JP6529257B2 - 真空蒸着装置 - Google Patents

真空蒸着装置 Download PDF

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Publication number
JP6529257B2
JP6529257B2 JP2014265981A JP2014265981A JP6529257B2 JP 6529257 B2 JP6529257 B2 JP 6529257B2 JP 2014265981 A JP2014265981 A JP 2014265981A JP 2014265981 A JP2014265981 A JP 2014265981A JP 6529257 B2 JP6529257 B2 JP 6529257B2
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Prior art keywords
evaporation
evaporation source
source
outside
face
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JP2014265981A
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Japanese (ja)
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JP2016125091A (ja
JP2016125091A5 (nl
Inventor
喜成 近藤
喜成 近藤
博之 田村
博之 田村
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Canon Tokki Corp
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Canon Tokki Corp
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Priority to JP2014265981A priority Critical patent/JP6529257B2/ja
Priority to TW104131265A priority patent/TWI673379B/zh
Priority to CN201510857298.2A priority patent/CN105734495B/zh
Priority to KR1020150174861A priority patent/KR101989653B1/ko
Publication of JP2016125091A publication Critical patent/JP2016125091A/ja
Publication of JP2016125091A5 publication Critical patent/JP2016125091A5/ja
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/225Oblique incidence of vaporised material on substrate

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP2014265981A 2014-12-26 2014-12-26 真空蒸着装置 Active JP6529257B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014265981A JP6529257B2 (ja) 2014-12-26 2014-12-26 真空蒸着装置
TW104131265A TWI673379B (zh) 2014-12-26 2015-09-22 真空蒸鍍裝置
CN201510857298.2A CN105734495B (zh) 2014-12-26 2015-11-30 真空蒸镀装置
KR1020150174861A KR101989653B1 (ko) 2014-12-26 2015-12-09 진공 증착 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014265981A JP6529257B2 (ja) 2014-12-26 2014-12-26 真空蒸着装置

Publications (3)

Publication Number Publication Date
JP2016125091A JP2016125091A (ja) 2016-07-11
JP2016125091A5 JP2016125091A5 (nl) 2017-12-21
JP6529257B2 true JP6529257B2 (ja) 2019-06-12

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ID=56295966

Family Applications (1)

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JP2014265981A Active JP6529257B2 (ja) 2014-12-26 2014-12-26 真空蒸着装置

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JP (1) JP6529257B2 (nl)
KR (1) KR101989653B1 (nl)
CN (1) CN105734495B (nl)
TW (1) TWI673379B (nl)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109328244B (zh) * 2016-08-02 2021-06-22 株式会社爱发科 真空蒸镀装置
TWI580807B (zh) * 2016-10-28 2017-05-01 財團法人工業技術研究院 蒸鍍設備與利用此設備之蒸鍍方法
CN111148860B (zh) * 2017-09-28 2022-02-11 夏普株式会社 蒸镀粒子射出装置及蒸镀装置、以及蒸镀膜制造方法
JPWO2019064426A1 (ja) * 2017-09-28 2020-07-27 シャープ株式会社 蒸着源および蒸着装置並びに蒸着膜製造方法
CN108570645B (zh) * 2017-11-30 2023-09-29 上海微电子装备(集团)股份有限公司 真空蒸镀装置及其蒸发头、真空蒸镀方法
JP6931599B2 (ja) * 2017-12-06 2021-09-08 長州産業株式会社 蒸着装置及び蒸着方法
JP6941547B2 (ja) 2017-12-06 2021-09-29 長州産業株式会社 蒸着装置、蒸着方法及び制御板
JP6983096B2 (ja) * 2018-03-30 2021-12-17 株式会社アルバック 真空蒸着装置用の蒸着源
CN111206220A (zh) * 2018-11-02 2020-05-29 北京铂阳顶荣光伏科技有限公司 一种镀膜设备及镀膜方法
CN111206224A (zh) * 2018-11-02 2020-05-29 北京铂阳顶荣光伏科技有限公司 沉积腔室、镀膜设备及镀膜方法
CN111206221A (zh) * 2018-11-02 2020-05-29 北京铂阳顶荣光伏科技有限公司 一种镀膜设备及镀膜方法
CN111206203A (zh) * 2018-11-02 2020-05-29 北京铂阳顶荣光伏科技有限公司 沉积腔室、镀膜设备及镀膜方法
CN111206207A (zh) * 2018-11-02 2020-05-29 北京铂阳顶荣光伏科技有限公司 沉积腔室、镀膜设备及镀膜方法
CN111206205A (zh) * 2018-11-02 2020-05-29 北京铂阳顶荣光伏科技有限公司 沉积腔室、镀膜设备及镀膜方法
CN111206219A (zh) * 2018-11-02 2020-05-29 北京铂阳顶荣光伏科技有限公司 沉积腔室、镀膜设备及镀膜方法
CN109666898A (zh) * 2019-01-03 2019-04-23 福建华佳彩有限公司 一种用于点蒸发源的坩埚
JP7217635B2 (ja) * 2019-01-11 2023-02-03 株式会社アルバック 蒸着源、成膜装置、及び蒸着方法
WO2020213228A1 (ja) * 2019-04-19 2020-10-22 株式会社アルバック 蒸着源及び蒸着装置
CN110791731B (zh) * 2019-11-20 2022-05-06 信利(仁寿)高端显示科技有限公司 一种蒸发源组件
CN114657505A (zh) * 2020-12-24 2022-06-24 上海升翕光电科技有限公司 蒸发源
CN114657504A (zh) * 2020-12-24 2022-06-24 上海升翕光电科技有限公司 蒸发源
CN114318237A (zh) * 2021-12-29 2022-04-12 武汉华星光电半导体显示技术有限公司 一种蒸镀装置
WO2024153969A1 (en) * 2023-01-17 2024-07-25 Applied Materials, Inc. Material deposition assembly, vacuum deposition system and method of manufacturing a device
CN116180018A (zh) * 2023-02-14 2023-05-30 上海升翕光电科技有限公司 一种共蒸方法及共蒸设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100623730B1 (ko) * 2005-03-07 2006-09-14 삼성에스디아이 주식회사 증발원 어셈블리 및 이를 구비한 증착 장치
JP4831841B2 (ja) * 2009-07-10 2011-12-07 三菱重工業株式会社 真空蒸着装置及び方法
KR20120061394A (ko) * 2010-12-03 2012-06-13 삼성모바일디스플레이주식회사 증발원 및 유기물 증착 방법
KR102046440B1 (ko) * 2012-10-09 2019-11-20 삼성디스플레이 주식회사 증착 장치 및 이를 이용한 유기 발광 표시장치의 제조방법
CN104099571A (zh) * 2013-04-01 2014-10-15 上海和辉光电有限公司 蒸发源组件和薄膜沉积装置和薄膜沉积方法
CN104099570B (zh) * 2013-04-01 2016-10-05 上海和辉光电有限公司 单点线性蒸发源系统

Also Published As

Publication number Publication date
CN105734495B (zh) 2019-12-06
KR20160079653A (ko) 2016-07-06
JP2016125091A (ja) 2016-07-11
TW201627515A (zh) 2016-08-01
KR101989653B1 (ko) 2019-06-14
CN105734495A (zh) 2016-07-06
TWI673379B (zh) 2019-10-01

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