JP6559243B2 - 画像記録システムおよび自動車 - Google Patents
画像記録システムおよび自動車 Download PDFInfo
- Publication number
- JP6559243B2 JP6559243B2 JP2017540691A JP2017540691A JP6559243B2 JP 6559243 B2 JP6559243 B2 JP 6559243B2 JP 2017540691 A JP2017540691 A JP 2017540691A JP 2017540691 A JP2017540691 A JP 2017540691A JP 6559243 B2 JP6559243 B2 JP 6559243B2
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- JP
- Japan
- Prior art keywords
- image recording
- recording system
- carrier plate
- optical system
- lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000003287 optical effect Effects 0.000 claims description 70
- 238000001746 injection moulding Methods 0.000 claims description 31
- 239000000463 material Substances 0.000 claims description 29
- 229920001187 thermosetting polymer Polymers 0.000 claims description 25
- 239000002775 capsule Substances 0.000 claims description 23
- 239000000835 fiber Substances 0.000 claims description 9
- 150000002118 epoxides Chemical class 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 7
- 239000004412 Bulk moulding compound Substances 0.000 claims description 6
- 239000004744 fabric Substances 0.000 claims description 6
- 229920001568 phenolic resin Polymers 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 3
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 3
- 239000000347 magnesium hydroxide Substances 0.000 claims description 3
- -1 phenol formaldehyde compound Chemical class 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims 1
- 229910052796 boron Inorganic materials 0.000 claims 1
- 150000004767 nitrides Chemical class 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000002347 injection Methods 0.000 description 7
- 239000007924 injection Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000001514 detection method Methods 0.000 description 5
- 230000007613 environmental effect Effects 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 4
- 229920006362 Teflon® Polymers 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 230000001419 dependent effect Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000002759 woven fabric Substances 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- 229920001774 Perfluoroether Polymers 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000004297 night vision Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000011345 viscous material Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
- B29C45/1676—Making multilayered or multicoloured articles using a soft material and a rigid material, e.g. making articles with a sealing part
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
- B29C45/1676—Making multilayered or multicoloured articles using a soft material and a rigid material, e.g. making articles with a sealing part
- B29C2045/1678—Making multilayered or multicoloured articles using a soft material and a rigid material, e.g. making articles with a sealing part first moulding the soft material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0013—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor using fillers dispersed in the moulding material, e.g. metal particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
- B29C45/1671—Making multilayered or multicoloured articles with an insert
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Lens Barrels (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Studio Devices (AREA)
Description
120 光学系ホルダ
121 ニードル通路
125 外側
126 保持位置
130 画像記録装置
140 キャリアプレート
150 ボンディングワイヤ
170 カプセル包囲部
200 射出成形工具
200a,200b,200c 部分
210,211 ダイ
220,221 ゲート通路
250 加熱パトローネ
270 エジェクタ
280 空気通路
290 シール体、シールエレメント
300 ニードル
310 コアトラクタ
320 金属織物
Claims (9)
- 画像記録システム(100)であって、該画像記録システム(100)が、貫通孔を備えた少なくとも1つの光学系ホルダ(120)と、表面を備えた側で前記貫通孔を閉鎖するキャリアプレート(140)と、該キャリアプレート(140)の前記表面上に配置された画像記録装置(130)とを有している形式のものにおいて、
前記貫通孔から前記光学系ホルダ(120)の外側(125)まで前記光学系ホルダ(120)を貫通するニードル通路(121)が設けられており、前記ニードル通路(121)が、光学レンズとして作用する、前記画像記録装置のカプセル包囲部(170)を射出成形するために適していて、
前記画像記録装置の、光学レンズとして作用する前記カプセル包囲部(170)がさらに設けられており、該カプセル包囲部(170)が少なくとも1つの透明な熱硬化性の材料を有していて、前記熱硬化性の材料が、前記ニードル通路(121)を通って前記外側(125)まで延在していて、
前記画像記録装置(130)の周囲を前記光学レンズの形の前記カプセル包囲部(170)によって充填することにより、前記画像記録装置(130)は前記キャリアプレート(140)の表面に封止されていることを特徴とする、画像記録システム(100)。 - 前記キャリアプレート(140)がさらに、前記カプセル包囲部(170)によって包囲された回路を備えている、請求項1記載の画像記録システム(100)。
- 前記熱硬化性の材料が、シリコーン、ポリウレタンおよび/またはエポキシドを含有している、請求項1または2記載の画像記録システム(100)。
- 前記カプセル包囲部(170)が、反射防止として作用する表面構造を有している、請求項1から3までのいずれか1項記載の画像記録システム(100)。
- 前記キャリアプレート(140)が少なくとも1つのボンディングワイヤ回路(150)を有している、請求項1から4のいずれか1項記載の画像記録システム(100)。
- 前記ニードル通路が前記キャリアプレート(140)の表面に対して平行に延在している、請求項1から5のいずれか1項記載の画像記録システム(100)。
- 前記光学系ホルダ(120)が別の熱硬化性の材料を有しており、該熱硬化性の材料が、フェノールフォルムアルデヒドコンパウンド、エポキシドおよび/またはバルク成形コンパウンドを含有しており、50〜70%までが、窒化硼素、水酸化アルミニウムおよび/または水酸化マグネシウムを含有する熱伝導性の粒子で置き換えられていて、および/または、別の熱硬化性の材料の繊維成分の10〜30%までが、銅、アルミニウムおよび/または銀を含有する金属織物(320)によって形成される、請求項1から6のいずれか1項記載の画像記録システム(100)。
- さらに、対物レンズを形成するレンズが設けられており、該レンズが前記光学系ホルダ(120)によって保持位置(126)で保持される、請求項1から7のいずれか1項記載の画像記録システム(100)。
- 請求項1から8のいずれか1項記載の画像記録システム(100)を備えた自動車。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015202314.1 | 2015-02-10 | ||
DE102015202314 | 2015-02-10 | ||
DE102015213575.6A DE102015213575A1 (de) | 2015-02-10 | 2015-07-20 | Bildaufnahmesystem und ein Kraftfahrzeug |
DE102015213575.6 | 2015-07-20 | ||
PCT/EP2016/050797 WO2016128173A1 (de) | 2015-02-10 | 2016-01-15 | Bildaufnahmesystem und ein kraftfahrzeug |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018511069A JP2018511069A (ja) | 2018-04-19 |
JP6559243B2 true JP6559243B2 (ja) | 2019-08-14 |
Family
ID=56498646
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017540691A Expired - Fee Related JP6559243B2 (ja) | 2015-02-10 | 2016-01-15 | 画像記録システムおよび自動車 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10321034B2 (ja) |
EP (1) | EP3257238B1 (ja) |
JP (1) | JP6559243B2 (ja) |
CN (1) | CN107211083B (ja) |
DE (1) | DE102015213575A1 (ja) |
WO (1) | WO2016128173A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102018210909A1 (de) | 2017-09-21 | 2019-03-21 | Robert Bosch Gmbh | Verfahren zur Herstellung von Kameramodulen und einer Kameramodulgruppe |
DE102017216709A1 (de) * | 2017-09-21 | 2019-03-21 | Robert Bosch Gmbh | Verfahren zur Herstellung von Kameramodulen und einer Kameramodulgruppe |
JP7231325B2 (ja) * | 2017-11-08 | 2023-03-01 | マクセル株式会社 | 鏡筒、レンズユニット、カメラモジュール、レンズユニット製造方法および鏡筒成形用金型 |
DE102019206266A1 (de) * | 2019-05-02 | 2020-11-05 | Robert Bosch Gmbh | Verfahren zum Herstellen eines optischen Systems für eine Kameraeinrichtung |
DE102019209764A1 (de) * | 2019-07-03 | 2021-01-07 | Robert Bosch Gmbh | Verfahren zur Herstellung eines Kameragehäuses |
CN115004679A (zh) * | 2020-03-17 | 2022-09-02 | 索尼半导体解决方案公司 | 传感器封装、其制造方法和成像装置 |
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JPS56103483A (en) * | 1980-01-21 | 1981-08-18 | Fuji Photo Film Co Ltd | Manufacture of semiconductor device for photoelectric conversion |
JPS56103482A (en) * | 1980-01-21 | 1981-08-18 | Fuji Photo Film Co Ltd | Manufacture of semiconductor device for photoelectric conversion |
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JP2001358997A (ja) * | 2000-06-12 | 2001-12-26 | Mitsubishi Electric Corp | 半導体装置 |
JP4034031B2 (ja) * | 2000-08-01 | 2008-01-16 | 三菱電機株式会社 | 撮像装置 |
JP2002258129A (ja) * | 2001-03-05 | 2002-09-11 | Moritex Corp | 耐振性レンズ系および該レンズ系の製造方法 |
US20030158503A1 (en) * | 2002-01-18 | 2003-08-21 | Shinya Matsumoto | Capsule endoscope and observation system that uses it |
JP4285966B2 (ja) | 2002-09-27 | 2009-06-24 | 三洋電機株式会社 | カメラモジュール |
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-
2015
- 2015-07-20 DE DE102015213575.6A patent/DE102015213575A1/de not_active Withdrawn
-
2016
- 2016-01-15 WO PCT/EP2016/050797 patent/WO2016128173A1/de active Application Filing
- 2016-01-15 CN CN201680009529.7A patent/CN107211083B/zh active Active
- 2016-01-15 EP EP16700959.6A patent/EP3257238B1/de active Active
- 2016-01-15 US US15/549,930 patent/US10321034B2/en active Active
- 2016-01-15 JP JP2017540691A patent/JP6559243B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20180035025A1 (en) | 2018-02-01 |
CN107211083B (zh) | 2021-02-26 |
WO2016128173A1 (de) | 2016-08-18 |
DE102015213575A1 (de) | 2016-08-11 |
JP2018511069A (ja) | 2018-04-19 |
EP3257238B1 (de) | 2019-08-28 |
EP3257238A1 (de) | 2017-12-20 |
CN107211083A (zh) | 2017-09-26 |
US10321034B2 (en) | 2019-06-11 |
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