CN111206205A - 沉积腔室、镀膜设备及镀膜方法 - Google Patents
沉积腔室、镀膜设备及镀膜方法 Download PDFInfo
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- CN111206205A CN111206205A CN201811303297.3A CN201811303297A CN111206205A CN 111206205 A CN111206205 A CN 111206205A CN 201811303297 A CN201811303297 A CN 201811303297A CN 111206205 A CN111206205 A CN 111206205A
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- 230000008021 deposition Effects 0.000 title claims abstract description 99
- 238000000576 coating method Methods 0.000 title claims abstract description 65
- 239000011248 coating agent Substances 0.000 title claims abstract description 50
- 238000001883 metal evaporation Methods 0.000 claims abstract description 114
- 238000000151 deposition Methods 0.000 claims abstract description 109
- 229910052755 nonmetal Inorganic materials 0.000 claims abstract description 37
- 238000001704 evaporation Methods 0.000 claims description 653
- 230000008020 evaporation Effects 0.000 claims description 652
- 239000010949 copper Substances 0.000 claims description 207
- 239000010409 thin film Substances 0.000 claims description 43
- 239000000758 substrate Substances 0.000 claims description 42
- 239000011521 glass Substances 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 29
- 238000010438 heat treatment Methods 0.000 claims description 21
- 229910052783 alkali metal Inorganic materials 0.000 claims description 11
- 150000001340 alkali metals Chemical class 0.000 claims description 11
- 238000005137 deposition process Methods 0.000 claims description 9
- 238000002203 pretreatment Methods 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 229910052733 gallium Inorganic materials 0.000 claims description 8
- 229910052738 indium Inorganic materials 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 7
- 150000001339 alkali metal compounds Chemical class 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 2
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 description 44
- 239000010408 film Substances 0.000 description 38
- 238000004544 sputter deposition Methods 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 11
- 239000000463 material Substances 0.000 description 8
- 238000012805 post-processing Methods 0.000 description 8
- 238000010248 power generation Methods 0.000 description 8
- 238000010549 co-Evaporation Methods 0.000 description 7
- 238000002425 crystallisation Methods 0.000 description 7
- 230000008025 crystallization Effects 0.000 description 7
- 239000013078 crystal Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 5
- 229910052731 fluorine Inorganic materials 0.000 description 5
- 239000011737 fluorine Substances 0.000 description 5
- -1 fluorine ions Chemical class 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 238000009834 vaporization Methods 0.000 description 4
- 230000008016 vaporization Effects 0.000 description 4
- 238000007599 discharging Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000009501 film coating Methods 0.000 description 3
- 238000001755 magnetron sputter deposition Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 229910052711 selenium Inorganic materials 0.000 description 3
- 229910001415 sodium ion Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000007888 film coating Substances 0.000 description 2
- 238000011031 large-scale manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000012163 sequencing technique Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910001414 potassium ion Inorganic materials 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0623—Sulfides, selenides or tellurides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0694—Halides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201811303297.3A CN111206205A (zh) | 2018-11-02 | 2018-11-02 | 沉积腔室、镀膜设备及镀膜方法 |
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CN201811303297.3A CN111206205A (zh) | 2018-11-02 | 2018-11-02 | 沉积腔室、镀膜设备及镀膜方法 |
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CN111206205A true CN111206205A (zh) | 2020-05-29 |
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CN201811303297.3A Pending CN111206205A (zh) | 2018-11-02 | 2018-11-02 | 沉积腔室、镀膜设备及镀膜方法 |
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Citations (24)
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---|---|---|---|---|
JPH05234890A (ja) * | 1992-02-25 | 1993-09-10 | Fuji Electric Corp Res & Dev Ltd | 化合物半導体薄膜層の成膜方法 |
CN1950952A (zh) * | 2004-03-05 | 2007-04-18 | 索里布罗股份公司 | 对cigs工艺进行直列式过程控制的方法和装置 |
JP2007146219A (ja) * | 2005-11-28 | 2007-06-14 | Hitachi Zosen Corp | 真空蒸着装置 |
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US20110030794A1 (en) * | 2009-08-10 | 2011-02-10 | Edward Teng | Apparatus And Method For Depositing A CIGS Layer |
JP2012007194A (ja) * | 2010-06-22 | 2012-01-12 | Fujifilm Corp | 成膜装置および光電変換素子の製造方法 |
JP2012012662A (ja) * | 2010-06-30 | 2012-01-19 | Fujifilm Corp | 成膜装置および太陽電池 |
CN102496565A (zh) * | 2011-12-23 | 2012-06-13 | 中国电子科技集团公司第十八研究所 | 柔性衬底上卷对卷沉积吸收层用装置 |
CN102492923A (zh) * | 2011-12-23 | 2012-06-13 | 中国电子科技集团公司第十八研究所 | 柔性衬底上卷对卷在线控制沉积吸收层的方法 |
JP2012184457A (ja) * | 2011-03-03 | 2012-09-27 | Sumitomo Heavy Ind Ltd | 成膜装置 |
CN102763230A (zh) * | 2010-02-22 | 2012-10-31 | 太阳能光电股份公司 | 制造半导体层的方法和装置 |
US20130224901A1 (en) * | 2012-02-26 | 2013-08-29 | Jiaxiong Wang | Production Line to Fabricate CIGS Thin Film Solar Cells via Roll-to-Roll Processes |
CN103866236A (zh) * | 2012-12-18 | 2014-06-18 | 北京汉能创昱科技有限公司 | 一种铜铟镓硒薄膜电池共蒸发线性源的布置方法 |
CN103871851A (zh) * | 2012-12-18 | 2014-06-18 | 北京汉能创昱科技有限公司 | 一种铜铟镓硒薄膜电池共蒸发线性源阵列的排布 |
CN103898450A (zh) * | 2012-12-25 | 2014-07-02 | 北京汉能创昱科技有限公司 | 一种铜铟镓硒共蒸发线性源装置及其使用方法 |
CN104716217A (zh) * | 2014-09-30 | 2015-06-17 | 天津理工大学 | 一种掺钠铜铟镓硒太阳电池器件及其制备方法 |
CN105428457A (zh) * | 2015-12-08 | 2016-03-23 | 中国电子科技集团公司第十八研究所 | 一种工业化沉积cigs太阳电池吸收层的方法及设备 |
CN105720132A (zh) * | 2014-12-03 | 2016-06-29 | 中国电子科技集团公司第十八研究所 | 一种柔性衬底上制备cigs吸收层碱金属掺杂方法 |
CN105734495A (zh) * | 2014-12-26 | 2016-07-06 | 佳能特机株式会社 | 真空蒸镀装置 |
WO2016199728A1 (ja) * | 2015-06-09 | 2016-12-15 | 株式会社アルバック | 巻取式成膜装置、蒸発源ユニット、及び巻取式成膜方法 |
CN207418851U (zh) * | 2017-09-22 | 2018-05-29 | 云谷(固安)科技有限公司 | 蒸发源装置 |
WO2018114376A1 (en) * | 2016-12-22 | 2018-06-28 | Flisom Ag | Linear evaporation source |
CN108269868A (zh) * | 2018-01-29 | 2018-07-10 | 北京铂阳顶荣光伏科技有限公司 | 薄膜太阳能电池 |
CN207596942U (zh) * | 2017-11-08 | 2018-07-10 | 深圳市柔宇科技有限公司 | 蒸镀装置 |
-
2018
- 2018-11-02 CN CN201811303297.3A patent/CN111206205A/zh active Pending
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JPH05234890A (ja) * | 1992-02-25 | 1993-09-10 | Fuji Electric Corp Res & Dev Ltd | 化合物半導体薄膜層の成膜方法 |
CN1950952A (zh) * | 2004-03-05 | 2007-04-18 | 索里布罗股份公司 | 对cigs工艺进行直列式过程控制的方法和装置 |
US20080254202A1 (en) * | 2004-03-05 | 2008-10-16 | Solibro Ab | Method and Apparatus for In-Line Process Control of the Cigs Process |
CN101599515A (zh) * | 2004-03-05 | 2009-12-09 | 索里布罗研究公司 | 对cigs工艺进行直列式过程控制的方法和装置 |
JP2007146219A (ja) * | 2005-11-28 | 2007-06-14 | Hitachi Zosen Corp | 真空蒸着装置 |
US20090215224A1 (en) * | 2008-02-21 | 2009-08-27 | Film Solar Tech Inc. | Coating methods and apparatus for making a cigs solar cell |
US20110030794A1 (en) * | 2009-08-10 | 2011-02-10 | Edward Teng | Apparatus And Method For Depositing A CIGS Layer |
CN102763230A (zh) * | 2010-02-22 | 2012-10-31 | 太阳能光电股份公司 | 制造半导体层的方法和装置 |
US20130045563A1 (en) * | 2010-02-22 | 2013-02-21 | Solarion AG Photovotaik | Method and device for producing a semiconductor layer |
JP2012007194A (ja) * | 2010-06-22 | 2012-01-12 | Fujifilm Corp | 成膜装置および光電変換素子の製造方法 |
JP2012012662A (ja) * | 2010-06-30 | 2012-01-19 | Fujifilm Corp | 成膜装置および太陽電池 |
JP2012184457A (ja) * | 2011-03-03 | 2012-09-27 | Sumitomo Heavy Ind Ltd | 成膜装置 |
CN102496565A (zh) * | 2011-12-23 | 2012-06-13 | 中国电子科技集团公司第十八研究所 | 柔性衬底上卷对卷沉积吸收层用装置 |
CN102492923A (zh) * | 2011-12-23 | 2012-06-13 | 中国电子科技集团公司第十八研究所 | 柔性衬底上卷对卷在线控制沉积吸收层的方法 |
US20130224901A1 (en) * | 2012-02-26 | 2013-08-29 | Jiaxiong Wang | Production Line to Fabricate CIGS Thin Film Solar Cells via Roll-to-Roll Processes |
CN103871851A (zh) * | 2012-12-18 | 2014-06-18 | 北京汉能创昱科技有限公司 | 一种铜铟镓硒薄膜电池共蒸发线性源阵列的排布 |
CN103866236A (zh) * | 2012-12-18 | 2014-06-18 | 北京汉能创昱科技有限公司 | 一种铜铟镓硒薄膜电池共蒸发线性源的布置方法 |
CN103898450A (zh) * | 2012-12-25 | 2014-07-02 | 北京汉能创昱科技有限公司 | 一种铜铟镓硒共蒸发线性源装置及其使用方法 |
CN104716217A (zh) * | 2014-09-30 | 2015-06-17 | 天津理工大学 | 一种掺钠铜铟镓硒太阳电池器件及其制备方法 |
CN105720132A (zh) * | 2014-12-03 | 2016-06-29 | 中国电子科技集团公司第十八研究所 | 一种柔性衬底上制备cigs吸收层碱金属掺杂方法 |
CN105734495A (zh) * | 2014-12-26 | 2016-07-06 | 佳能特机株式会社 | 真空蒸镀装置 |
WO2016199728A1 (ja) * | 2015-06-09 | 2016-12-15 | 株式会社アルバック | 巻取式成膜装置、蒸発源ユニット、及び巻取式成膜方法 |
CN105428457A (zh) * | 2015-12-08 | 2016-03-23 | 中国电子科技集团公司第十八研究所 | 一种工业化沉积cigs太阳电池吸收层的方法及设备 |
WO2018114376A1 (en) * | 2016-12-22 | 2018-06-28 | Flisom Ag | Linear evaporation source |
CN207418851U (zh) * | 2017-09-22 | 2018-05-29 | 云谷(固安)科技有限公司 | 蒸发源装置 |
CN207596942U (zh) * | 2017-11-08 | 2018-07-10 | 深圳市柔宇科技有限公司 | 蒸镀装置 |
CN108269868A (zh) * | 2018-01-29 | 2018-07-10 | 北京铂阳顶荣光伏科技有限公司 | 薄膜太阳能电池 |
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Application publication date: 20200529 |