JP6527042B2 - ワイヤープローブの保持構造 - Google Patents

ワイヤープローブの保持構造 Download PDF

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Publication number
JP6527042B2
JP6527042B2 JP2015139832A JP2015139832A JP6527042B2 JP 6527042 B2 JP6527042 B2 JP 6527042B2 JP 2015139832 A JP2015139832 A JP 2015139832A JP 2015139832 A JP2015139832 A JP 2015139832A JP 6527042 B2 JP6527042 B2 JP 6527042B2
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JP
Japan
Prior art keywords
wire probe
hole
large diameter
diameter portion
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015139832A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017020943A (ja
Inventor
靖典 加藤
靖典 加藤
大西　正樹
正樹 大西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Organ Needle Co Ltd
Original Assignee
Organ Needle Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Organ Needle Co Ltd filed Critical Organ Needle Co Ltd
Priority to JP2015139832A priority Critical patent/JP6527042B2/ja
Priority to TW105119629A priority patent/TWI687690B/zh
Priority to KR1020160085891A priority patent/KR102557737B1/ko
Priority to CN201610547650.7A priority patent/CN106353541B/zh
Publication of JP2017020943A publication Critical patent/JP2017020943A/ja
Application granted granted Critical
Publication of JP6527042B2 publication Critical patent/JP6527042B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0425—Test clips, e.g. for IC's
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06744—Microprobes, i.e. having dimensions as IC details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2015139832A 2015-07-13 2015-07-13 ワイヤープローブの保持構造 Active JP6527042B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2015139832A JP6527042B2 (ja) 2015-07-13 2015-07-13 ワイヤープローブの保持構造
TW105119629A TWI687690B (zh) 2015-07-13 2016-06-22 探針的保持結構
KR1020160085891A KR102557737B1 (ko) 2015-07-13 2016-07-07 와이어 프로브의 유지 구조
CN201610547650.7A CN106353541B (zh) 2015-07-13 2016-07-12 探针的保持结构

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015139832A JP6527042B2 (ja) 2015-07-13 2015-07-13 ワイヤープローブの保持構造

Publications (2)

Publication Number Publication Date
JP2017020943A JP2017020943A (ja) 2017-01-26
JP6527042B2 true JP6527042B2 (ja) 2019-06-05

Family

ID=57843162

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015139832A Active JP6527042B2 (ja) 2015-07-13 2015-07-13 ワイヤープローブの保持構造

Country Status (4)

Country Link
JP (1) JP6527042B2 (zh)
KR (1) KR102557737B1 (zh)
CN (1) CN106353541B (zh)
TW (1) TWI687690B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109613307B (zh) * 2018-08-01 2019-10-11 日本电产理德机器装置(浙江)有限公司 检查夹具
KR102597311B1 (ko) * 2021-08-24 2023-11-02 윌테크놀러지(주) 미세피치 대응이 가능한 프로브 카드

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4686467A (en) * 1984-03-21 1987-08-11 Dit-Mco International Corp. Circuit board testing system
US4901013A (en) * 1988-08-19 1990-02-13 American Telephone And Telegraph Company, At&T Bell Laboratories Apparatus having a buckling beam probe assembly
JP4251855B2 (ja) * 2002-11-19 2009-04-08 株式会社ヨコオ 高周波・高速用デバイスの検査治具の製法
JP2006023243A (ja) * 2004-07-09 2006-01-26 Tokyo Eletec Kk Ｉｃソケット及びそれに使用可能なプローブピン
JP2006098066A (ja) * 2004-09-28 2006-04-13 Totoku Electric Co Ltd プローブ針及びその使用方法並びにプローブ針の製造方法
JP4465250B2 (ja) * 2004-10-05 2010-05-19 株式会社精研 検査ユニット及びそれを用いた検査装置
JP2007057447A (ja) * 2005-08-26 2007-03-08 Japan Electronic Materials Corp プローブカード用ガイド板およびその加工方法
JP4905876B2 (ja) * 2005-10-31 2012-03-28 日本発條株式会社 導電性接触子ホルダの製造方法および導電性接触子ホルダ
JP3849948B1 (ja) * 2005-11-16 2006-11-22 日本電産リード株式会社 基板検査用治具及び検査用プローブ
JP2007322179A (ja) * 2006-05-30 2007-12-13 Nidec-Read Corp 基板検査用治具及びこの治具を備える基板検査装置
US20080048685A1 (en) * 2006-08-28 2008-02-28 Corad Technology Inc. Probe card having vertical probes
JP4965341B2 (ja) * 2007-05-31 2012-07-04 日置電機株式会社 プローブユニットおよび回路基板検査装置
KR101192209B1 (ko) * 2008-09-05 2012-10-17 니혼덴산리드가부시키가이샤 기판검사용 검사치구
JP2012042252A (ja) 2010-08-16 2012-03-01 Molex Inc 同軸プローブ
JP2012098219A (ja) 2010-11-04 2012-05-24 Yamaichi Electronics Co Ltd 半導体装置用ソケット
TWI542889B (zh) * 2011-06-03 2016-07-21 Hioki Electric Works A detection unit, a circuit board detection device, and a detection unit manufacturing method
JP6109072B2 (ja) * 2011-10-07 2017-04-05 日本発條株式会社 プローブユニット
JP5858781B2 (ja) 2011-12-29 2016-02-10 株式会社エンプラス プローブピン及び電気部品用ソケット
JP2015125971A (ja) 2013-12-27 2015-07-06 株式会社エンプラス 電気部品用ソケット

Also Published As

Publication number Publication date
TW201702603A (zh) 2017-01-16
KR102557737B1 (ko) 2023-07-20
CN106353541A (zh) 2017-01-25
CN106353541B (zh) 2020-09-08
JP2017020943A (ja) 2017-01-26
KR20170008162A (ko) 2017-01-23
TWI687690B (zh) 2020-03-11

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