24 | 2008-03-06 | Matsushita Electric Ind Co Ltd | 圧電フィルタ及びそれを用いた共用器、通信機器 |
| JP4342370B2 (ja) * | 2004-04-19 | 2009-10-14 | 株式会社東芝 | 高周波集積回路装置 |
| JP4697528B2 (ja) * | 2004-06-02 | 2011-06-08 | 太陽誘電株式会社 | 弾性波装置 |
| JP4791181B2 (ja) * | 2005-12-28 | 2011-10-12 | 京セラ株式会社 | 薄膜バルク音響波共振子、それを備えるフィルタおよび通信装置ならびに薄膜バルク音響波共振子の製造方法 |
| US8756778B2 (en) * | 2009-10-01 | 2014-06-24 | Stmicroelectronics Sa | Method of adjustment during manufacture of a circuit having a capacitor |
| JP6336712B2 (ja) | 2013-01-28 | 2018-06-06 | 太陽誘電株式会社 | 圧電薄膜共振器、フィルタおよびデュプレクサ |
| JP6333540B2 (ja) | 2013-11-11 | 2018-05-30 | 太陽誘電株式会社 | 圧電薄膜共振子、フィルタ、及び分波器 |
| JP6603012B2 (ja) * | 2014-05-21 | 2019-11-06 | 太陽誘電株式会社 | 分波器 |
-
2016
- 2016-08-10 JP JP2016158253A patent/JP6573853B2/ja not_active Expired - Fee Related
-
2017
- 2017-07-13 US US15/649,483 patent/US10491191B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US20180048290A1 (en) | 2018-02-15 |
| JP2018026735A (ja) | 2018-02-15 |
| US10491191B2 (en) | 2019-11-26 |
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