JP6555239B2 - 半導体集積回路及び半導体集積回路のクロック供給方法 - Google Patents

半導体集積回路及び半導体集積回路のクロック供給方法 Download PDF

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JP6555239B2
JP6555239B2 JP2016241633A JP2016241633A JP6555239B2 JP 6555239 B2 JP6555239 B2 JP 6555239B2 JP 2016241633 A JP2016241633 A JP 2016241633A JP 2016241633 A JP2016241633 A JP 2016241633A JP 6555239 B2 JP6555239 B2 JP 6555239B2
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circuit
clock
control
semiconductor integrated
integrated circuit
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Japanese (ja)
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JP2017174394A (ja
JP2017174394A5 (cg-RX-API-DMAC7.html
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翔 亀沢
翔 亀沢
管野　透
透 管野
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Ricoh Co Ltd
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Ricoh Co Ltd
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Priority to US15/441,617 priority Critical patent/US10234891B2/en
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Priority to US16/265,251 priority patent/US10901453B2/en
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JP2016241633A 2016-03-16 2016-12-13 半導体集積回路及び半導体集積回路のクロック供給方法 Expired - Fee Related JP6555239B2 (ja)

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Application Number Priority Date Filing Date Title
US15/441,617 US10234891B2 (en) 2016-03-16 2017-02-24 Semiconductor integrated circuit, and method for supplying clock signals in semiconductor integrated circuit
US16/265,251 US10901453B2 (en) 2016-03-16 2019-02-01 Semiconductor integrated circuit, and method for supplying clock signals in semiconductor integrated circuit

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JP2016052602 2016-03-16
JP2016052602 2016-03-16

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JP2017174394A JP2017174394A (ja) 2017-09-28
JP2017174394A5 JP2017174394A5 (cg-RX-API-DMAC7.html) 2018-09-27
JP6555239B2 true JP6555239B2 (ja) 2019-08-07

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JP2019128917A Active JP6881514B2 (ja) 2016-03-16 2019-07-11 半導体集積回路及び半導体集積回路のクロック供給方法

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10437545B2 (en) 2016-12-28 2019-10-08 Ricoh Company, Ltd. Apparatus, system, and method for controlling display, and recording medium
JP6988221B2 (ja) 2017-07-18 2022-01-05 株式会社リコー 半導体集積回路
BR112020003397A2 (pt) 2018-12-29 2021-06-22 Huawei Technologies Co., Ltd. aparelho de divisão ótica

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05159080A (ja) * 1991-12-05 1993-06-25 Hitachi Ltd 論理集積回路
JP2000148282A (ja) * 1998-11-10 2000-05-26 Hitachi Ltd 半導体装置及び当該装置を搭載したモジュール
JP2004159239A (ja) * 2002-11-08 2004-06-03 Renesas Technology Corp 半導体集積回路
WO2011155333A1 (ja) * 2010-06-11 2011-12-15 株式会社日立製作所 半導体集積回路装置
JP2013219442A (ja) * 2012-04-05 2013-10-24 Nikon Corp 電子装置、イメージセンサおよび電子カメラ

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JP2019215881A (ja) 2019-12-19
JP2017174394A (ja) 2017-09-28
JP6881514B2 (ja) 2021-06-02

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