JP6566879B2 - 電子部品内蔵基板 - Google Patents

電子部品内蔵基板 Download PDF

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Publication number
JP6566879B2
JP6566879B2 JP2016014726A JP2016014726A JP6566879B2 JP 6566879 B2 JP6566879 B2 JP 6566879B2 JP 2016014726 A JP2016014726 A JP 2016014726A JP 2016014726 A JP2016014726 A JP 2016014726A JP 6566879 B2 JP6566879 B2 JP 6566879B2
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JP
Japan
Prior art keywords
substrate
pad
electronic component
diameter
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016014726A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017135290A (ja
JP2017135290A5 (enExample
Inventor
聡史 白木
聡史 白木
功一 田中
功一 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2016014726A priority Critical patent/JP6566879B2/ja
Priority to US15/409,766 priority patent/US9935053B2/en
Publication of JP2017135290A publication Critical patent/JP2017135290A/ja
Publication of JP2017135290A5 publication Critical patent/JP2017135290A5/ja
Application granted granted Critical
Publication of JP6566879B2 publication Critical patent/JP6566879B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H10W70/614—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H10W70/093—
    • H10W70/095—
    • H10W70/611—
    • H10W70/635—
    • H10W70/65—
    • H10W74/016—
    • H10W74/127—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H10W70/60—
    • H10W74/00—
    • H10W74/012—
    • H10W74/117—
    • H10W74/15—
    • H10W90/401—
    • H10W90/701—
    • H10W90/722—
    • H10W90/724—
    • H10W90/734—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Ceramic Engineering (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Geometry (AREA)
JP2016014726A 2016-01-28 2016-01-28 電子部品内蔵基板 Active JP6566879B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2016014726A JP6566879B2 (ja) 2016-01-28 2016-01-28 電子部品内蔵基板
US15/409,766 US9935053B2 (en) 2016-01-28 2017-01-19 Electronic component integrated substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016014726A JP6566879B2 (ja) 2016-01-28 2016-01-28 電子部品内蔵基板

Publications (3)

Publication Number Publication Date
JP2017135290A JP2017135290A (ja) 2017-08-03
JP2017135290A5 JP2017135290A5 (enExample) 2019-01-17
JP6566879B2 true JP6566879B2 (ja) 2019-08-28

Family

ID=59387036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016014726A Active JP6566879B2 (ja) 2016-01-28 2016-01-28 電子部品内蔵基板

Country Status (2)

Country Link
US (1) US9935053B2 (enExample)
JP (1) JP6566879B2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10177011B2 (en) * 2017-04-13 2019-01-08 Powertech Technology Inc. Chip packaging method by using a temporary carrier for flattening a multi-layer structure
JP7202785B2 (ja) * 2018-04-27 2023-01-12 新光電気工業株式会社 配線基板及び配線基板の製造方法
KR102592327B1 (ko) 2018-10-16 2023-10-20 삼성전자주식회사 반도체 패키지
JP7196936B2 (ja) * 2018-12-10 2022-12-27 凸版印刷株式会社 半導体装置用配線基板の製造方法、及び半導体装置用配線基板
JP7478742B2 (ja) * 2019-01-07 2024-05-07 テスラ，インコーポレイテッド 構成要素の埋め込みアレイを有するパッケージデバイス
JP7451880B2 (ja) * 2019-05-20 2024-03-19 Ｔｏｐｐａｎホールディングス株式会社 半導体パッケージおよび製造方法
KR102822947B1 (ko) * 2020-06-29 2025-06-20 삼성전자주식회사 반도체 패키지, 및 이를 가지는 패키지 온 패키지
US12148867B2 (en) * 2021-01-15 2024-11-19 Foshan Nationstar Optoelectronics Co., Ltd Light-emitting device and displayer
JP7750458B2 (ja) * 2021-06-30 2025-10-07 新光電気工業株式会社 半導体装置
JP7740628B2 (ja) * 2021-12-20 2025-09-17 新光電気工業株式会社 電子部品内蔵基板及び電子部品内蔵基板の製造方法
CN120127067B (zh) * 2025-05-14 2025-08-22 甬矽电子(宁波)股份有限公司 堆叠封装结构及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2007069606A1 (ja) 2005-12-14 2009-05-21 新光電気工業株式会社 チップ内蔵基板の製造方法
JP2008078343A (ja) * 2006-09-21 2008-04-03 Cmk Corp プリント配線板及びその製造方法
JP5054440B2 (ja) * 2007-06-15 2012-10-24 新光電気工業株式会社 電子部品内蔵基板の製造方法及び電子部品内蔵基板
JP2010232616A (ja) * 2009-03-30 2010-10-14 Nec Corp 半導体装置及び配線基板
JP2015076465A (ja) * 2013-10-08 2015-04-20 イビデン株式会社 プリント配線板、プリント配線板の製造方法、パッケージ−オン−パッケージ
KR20150092881A (ko) * 2014-02-06 2015-08-17 엘지이노텍 주식회사 인쇄회로기판, 패키지 기판 및 이의 제조 방법
JP6375121B2 (ja) * 2014-02-27 2018-08-15 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
JP2015162660A (ja) * 2014-02-28 2015-09-07 イビデン株式会社 プリント配線板、プリント配線板の製造方法、パッケージ−オン−パッケージ
JP2015170725A (ja) * 2014-03-07 2015-09-28 イビデン株式会社 複合基板

Also Published As

Publication number Publication date
JP2017135290A (ja) 2017-08-03
US20170221829A1 (en) 2017-08-03
US9935053B2 (en) 2018-04-03

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