JP6566895B2 - 気密封止されたled灯、及び、気密封止されたled灯の製造方法 - Google Patents
気密封止されたled灯、及び、気密封止されたled灯の製造方法 Download PDFInfo
- Publication number
- JP6566895B2 JP6566895B2 JP2016042331A JP2016042331A JP6566895B2 JP 6566895 B2 JP6566895 B2 JP 6566895B2 JP 2016042331 A JP2016042331 A JP 2016042331A JP 2016042331 A JP2016042331 A JP 2016042331A JP 6566895 B2 JP6566895 B2 JP 6566895B2
- Authority
- JP
- Japan
- Prior art keywords
- led lamp
- hermetically sealed
- metal cap
- base
- sealed led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 60
- 239000002184 metal Substances 0.000 claims description 60
- 229910000679 solder Inorganic materials 0.000 claims description 21
- 239000011521 glass Substances 0.000 claims description 17
- 239000000919 ceramic Substances 0.000 claims description 9
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 claims description 8
- 238000002844 melting Methods 0.000 claims description 8
- 230000008018 melting Effects 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000011159 matrix material Substances 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 239000003086 colorant Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 description 7
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 210000000214 mouth Anatomy 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 208000002925 dental caries Diseases 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 210000003128 head Anatomy 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- PQIJHIWFHSVPMH-UHFFFAOYSA-N [Cu].[Ag].[Sn] Chemical compound [Cu].[Ag].[Sn] PQIJHIWFHSVPMH-UHFFFAOYSA-N 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000000156 glass melt Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 229910000969 tin-silver-copper Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V33/00—Structural combinations of lighting devices with other articles, not otherwise provided for
- F21V33/0064—Health, life-saving or fire-fighting equipment
- F21V33/0068—Medical equipment
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/06—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor with illuminating arrangements
- A61B1/0661—Endoscope light sources
- A61B1/0684—Endoscope light sources using light emitting diodes [LED]
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61C—DENTISTRY; APPARATUS OR METHODS FOR ORAL OR DENTAL HYGIENE
- A61C1/00—Dental machines for boring or cutting ; General features of dental machines or apparatus, e.g. hand-piece design
- A61C1/08—Machine parts specially adapted for dentistry
- A61C1/088—Illuminating devices or attachments
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61C—DENTISTRY; APPARATUS OR METHODS FOR ORAL OR DENTAL HYGIENE
- A61C3/00—Dental tools or instruments
- A61C3/02—Tooth drilling or cutting instruments; Instruments acting like a sandblast machine
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/005—Sealing arrangements therefor
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
- G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
- G02B23/2407—Optical details
- G02B23/2461—Illumination
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
- G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
- G02B23/2476—Non-optical details, e.g. housings, mountings, supports
- G02B23/2484—Arrangements in relation to a camera or imaging device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
- F21W2131/20—Lighting for medical use
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2101/00—Point-like light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Landscapes
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Veterinary Medicine (AREA)
- Public Health (AREA)
- General Health & Medical Sciences (AREA)
- Animal Behavior & Ethology (AREA)
- Epidemiology (AREA)
- Dentistry (AREA)
- Surgery (AREA)
- General Physics & Mathematics (AREA)
- Biomedical Technology (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Molecular Biology (AREA)
- Heart & Thoracic Surgery (AREA)
- Biophysics (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Pathology (AREA)
- Radiology & Medical Imaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Medical Informatics (AREA)
- Astronomy & Astrophysics (AREA)
- Multimedia (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Endoscopes (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Dental Tools And Instruments Or Auxiliary Dental Instruments (AREA)
Description
2 金属キャップ
3 窓
4 給電線
5 チャネル
6 ベース
7 チャネル
8 くぼみ
9 変換器
10 LED
11 フィードスルー
12 フィードスルー
13 イメージセンサ
14 レンズ
15 医療機器
16 レセプタクル
17 LED灯
18 ベース
19 金属キャップ
20 窓
21 変換器
22 LED
23 はんだ
Claims (13)
- 気密封止されたLED灯であって、
複数のLEDが載置されたセラミックからなるベースと、複数の窓を有し且つ前記ベースにはんだ付けされた少なくとも1つの金属キャップと、を含み、
前記LED灯は、電気的要素、光学的要素、又は機械的要素を導き入れるための、前記ベース及び前記金属キャップを貫通して延在する主チャネルを有し、
前記LED灯は、別個に制御可能な、それぞれ異なる光の色の複数のLEDを含み、
少なくとも2つの別個に制御可能なLEDは、それぞれ異なる光出射角度を有する、
気密封止されたLED灯。 - 気密封止されたLED灯であって、
複数のLEDが載置されたセラミックからなるベースと、複数の窓を有し且つ前記ベースにはんだ付けされた少なくとも1つの金属キャップと、を含み、
前記LED灯は、電気的要素、光学的要素、又は機械的要素を導き入れるための、前記ベース及び前記金属キャップを貫通して延在する主チャネルを有し、
前記複数の窓は、それぞれ異なる焦点距離及び/又はそれぞれ異なる開口角度を有するレンズによって画定されている、
気密封止されたLED灯。 - 前記金属キャップは、複数のチャネルを有し、前記複数のチャネル内に前記複数の窓が溶着される、
請求項1又は2記載の気密封止されたLED灯。 - 前記LED灯は、中央に配置された主チャネルを備える環形の形状を有する、
請求項3記載の気密封止されたLED灯。 - 前記LED灯は、環形に分配された複数の窓を含む、
請求項4記載の気密封止されたLED灯。 - 前記複数の窓は、レンズによって画定されている、
請求項5記載の気密封止されたLED灯。 - 前記金属キャップは、それぞれの窓に隣接したくぼみを有する、
請求項3から6のいずれか1項記載の気密封止されたLED灯。 - 前記窓の下の前記複数のチャネルの1つ内に、蛍光粒子が埋め込まれたシリコーンキャリアマトリクスを備える変換器が配置されている、
請求項3から7のいずれか1項記載の気密封止されたLED灯。 - 医療器具であって、
請求項1から8のいずれか1項記載の気密封止されたLED灯を含み、
前記LED灯は、LEDの光が直接外部に出射するように前記医療器具に埋め込まれている、
医療器具。 - 請求項1から8のいずれか1項記載の気密封止されたLED灯の製造方法であって、
まず、セラミックからなるベース上に少なくとも1つのLEDを組み付け、
その後、金錫はんだを用いて前記ベースに金属キャップをはんだ付けする、
気密封止されたLED灯の製造方法。 - 前記ベースに前記金属キャップをはんだ付けする前に、前記金属キャップに窓を設ける、
請求項10記載の気密封止されたLED灯の製造方法。 - 前記金属キャップのそれぞれのチャネル内にガラスを溶融させることによって、前記窓を製造する、
請求項11記載の気密封止されたLED灯の製造方法。 - 前記金属キャップを、ニッケル及び/又は金を含有するコーティングによって被覆する、
請求項10から12のいずれか1項記載の気密封止されたLED灯の製造方法。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015103331.3 | 2015-03-06 | ||
DE102015103331.3A DE102015103331B4 (de) | 2015-03-06 | 2015-03-06 | Hermetisch abgedichtete LED-Leuchte, Verfahren zur Herstellung einer hermetisch abgedichteten LED-Leuchte sowie ärztliches Instrument umfassend eine hermetisch abgedichtete LED-Leuchte |
DE102015103507.3 | 2015-03-10 | ||
DE102015103507 | 2015-03-10 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017123344A Division JP2017162843A (ja) | 2015-03-06 | 2017-06-23 | 気密封止されたled灯、及び、気密封止されたled灯の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016164880A JP2016164880A (ja) | 2016-09-08 |
JP6566895B2 true JP6566895B2 (ja) | 2019-08-28 |
Family
ID=55527752
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016042331A Active JP6566895B2 (ja) | 2015-03-06 | 2016-03-04 | 気密封止されたled灯、及び、気密封止されたled灯の製造方法 |
JP2017123344A Pending JP2017162843A (ja) | 2015-03-06 | 2017-06-23 | 気密封止されたled灯、及び、気密封止されたled灯の製造方法 |
JP2020183100A Active JP6985485B2 (ja) | 2015-03-06 | 2020-10-30 | 気密封止されたled灯、及び、気密封止されたled灯の製造方法 |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017123344A Pending JP2017162843A (ja) | 2015-03-06 | 2017-06-23 | 気密封止されたled灯、及び、気密封止されたled灯の製造方法 |
JP2020183100A Active JP6985485B2 (ja) | 2015-03-06 | 2020-10-30 | 気密封止されたled灯、及び、気密封止されたled灯の製造方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US10890318B2 (ja) |
EP (1) | EP3064166B1 (ja) |
JP (3) | JP6566895B2 (ja) |
KR (1) | KR102034919B1 (ja) |
CN (2) | CN105937708A (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102017212030A1 (de) * | 2017-07-13 | 2019-01-17 | Tridonic Jennersdorf Gmbh | LED/LD-Beleuchtungsvorrichtung mit neuartiger Remote-Leuchtstoff-Konfiguration und Verfahren zur Herstellung einer solchen |
DE102017127723A1 (de) * | 2017-11-23 | 2019-05-23 | Schott Ag | Autoklavierbares medizinisches Gerät sowie Betätigungseinrichtung für ein autoklavierbares medizinisches Gerät |
Family Cites Families (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2568443B1 (fr) * | 1984-07-27 | 1986-11-14 | Cepe | Boitier a fermeture a froid supportant les hautes temperatures |
US5531664A (en) * | 1990-12-26 | 1996-07-02 | Olympus Optical Co., Ltd. | Bending actuator having a coil sheath with a fixed distal end and a free proximal end |
CA2177178A1 (en) | 1993-11-22 | 1995-06-01 | John I. Shipp | Single sensor video imaging system and method using sequential color object illumination |
JPH09140664A (ja) * | 1995-11-20 | 1997-06-03 | Osada Res Inst Ltd | 歯科用口腔内観察カメラ |
EP0935643A1 (en) | 1996-10-02 | 1999-08-18 | Ormco Corporation | Metal to ceramic attachment in dental appliances |
US6547721B1 (en) * | 1998-08-07 | 2003-04-15 | Olympus Optical Co., Ltd. | Endoscope capable of being autoclaved |
JP2000316874A (ja) * | 1999-05-07 | 2000-11-21 | Morita Mfg Co Ltd | 照明機構付き歯科用器具 |
US6796939B1 (en) * | 1999-08-26 | 2004-09-28 | Olympus Corporation | Electronic endoscope |
JP3121812B1 (ja) * | 1999-10-20 | 2001-01-09 | 株式会社ナカニシ | 歯科・医科用器具の照明装置 |
JP2003163382A (ja) | 2001-11-29 | 2003-06-06 | Matsushita Electric Ind Co Ltd | 受光素子または発光素子用パッケージ |
US7775685B2 (en) * | 2003-05-27 | 2010-08-17 | Cree, Inc. | Power surface mount light emitting die package |
JP3668480B2 (ja) * | 2003-03-06 | 2005-07-06 | オリンパス株式会社 | 撮像装置 |
JP4056930B2 (ja) | 2003-05-27 | 2008-03-05 | 株式会社モリタ製作所 | 医療用光照射装置 |
JP4418202B2 (ja) * | 2003-10-06 | 2010-02-17 | オリンパス株式会社 | 内視鏡 |
US7195482B2 (en) | 2003-12-30 | 2007-03-27 | Ultradent Products, Inc. | Dental curing device having a heat sink for dissipating heat |
JP2005215213A (ja) * | 2004-01-28 | 2005-08-11 | Pentax Corp | レンズ接合体の製造方法、レンズ接合体および内視鏡 |
US7762950B2 (en) * | 2004-03-25 | 2010-07-27 | Olympus Corporation | Endoscope |
JP4606954B2 (ja) * | 2004-07-15 | 2011-01-05 | Toto株式会社 | 光レセプタクル用フェルール保持部材及びその製造方法並びにそれを用いた光レセプタクル |
WO2006046559A1 (ja) * | 2004-10-25 | 2006-05-04 | Olympus Corporation | 内視鏡装置 |
DE202005002341U1 (de) | 2005-02-14 | 2005-06-02 | Gutmann, Max | UV-LED Lampe zur Sichtbarmachung von Zahnbelägen |
JP4652843B2 (ja) * | 2005-02-21 | 2011-03-16 | オリンパスメディカルシステムズ株式会社 | 内視鏡 |
DE202005020300U1 (de) | 2005-12-27 | 2006-02-16 | Chou, Peter | Steuerschaltung zum Verändern der Helligkeit und der Farbe einer Beleuchtungsvorrichtung mit Licht emittierenden Dioden |
JP5130680B2 (ja) | 2006-03-02 | 2013-01-30 | 日亜化学工業株式会社 | 半導体装置およびその形成方法 |
JP2007311325A (ja) * | 2006-04-17 | 2007-11-29 | Citizen Electronics Co Ltd | 導光板及びその製造方法とその導光板を用いたバックライトユニット |
DE102007022605B4 (de) | 2006-05-24 | 2018-06-21 | Osram Gmbh | Farblich durchstimmbares Beleuchtungssystem zur abbildenden Beleuchtung |
EP1870022B1 (de) * | 2006-06-22 | 2016-05-11 | W & H Dentalwerk Bürmoos GmbH | Medizinischer Handgriff mit Beleuchtungsvorrichtung und Verfahren zur Herstellung |
US8269828B2 (en) * | 2006-12-22 | 2012-09-18 | Perceptron, Inc. | Thermal dissipation for imager head assembly of remote inspection device |
CN201062739Y (zh) * | 2007-05-09 | 2008-05-21 | 常熟鸿邦新能源有限公司 | 组合式路灯结构 |
DE102008033556A1 (de) * | 2008-03-14 | 2009-09-17 | Kaltenbach & Voigt Gmbh | Lichtquelle für ein zahnmedizinisches Gerät |
JP5223447B2 (ja) | 2008-05-12 | 2013-06-26 | 日亜化学工業株式会社 | 半導体発光装置 |
US8390193B2 (en) * | 2008-12-31 | 2013-03-05 | Intematix Corporation | Light emitting device with phosphor wavelength conversion |
US8328381B2 (en) * | 2009-02-25 | 2012-12-11 | Black & Decker Inc. | Light for a power tool and method of illuminating a workpiece |
JP5384970B2 (ja) * | 2009-02-25 | 2014-01-08 | オリンパス株式会社 | アダプタ式内視鏡 |
JP5186464B2 (ja) * | 2009-11-04 | 2013-04-17 | 株式会社モリタ製作所 | 医療用ハンドピース |
JP2011100866A (ja) * | 2009-11-06 | 2011-05-19 | Toshiba Corp | リードを有する薄膜基板及び薄膜基板の接続方法 |
DE202010000518U1 (de) | 2010-03-31 | 2011-08-09 | Turck Holding Gmbh | Lampe mit einer in einem hermetisch verschlossenen Gehäuse angeordneten LED |
EP2548530B1 (de) * | 2011-07-19 | 2014-03-19 | W & H Dentalwerk Bürmoos GmbH | Beleuchtungsvorrichtung für ein medizinisches, insbesondere dentales, Instrument |
JP5716627B2 (ja) * | 2011-10-06 | 2015-05-13 | オムロン株式会社 | ウエハの接合方法及び接合部の構造 |
WO2013061838A1 (ja) * | 2011-10-27 | 2013-05-02 | オリンパスメディカルシステムズ株式会社 | 内視鏡 |
CN102628554A (zh) * | 2012-03-22 | 2012-08-08 | 浙江英特来光电科技有限公司 | 一种三通道共极式透镜结构的led灯 |
JP2013251384A (ja) * | 2012-05-31 | 2013-12-12 | Seika Sangyo Kk | 発光装置 |
JP6037293B2 (ja) * | 2012-07-11 | 2016-12-07 | パナソニックIpマネジメント株式会社 | 窒化物半導体発光装置 |
KR101373710B1 (ko) * | 2012-12-12 | 2014-03-13 | (주)포인트엔지니어링 | 엘이디 금속기판 패키지 및 그 제조방법 |
US9133990B2 (en) * | 2013-01-31 | 2015-09-15 | Dicon Fiberoptics Inc. | LED illuminator apparatus, using multiple luminescent materials dispensed onto an array of LEDs, for improved color rendering, color mixing, and color temperature control |
CN103162236A (zh) * | 2013-03-28 | 2013-06-19 | 苏州百纳思光学科技有限公司 | 一种用于多芯片封装大功率led路灯的自由曲面透镜 |
JP2015002824A (ja) | 2013-06-20 | 2015-01-08 | 株式会社中央技研 | 口腔医療用照明器具 |
EP2815719B1 (en) * | 2013-06-21 | 2018-10-03 | Kerr Corporation | Dental light curing device |
JP5891208B2 (ja) * | 2013-08-13 | 2016-03-22 | Hoya株式会社 | 内視鏡用照明光学系 |
EP2842513A1 (de) * | 2013-08-28 | 2015-03-04 | W & H Dentalwerk Bürmoos GmbH | Beleuchtungsvorrichtung für ein medizinisches, insbesondere dentales, Instrument |
CN203686834U (zh) * | 2014-01-26 | 2014-07-02 | 中山市帝光汽配实业有限公司 | 一种led汽车前照灯 |
JP2015176960A (ja) * | 2014-03-14 | 2015-10-05 | 株式会社東芝 | 発光装置 |
JP6302762B2 (ja) * | 2014-06-23 | 2018-03-28 | スタンレー電気株式会社 | 発光装置および照明装置 |
WO2018003442A1 (ja) * | 2016-06-27 | 2018-01-04 | オリンパス株式会社 | 内視鏡、内視鏡の製造方法 |
-
2016
- 2016-02-25 EP EP16157312.6A patent/EP3064166B1/de active Active
- 2016-03-03 KR KR1020160025657A patent/KR102034919B1/ko active IP Right Grant
- 2016-03-04 CN CN201610125274.2A patent/CN105937708A/zh active Pending
- 2016-03-04 CN CN202111351477.0A patent/CN114017688A/zh active Pending
- 2016-03-04 JP JP2016042331A patent/JP6566895B2/ja active Active
- 2016-03-04 US US15/060,866 patent/US10890318B2/en active Active
-
2017
- 2017-06-23 JP JP2017123344A patent/JP2017162843A/ja active Pending
-
2020
- 2020-10-30 JP JP2020183100A patent/JP6985485B2/ja active Active
- 2020-11-24 US US17/103,217 patent/US11933485B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2017162843A (ja) | 2017-09-14 |
JP2021028913A (ja) | 2021-02-25 |
US20210080100A1 (en) | 2021-03-18 |
US10890318B2 (en) | 2021-01-12 |
JP2016164880A (ja) | 2016-09-08 |
KR20160108199A (ko) | 2016-09-19 |
EP3064166A1 (de) | 2016-09-07 |
US20160258582A1 (en) | 2016-09-08 |
JP6985485B2 (ja) | 2021-12-22 |
US11933485B2 (en) | 2024-03-19 |
CN114017688A (zh) | 2022-02-08 |
EP3064166B1 (de) | 2018-07-04 |
CN105937708A (zh) | 2016-09-14 |
KR102034919B1 (ko) | 2019-10-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6985485B2 (ja) | 気密封止されたled灯、及び、気密封止されたled灯の製造方法 | |
EP1382960B1 (en) | Light irradiating unit | |
KR101144489B1 (ko) | Led 패키지 | |
JP5914652B2 (ja) | 医療用の、特に歯科医療用の器具用の照明手段 | |
US7922378B2 (en) | Medical illumination unit | |
JP2009170759A (ja) | 発光装置及びそれを備えた灯具 | |
WO2002033312A2 (en) | A light-emitting assembly | |
JP2008021973A (ja) | 発光装置 | |
WO2013150810A1 (ja) | 内視鏡 | |
US6956243B1 (en) | Light emitting diode | |
JP3423304B1 (ja) | 光照射装置及び光照射ユニット | |
JP2014027179A (ja) | 発光装置およびその製造方法、並びにパッケージ部材 | |
JP5591427B1 (ja) | 波長変換を具備する小型の光出力装置 | |
JP5338899B2 (ja) | 光通信モジュール及び光通信モジュールの製造方法 | |
JP2019532744A (ja) | 照明要素 | |
JP2004247312A (ja) | 光源装置 | |
JP5561296B2 (ja) | 発光装置 | |
US20200083401A1 (en) | Method for producing light-emitting semiconductor components and light-emitting semiconductor component | |
JP7303790B2 (ja) | 別個の発光構成を備えたled/ld照射デバイスおよびその製造方法 | |
JP2004212402A (ja) | 光照射装置 | |
US20200379246A1 (en) | Optical module for endoscope, endoscope, and manufacturing method of optical module for endoscope | |
JP2004077463A (ja) | 光源装置及び光照射ユニット | |
KR101900647B1 (ko) | 치과 진료용 조명장치 | |
KR20170022241A (ko) | 치과 진료용 조명장치 | |
JP2008311512A (ja) | 発光装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20160304 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20161228 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170110 |
|
RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20170322 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20170407 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20170607 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170623 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20170911 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180109 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20180116 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20180209 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190510 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20190730 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6566895 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |