JP6527042B2 - Wire probe holding structure - Google Patents

Description

  The present invention relates to a holding structure of a wire probe used for substrate inspection.

  2. Description of the Related Art Heretofore, inspection using a very thin wire probe has been carried out in a continuity inspection and an electrical characteristic inspection of a semiconductor integrated circuit or the like (inspection substrate). For example, both ends of a plurality of wire probes are held by a wire probe jig, and the wire probe jig is sandwiched between the electrode substrate and the inspection substrate, and both ends of the wire probe are respectively the terminals of the electrode substrate and the inspection There is known a method in which the inspection is performed in contact with the terminal of the substrate. In such an inspection, when the electrode to be inspected is small, it is necessary to reduce the minimum pitch (arrangement interval) of the wire probe.

  However, in the conventional wire probe, the minimum pitch of the wire probe is necessarily determined by the diameter of the metal pin of the wire probe.

  That is, when the wire probe is inserted into the wire probe jig, the wire probe is inserted from the hole facing the electrode substrate (the hole at the rear end), and the hole facing the inspection substrate with this wire probe (tip Make it project from the side hole). In the conventional wire probe, when the tip end portion is inserted into the hole on the tip end side, the insulating coating is locked in the hole on the tip end side and functions as a stopper so that the wire probe drops out of the jig for wire probe (See Patent Document 1 to be described later). At this time, it is necessary to form the hole on the tip side to have a large diameter to the extent that the tip portion (metal pin) of the wire probe can slide smoothly. And, it is necessary to form the insulating coating of the wire probe larger in diameter than the hole on the tip side to such an extent that it can not pass through the hole on the tip side. Furthermore, the hole on the rear end side needs to be formed larger in diameter than the insulating coating to such an extent that the insulating coating of the wire probe can pass through. And since the wall thickness between the holes on the rear end side is determined by processing technology limitations, the minimum pitch of the wire probe determined by the hole diameter on the rear end side and the wall thickness between the holes is also determined. .

  Thus, the diameter of the metal pin of the wire probe necessarily determines the minimum value of the hole diameter on the tip side, and the hole diameter on the tip side necessarily determines the minimum value of the outer diameter of the insulating coating. The diameter necessarily determines the minimum value of the hole diameter on the rear end side, and the hole diameter on the rear end side necessarily determines the minimum pitch of the wire probe. In other words, the minimum pitch of the wire probe was necessarily determined by the diameter of the metal pin of the wire probe. Therefore, in order to reduce the minimum pitch of the wire probe, the diameter of the metal pin of the wire probe has to be reduced.

  However, the use of a linear thin wire probe increases the cost of maintenance and makes the replacement operation complicated. Conversely, if narrow pitch can be realized without reducing the diameter of the metal pin, cost reduction and workability improvement of the user can be realized. Therefore, a technique for realizing a narrow pitch without reducing the diameter of the metal pin has been required.

  In Patent Document 1, two pairs of probe needles are inserted into one hole of a jig for an inspection apparatus, and the four terminals of the tips of the pair of probe needles are simultaneously brought into contact with one electrode of an object to be measured. A technique is disclosed for measuring the electrical characteristics of the object by means of resistance measurement. According to such a method, the minimum pitch of the two probe needles can be reduced without reducing the diameter of the metal pin.

  In the technique described in Patent Document 1, the tip of the probe needle inserted into the hole is formed of a metal conductor exposed from the insulating film, and a part or all of the insulating film on the tip is removed. An insulating film removing portion is formed, and a stepped portion is provided between the insulating film removing portion and the insulating film. The stepped portion is engaged with the periphery of the hole to function as a stopper, thereby preventing the probe needle from falling off the inspection device jig.

Unexamined-Japanese-Patent No. 2006-98066

  However, in the structure described in Patent Document 1 described above, the probe needle can not slide smoothly in the hole because the shape of the tip of the probe needle inserted in the hole is not a circular cross section as in a normal wire probe. There was a fear. In addition, in the case of two probe needles, the minimum pitch can be narrowed, but the minimum pitch can not be reduced for three or more probe needles.

  Therefore, according to the present invention, the minimum pitch of the wire probe can be made smaller than the conventional one without making the tip of the wire probe a special shape, and the minimum number of wire probes is not limited. It is an object of the present invention to provide a wire probe holding structure capable of reducing the pitch.

  The present invention has been made to solve the above-mentioned problems, and is characterized by the following.

  The invention according to claim 1 comprises a wire probe, and a jig for a wire probe which is held between the electrode substrate and the inspection substrate while holding both end portions of the wire probe, and the wire probe is maintained. The tool includes a base portion which holds the rear end portion of the wire probe and is disposed so as to be in contact with the electrode substrate, and the base portion is provided with a plurality of insertion holes through which the wire probe is inserted. The hole includes a large diameter portion facing the electrode substrate, and a small diameter portion continuing to the large diameter portion, and a stepped portion is formed between the large diameter portion and the small diameter portion, and the wire probe A ring-shaped engaging portion is provided, which is internally provided in the large diameter portion and formed to have a diameter larger than that of the small diameter portion.

Further , in addition to the feature of the invention described in the first aspect, the large diameter portion of the insertion hole is formed to be connected to another large diameter portion.

The invention according to claim 2, in addition to feature points of the invention described in claim 1 or 2 above, wherein the step portion is characterized by being formed by the through hole and Dan'ana .

  The invention according to claim 1 is as described above, and the insertion hole through which the wire probe is inserted includes a large diameter portion facing the electrode substrate and a small diameter portion continuing to the large diameter portion, and the large diameter portion A stepped portion is formed between the small diameter portion and the small diameter portion, and the wire probe includes a ring-shaped locking portion which is internally provided in the large diameter portion and formed larger in diameter than the small diameter portion. Therefore, the ring-shaped locking portion serves as a stopper, and the wire probe can be prevented from dropping off from the wire probe jig. Since the locking portion serves as a stopper, it is not necessary to lock the insulating film of the wire probe in the hole on the tip side. In other words, the insulation film of the wire probe can be thinned. By thinning the insulation film of the wire probe, the hole diameter on the rear end side can be reduced, so the minimum pitch of the wire probe can be reduced. Moreover, since such an effect can be realized without making the tip of the wire probe into a special shape, the problem that the tip of the wire probe can not slide smoothly does not occur. Moreover, the minimum pitch of a wire probe can be made small, without limiting the number of wire probes.

  In addition, since the locking portion is held by the large diameter portion, the rear end portion of the wire probe facing the substrate does not move, and the positional accuracy of the wire probe can be improved.

Further, the large diameter portion of the previous SL insertion hole is formed to connect with other large-diameter portion. According to such a configuration, the minimum pitch of the wire probe can be further reduced by making the insertion holes approach each other. In addition, since the wire probe penetrated by the large diameter part is insulated by the ring-shaped latching | locking part, even if the adjacent wire probe contacts temporarily, the mutually insulated state can be maintained.

The invention according to claim 2 is as described above, and the stepped portion is formed by using the insertion hole as a stepped hole. According to such a configuration, the stepped portion can be formed regardless of the shape of the insertion hole. For example, when the plate thickness of the plate through which the insertion hole is formed is thick, even if it is necessary to spot the back side of the insertion hole due to restrictions in processing technology, the step portion is formed using the front side straight hole can do.

It is a sectional side view of the holding structure of a wire probe. It is a side view of a wire probe. It is a sectional side view of the holding structure of a wire probe, Comprising: (a) Partially enlarged view of the rear end part vicinity of a wire probe, (b) It is the figure which further expanded near the rear end part of a wire probe. (A) Partially enlarged view which looked at an insertion hole from opening side, (b) It is the partially expanded view which looked at the insertion hole which concerns on modification 1 from an opening side. (A) A partially enlarged view of the insertion hole according to modification 2 as viewed from the opening side, (b) a partially enlarged view of the insertion hole according to modification 3 as viewed from the opening side, (c) according to modification 4 It is the partially expanded view which looked the insertion hole from the opening side, (d) It is a partial enlarged view which looked at the insertion hole concerning modification 5 from the opening side. It is a sectional side view of the holding | maintenance structure of the wire probe which concerns on the modification 6, Comprising: It is a partially expanded view of rear end part vicinity of a wire probe.

  Embodiments of the present invention will be described with reference to the drawings.

  The holding structure of the wire probe 30 according to the present embodiment is for the wire probe 30 and the wire probe which holds both ends of the wire probe 30 and is disposed between the electrode substrate 40 and the inspection substrate (not shown). And a jig 10.

  As shown in FIG. 2 etc., the wire probe 30 is provided with the insulating film 32 and the latching | locking part 33 in the outer peripheral part of the electroconductive metal pin 31. As shown in FIG. The insulating film 32 is an insulating coating that covers the outer periphery of the metal pin 31 in the middle portion of the wire probe 30. By providing the insulating film 32, even when the wire probe 30 is bent, the insulation with the other wire probe 30 is secured. The locking portion 33 is a ring-shaped insulator attached to the outer periphery of the metal pin 31 in the vicinity of the rear end portion 30 b of the wire probe 30. The locking portion 33 secures the insulation of the wire probe 30 and prevents the wire probe 30 from falling off the wire probe jig 10.

  The wire probe 30 is held by the wire probe jig 10 so that the front end 30a and the rear end 30b are exposed. At the time of inspection, the exposed front end 30a contacts the terminal of the inspection substrate, and the exposed rear end 30b contacts the terminal of the electrode substrate 40.

  The end portion of the wiring 41 is provided on the electrode substrate 40 at a position in contact with the rear end portion 30 b of the wire probe 30. The wiring 41 is electrically connected to a scanner for inspection (not shown), whereby the wire probe 30 can be used to inspect a predetermined portion of the substrate to be inspected. There is.

  As shown in FIG. 1, the wire probe jig 10 holds a plurality of wire probes 30 so as not to be in contact with each other. With the wire probe jig 10 fixed to one surface of the electrode substrate 40, the other surface is pressed against the inspection substrate such as a semiconductor integrated circuit, and both ends of the held wire probe 30 are respectively electrode substrates It is used to contact the 40 terminals and the terminals of the test substrate.

  As shown in FIG. 1, the wire probe jig 10 according to the present embodiment includes a base portion 11 disposed on the electrode substrate 40 side, a head portion 17 disposed on the inspection substrate side, and the base portion 11. And a spacer 22 provided between it and the head portion 17.

  The base portion 11 is a plate-like portion which is disposed so as to be able to contact the electrode substrate 40 while holding the rear end portion 30b of the wire probe 30, and in the present embodiment, two sheets of the first base plate 13 and the second base plate 15 It is constructed by overlapping the plates of. The two plates are connected by a base fixing screw 23. The base fixing screw 23 for connecting the two plates is screwed to the spacer 22, whereby the base portion 11 and the spacer 22 are integrally fixed.

  The base portion 11 is provided with a plurality of insertion holes 12 through which the wire probe 30 is inserted. The insertion hole 12 is formed by communication between a first rear end hole 14 of the first base plate 13 described later and a second rear end hole 16 of the second base plate 15. As shown in FIG. 3, the insertion hole 12 includes a large diameter portion 12 a facing the electrode substrate 40 and a small diameter portion 12 b continuous to the large diameter portion 12 a. The small diameter portion 12b is smaller in diameter than the large diameter portion 12a, so the stepped portion 12c is formed between the large diameter portion 12a and the small diameter portion 12b. The large diameter portion 12a is for mounting the locking portion 33 of the wire probe 30, but since the small diameter portion 12b is smaller in diameter than the locking portion 33, the edge portion of the locking portion 33 is a step 12c. It is supposed to be locked.

  The first base plate 13 is a plate disposed to face the electrode substrate 40. At the time of inspection, the surface of the first base plate 13 is fixed in contact with the electrode substrate 40. The first base plate 13 is provided with a first rear end hole 14 through which the wire probe 30 is inserted. The first rear end holes 14 are provided by the number of the wire probes 30 to be held.

  As shown in FIG. 3, the first rear end hole 14 includes a step hole portion 14 b on the electrode substrate 40 side and a counterbore portion 14 a on the inspection substrate side. The stepped hole portion 14b is a stepped hole in which the large diameter portion 12a, the small diameter portion 12b, and the stepped portion 12c described above are formed. On the other hand, the counterbore portion 14a is a tapered hole formed by counterbore processing. In the present embodiment, since the plate thickness of the first base plate 13 is thick, in order to facilitate processing, the hole is made by counterbore processing from the back side of the straight hole. In the present embodiment, one counterbore portion 14a is in communication with the plurality of step holes 14b.

  In addition, the large diameter part 12a which concerns on this embodiment is connected with the other large diameter part 12a, as shown in FIG. 4, and is formed. On the other hand, the small diameter portion 12b is not connected to the other small diameter portion 12b. For this reason, as shown in FIG. 3, when viewed in a cross section passing through the center line of the two large diameter portions 12a connected, there is no wall between the large diameter portions 12a, and between the small diameter portions 12b. There is a partition 14c.

  The second base plate 15 is a plate disposed on the inner side of the first base plate 13, that is, closer to the substrate to be inspected than the first base plate 13. The second base plate 15 is provided with a second rear end hole 16 through which the wire probe 30 is inserted. The second rear end holes 16 are provided as many as the number of the wire probes 30 to be held, and are in communication with the first rear end holes 14.

  As shown in FIG. 3, the second rear end hole 16 includes a counterbore portion 16 a on the electrode substrate 40 side and a straight portion 16 b on the inspection substrate side. The counterbore portion 16a is a tapered hole formed by counterbore processing. In the present embodiment, since the plate thickness of the second base plate 15 is thick, in order to facilitate processing, a hole is made by spot facing from the back side of the straight hole. In the present embodiment, one counterbore portion 16a is in communication with the plurality of straight portions 16b. Partitions 16c are provided between the adjacent straight parts 16b.

  The head portion 17 is a plate-like portion that holds the tip portion 30 a of the wire probe 30 and is disposed so as to be in contact with the inspection substrate. In the present embodiment, the head portion 17 includes two of the first head plate 18 and the second head plate 20 It consists of a stack of plates. The two plates are connected to each other by a head fixing screw 24. The head fixing screw 24 connecting the two plates is screwed to the spacer 22, whereby the head portion 17 and the spacer 22 are integrally fixed.

  The first head plate 18 is a plate disposed on the inner side of the second head plate 20, that is, closer to the electrode substrate 40 than the second head plate 20. The first head plate 18 is provided with a first tip hole 19 through which the wire probe 30 is inserted. The first tip holes 19 are provided by the number of the wire probes 30 to be held.

  The second head plate 20 is a plate disposed to face the substrate to be inspected. At the time of inspection, the surface of the second head plate 20 is pressed against the substrate to be inspected. The second head plate 20 is provided with a second tip hole 21 through which the wire probe 30 is inserted. The second tip holes 21 are provided as many as the number of the wire probes 30 to be held, and are in communication with the first tip holes 19 described above.

  The spacer 22 is a member for connecting the base portion 11 and the head portion 17 at a predetermined interval. In the present embodiment, a plurality of columnar members are used as the spacer 22. However, the present invention is not limited to this. For example, the spacer 22 may be configured using a plate-like member.

  When the wire probe jig 10 configured as described above is pressed against the substrate to be inspected, the tip 30a of the wire probe 30 protruding from the head 17 is pressed against the terminal of the substrate to be inspected. The wire probe 30 pressed against the substrate to be inspected is bent at an intermediate portion, and is pressed against the substrate to be inspected by its elastic force. By acting in this manner, both ends of the wire probe 30 are reliably pressed against the electrode substrate 40 and the inspection substrate.

  In the present embodiment, the base portion 11 and the head portion 17 are described as being fixed. However, when the base portion 11 and the head portion 17 are pressed against the inspection substrate, the base portion 11 (or a part of the base portion 11) and the head The structure may be such that the portion 17 (or a part of the head portion 17) moves relative to each other.

  By the way, as the wire probe 30 which concerns on this embodiment is covering a part of outer periphery of the metal pin 31 by the insulating film 32, as shown to Fig.4 (a), the insulating film is more than the outer diameter of the metal pin 31. The outer diameter of 32 is large. Further, the outer diameter of the locking portion 33 is set larger than the outer diameter of the insulating film 32.

  The inner diameter of the small diameter portion 12 b is set to be larger than the outer diameter of the insulating film 32 and smaller than the outer diameter of the locking portion 33. Further, the inner diameter of the large diameter portion 12 a is set larger than the outer diameter of the insulating film 32 and the outer diameter of the locking portion 33.

That is, the relationship of “outside diameter of metal pin 31” <“outside diameter of insulating film 32” <“inside diameter of small diameter portion 12 b” <“outside diameter of locking portion 33” <“inside diameter of large diameter portion 12 a” holds So that each dimension is set. By such dimension setting, the wire probe 30 can be inserted until the locking portion 33 is locked to the small diameter portion 12 b, and the locking portion 33 is formed so as to be prevented from coming off.

  When inserting the wire probe 30 into the wire probe jig 10, the tip 30a of the wire probe 30 is inserted from the base 11 side. At this time, since the insulating coating 32 of the wire probe 30 passes through the small diameter portion 12 b, the wire probe 30 penetrates the insertion hole 12 of the base portion 11. Then, the distal end portion 30 a (metal pin 31) of the wire probe 30 which has penetrated the insertion hole 12 is inserted into the first distal end hole 19 and the second distal end hole 21 of the head portion 17. On the other hand, since the locking portion 33 can not pass through the small diameter portion 12b, the locking portion 33 is locked to the step 12c and plays a role of a stopper.

  As described above, in the present embodiment, the insulating film 32 is not locked to the head portion 17 and not to be removed as in the prior art, but the locking portion 33 is locked to the small diameter portion 12 b of the base portion 11 to be removed It is supposed to stop. According to such a configuration, the outer diameter of the insulating film 32 is not limited, and the outer diameter of the insulating film 32 can be reduced, so the minimum pitch of the wire probe 30 can be reduced.

And in this embodiment, as shown to Fig.4 (a), the large diameter part 12a is connected with the other large diameter part 12a, and is formed. For this reason, the large diameter part 12a can be made as close as possible (for example, with the minimum dimension permitted in drilling of the small diameter part 12b). By bringing the large diameter portion 12a close in this manner, the minimum pitch of the wire probe 30 can be further reduced. The shape of the large diameter portion 12a is not limited to a circular cross section as shown in FIG. 4A, but can be appropriately changed in consideration of workability in processing and the like. For example, a long hole shape as shown in FIG. 4 (b) may be used.
Moreover, as shown to FIG. 5 (a)-(d), you may connect three or more large diameter parts 12a.
That is, as shown to Fig.5 (a), you may connect the large diameter part 12a of a circular cross section vertically and horizontally.

Further, as shown in FIG. 5B, by forming one large rectangular recess, a plurality of large diameter portions 12a corresponding to the plurality of small diameter portions 12b can be formed by the one recess. It is also good.
Alternatively, as shown in FIG. 5 (c), the large diameter portions 12a of circular cross section may be arranged in a hexagonal lattice, and then connected to the adjacent large diameter portions 12a.

  Further, as shown in FIG. 5D, by forming one large concave portion of a substantially parallelogram, a plurality of large diameter portions 12a corresponding to the plurality of small diameter portions 12b can be formed by this one concave portion. You may

  As described above, according to the present embodiment, the wire probe 30 and the jig 10 for the wire probe which is disposed between the electrode substrate 40 and the inspection substrate while holding both ends of the wire probe 30 , And the wire probe jig 10 includes a base portion 11 which holds the rear end portion 30b of the wire probe 30 and is disposed in contact with the electrode substrate 40, and the base portion 11 includes the base portion 11; A plurality of insertion holes 12 for inserting the wire probe 30 are provided, and the insertion hole 12 includes a large diameter portion 12a facing the electrode substrate 40 and a small diameter portion 12b continuing to the large diameter portion 12a. A stepped portion 12c is formed between the large diameter portion 12a and the small diameter portion 12b, and the wire probe 30 is incorporated in the large diameter portion 12a and has a diameter larger than the small diameter portion 12b. Comprising a ring-shaped engaging portion 33 has been made. Therefore, the ring-shaped locking portion 33 serves as a stopper, and the wire probe 30 can be prevented from dropping off from the wire probe jig 10. Since the locking portion 33 serves as a stopper, it is not necessary to lock the insulating film 32 of the wire probe 30 in the first tip hole 19 on the tip side. In other words, the insulation film 32 of the wire probe 30 can be thinned. By thinning the insulating film 32 of the wire probe 30, the outer diameter of the small diameter portion 12b can be reduced, so the minimum pitch of the wire probe 30 can be reduced. In addition, since such an effect can be realized without making the tip portion 30a of the wire probe 30 into a special shape, the problem that the tip portion 30a of the wire probe 30 can not slide smoothly does not occur. In addition, since the narrowing of the wire probe 30 is realized by reducing the outer diameter of the small diameter portion 12b, the minimum pitch of the wire probe 30 can be reduced without limiting the number of the wire probes 30.

  Further, since the locking portion 33 is held by the large diameter portion 12a, the rear end portion 30b of the wire probe 30 facing the electrode substrate 40 does not move, and the positional accuracy of the wire probe 30 with respect to the electrode substrate 40 can be improved. it can.

  Further, since the large diameter portion 12a of the insertion hole 12 is formed to be connected to the other large diameter portion 12a, the minimum pitch of the wire probe 30 can be further reduced by making the insertion hole 12 approach. In addition, since the wire probe 30 inserted in the large diameter portion 12a is insulated by the ring-shaped locking portion 33, even if adjacent wire probes 30 are in contact with each other, they are kept electrically insulated from each other. Can.

  The stepped portion 12c is formed by using the insertion hole 12 (first rear end hole 14) as a stepped hole. According to such a configuration, the stepped portion 12 c can be formed regardless of the shape of the insertion hole 12. For example, when the plate thickness of the plate (first base plate 13) through which the insertion hole 12 is formed is thick, even if it is necessary to spot the back side of the insertion hole 12 due to restrictions in processing technology, the front straight hole Can be used to form the step 12c.

  In the embodiment described above, the stepped portion 12c is formed by forming the insertion hole 12 as a stepped hole, but the embodiment of the present invention is not limited to this. For example, as shown in FIG. 6, the first rear end hole 14 and the second rear end hole 16 are formed as straight holes, and the stepped portion 12 c is formed at the boundary between the first base plate 13 and the second base plate 15. You may That is, the large diameter portion 12 a may be formed by the first rear end hole 14, and the small diameter portion 12 b may be formed by the second rear end hole 16.

DESCRIPTION OF SYMBOLS 10 Jig for wire probe 11 Base part 12 Insertion hole 12a Large diameter part 12b Small diameter part 12c Stepped part 13 1st base plate 14 1st back end hole 14a Counterbore part 14b Stepd hole part 14c Partition wall part 15 2nd base plate 16 2nd Rear end hole 16a Counterbore portion 16b Straight portion 16c Partition portion 17 Head portion 18 First head plate 19 First front end hole 20 Second head plate 21 Second front end hole 22 Spacer 23 Base fixing screw 24 Head fixing screw 30 Wire probe 30a Leading end 30b Rear end 31 Metal pin 32 Insulating film 33 Locking part 40 Electrode substrate 41 Wiring

Claims (2)

A wire probe, and a jig for a wire probe which holds both ends of the wire probe and is disposed between an electrode substrate and a substrate to be inspected;
The wire probe jig includes a base portion that holds the rear end portion of the wire probe and is disposed so as to be in contact with the electrode substrate.
The base portion is provided with a plurality of insertion holes through which the wire probe is inserted,
The insertion hole includes a large diameter portion facing the electrode substrate and a small diameter portion connected to the large diameter portion, and a stepped portion is formed between the large diameter portion and the small diameter portion.
The wire probe includes a ring-shaped locking portion which is internally provided in the large diameter portion and is formed larger in diameter than the small diameter portion.
The large diameter portion of the insertion hole is formed to be connected to another large diameter portion . The stepped portion is characterized by being formed by the through hole and Dan'ana, holding structure of claim 1, wherein the wire probe.

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