JP2007057447A - Guide plate for probe card and processing technique thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that as for the conventional guide plate coaxial double-deck constitutional guide holes are required to be prepared in the bottom guide plate, processing is so complicated that the cost of production rises with increasing extra fineness of the guide hole. <P>SOLUTION: In the guide plate for probe, which is guide plates equipped with an upper guide plate and a bottom guide plate, guide holes are deployed in the upper guide plate and the bottom guide plate, the guide hole prepared in the bottom guide plate has a double-deck constitution consisting of a guide hole of a first deck and a guide hole of a second deck and a plurality of guide holes of the second deck are prepared in the bottom plane of the guide hole of the first deck. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a guide plate used in a probe card which is an inspection tool for measuring electrical characteristics of a semiconductor device such as an LSI chip and a method for processing the guide plate.

  A probe card is an inspection device used to measure the electrical characteristics of a semiconductor chip or the like formed on a semiconductor wafer. A number of probes are arranged in accordance with electrode pads of a semiconductor device such as a semiconductor chip. Is used. That is, after setting the semiconductor wafer on the stage, the stage is moved in the direction of the probe card, and the tip of the probe is pressed against the electrode pad of the semiconductor chip. In this state, since the semiconductor chip and the semiconductor tester are electrically connected via the probe, the electrical characteristics of the semiconductor device can be measured by the semiconductor tester. Such a measurement is performed in an inspection process after the semiconductor wafer manufacturing process is completed. In addition, as an example of the probe used for the conventional probe card, what was disclosed in patent document 1 etc. is known.

  As shown in FIGS. 5 and 6, the conventional probe card is provided with a guide plate 1 for setting a probe pin, and has two coaxial stages provided on a bottom guide plate 2 constituting the guide plate 1. One probe P is inserted into each guide hole 12. The second-stage guide hole 12b with a small diameter of the guide hole 12 guides the probe P, and the inner diameter of the second-stage guide hole is about 140 μm. There is a tendency of further miniaturization as the circuit density increases.

  The first-stage guide hole 12a having a diameter larger than that of the second-stage guide hole 12b is provided for setting the protruding amount of the probe P. The second-stage guide hole 12b is also processed. It is a necessary hole.

  The need for a coaxial two-stage guide hole in the bottom guide plate is related to the thickness of the bottom guide plate. If the probes are arranged corresponding to the number of electrodes of the semiconductor integrated circuit, it is necessary to provide about 2500 probes in a limited area of about 1 cm 2, and if the contact pressure per probe is 5 g, the total is about A bottom guide plate having a thickness capable of withstanding a pressure of 12.5 kg is required. As the thickness of the bottom guide plate increases in this way, it becomes difficult to make an extremely fine through hole in the bottom guide plate.

In this way, it is difficult to form the very fine guide hole 12 by a single drilling process. Therefore, after forming the first-stage guide hole 12a having a large diameter first, the bottom surface of the first-stage guide hole 12a is formed. Since it is necessary to form the second-stage guide hole 12b having a small coaxial diameter, a coaxial two-stage structure has been used.
JP 2002-22768 A

  As described above, the conventional guide plate needs to secure the thickness of the bottom guide plate in order to suppress the deformation of the bottom guide plate due to the initial load. However, it is necessary to process two coaxial guide holes, which complicates the processing of the guide plate, increases the processing effort, and increases the processing cost. In order to solve this problem, there is an idea of reducing the thickness of the bottom guide plate. In this case, however, the bottom guide plate is thinned so that the center of the bottom guide plate is recessed so that many probes do not contact each other. The problem of uniformity occurs.

  In view of the above-described problems, an object of the present invention is to provide a guide plate and a guide plate processing method capable of easily opening a guide hole in a bottom guide plate having an increased thickness.

  The probe card guide plate of the present invention is a probe card guide plate comprising an upper guide plate and a bottom guide plate, wherein the upper guide plate and the bottom guide plate are provided with guide holes, and the guide provided on the bottom guide plate. The hole has a two-stage configuration of a first-stage guide hole and a second-stage guide hole, and a plurality of second-stage guide holes are provided on the bottom surface of the first-stage guide hole. To do.

  Further, it is preferable that the first-stage guide hole provided in the bottom guide plate is substantially rectangular, and the second-stage holes are provided at predetermined intervals on the bottom surface of the first-stage guide hole.

  And it is preferable that the said 1st step | paragraph guide hole is provided with two or more by the bottom guide plate, and it functions as a partition between the adjacent 1st step | paragraph guide holes.

  The guide plate processing method of the present invention is a guide plate processing method including an upper guide plate and a bottom guide plate, and the first guide hole and the partition wall are formed on the bottom guide plate by counterboring, A plurality of second-stage holes are formed on the bottom surface of the first-stage guide hole by drilling.

  The probe card guide plate of the present invention is a probe card guide plate comprising an upper guide plate and a bottom guide plate, wherein the upper guide plate and the bottom guide plate are provided with guide holes, and the guide provided on the bottom guide plate. The hole has a two-stage configuration of a first-stage guide hole and a second-stage guide hole, and a plurality of second-stage guide holes are provided on the bottom surface of the first-stage guide hole. Hole machining is simplified, the guide plate machining efficiency is increased, and the unit cost is reduced.

  In addition, the first step guide hole provided in the bottom guide plate is substantially rectangular, and the second step holes are provided at predetermined intervals on the bottom surface of the first step guide hole, so that a narrower pitch is provided. It is possible to correspond to the arrangement of the probes.

  A plurality of the first-stage guide holes are provided in the bottom guide plate, and the space between the adjacent first-stage guide holes functions as a partition, so that the strength of the guide plate can be maintained. .

  The guide plate processing method of the present invention is a guide plate processing method including an upper guide plate and a bottom guide plate, and the first guide hole and the partition wall are formed on the bottom guide plate by counterboring, By forming a plurality of second-stage holes on the bottom surface of the first-stage guide hole by drilling, the processing effort can be reduced and the processing time can be greatly shortened.

  Hereinafter, an embodiment of a probe card guide plate 1 according to the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view showing the entire structure of a probe card A using the guide plate 1 of the present invention, FIG. 2 is a partially enlarged cross-sectional view of the guide plate 1, and FIG. 3 is a guide hole 8 provided in the bottom guide plate 2. FIG. 4 is a perspective view of a guide hole 8 provided in the bottom guide plate 2.

  As shown in FIG. 1, the probe card A includes a guide plate 1, a wire substrate 5 mounted on the guide plate 1, a main substrate 6 mounted on the wire substrate 5, and a main board 6. The laminated structure is composed of a reinforcing plate 7 that is mounted on the central portion of the substrate 6.

  The guide plate 1 includes a bottom guide plate 2 in which the lower portions of a plurality of probes P are inserted to support the probe P, and an upper guide plate that is mounted on the bottom guide plate 2 with the upper portion of the probe P inserted and supported. 3 and includes a spacer 4 that is sandwiched between the bottom guide plate 2 and the upper guide plate 3 to keep the distance therebetween appropriately.

  The bottom guide plate 2, the spacer 4 and the upper guide plate 4 are bolted to the wire substrate 5 in a fastened state, and the wire substrate 5 is bolted to the reinforcing plate 7 in a fastened state with the main substrate 6. Two of the board 6 and the reinforcing plate 7 are bolted. The upper end of each probe P and the main board 6 are electrically connected by a wire 11 made of enamel-coated copper wire or the like in a space formed by the cylindrical hole 7a of the reinforcing plate 7 and the center hole 6a of the main board 6. Wire bonding processing is performed.

  For ease of understanding, only one wire 11 is drawn in FIG. 1 and the others are omitted. Although not shown, a thin film conducting means such as a printed board connected to the wire 11 is formed on the upper surface of the main board 6.

  The guide plate 1 of the present invention used for the probe card A will be described in more detail. FIG. 2 is a partial cross-sectional view of the guide plate 1 used in the probe card A of FIG.

  The guide plate 1 is provided with a guide hole for inserting the probe P, the bottom guide plate 2 is provided with a plurality of guide holes 8, and the upper guide plate 3 is provided with a plurality of guide holes 9. The guide hole 8 provided in the bottom guide plate 2 has a two-stage configuration of a first-stage guide hole 8a and a second-stage guide hole 8b. A plurality of guide holes 8 are formed on the bottom surface of the first-stage guide hole 8a. A second-stage guide hole 8b is provided.

  As shown in the plan view of FIG. 3, the first-stage guide hole 8a is substantially rectangular, and a plurality of second-stage guide holes 8b are provided at predetermined intervals on the bottom surface of the first-stage guide hole 8a. In the present embodiment, nine second-stage guide holes 8b are arranged at equal intervals in 3 × 3 rows for each first-stage guide hole 8a.

  A plurality of first-stage guide holes 8a are provided in the bottom guide plate 2, and a partition wall 9 is formed between the adjacent first-stage guide holes 8a. The partition wall 9 functions as a reinforcing member for the bottom guide plate 2 and can prevent the bottom guide plate 2 from being deformed. The thickness of the partition wall 9 is determined by the pitch of the probes P and the diameter of the probes P.

  A method for forming the guide holes 8 and 9 will be described. First, the bottom guide plate 2 is counterbored to form first-stage guide holes 8a and partition walls 9. Next, a plurality of second-stage guide holes 8b are formed at predetermined intervals on the bottom surface of the first-stage guide hole 8a by drilling. The guide hole 9 of the upper guide plate is formed by drilling.

  Thus, unlike the conventional first-stage guide hole, the first-stage guide hole 8a is formed by counterbore processing, so that the labor for processing the first-stage guide hole 8a can be greatly reduced. Since the second-stage guide hole 8b and the guide hole 9 may be formed by the same drilling as in the prior art, the entire processing time can be reduced by 35 to 40%.

  The number of second-stage guide holes 8b formed on the bottom surface of one first-stage guide hole 8a, the depth and pitch of each guide hole, and the like are appropriately set according to the diameter and pitch of the probe P. be able to.

  As described above, the guide plate of the present invention has a conventional two-stage configuration by forming a plurality of second-stage guide holes on the bottom surface of the first-stage guide hole. Compared with the guide hole machining, the labor for machining the guide hole can be greatly reduced, and the machining time can be greatly reduced. Moreover, the guide plate which can ensure the intensity | strength of a guide plate with a partition can be implement | achieved although processing is easy.

Sectional view showing the structure of a vertical probe card Enlarged sectional view of the guide plate Plan view of guide holes provided in the guide plate Perspective view of guide holes provided in the guide plate Sectional view showing the structure of a conventional vertical probe card Enlarged sectional view of a conventional guide plate

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Guide plate 2 Bottom guide plate 3 Upper guide plate 4 Spacer 5 Wire substrate 6 Main substrate 6a Center hole 7 Reinforcement plate 7a Tube hole 8 Guide hole 8a First step guide hole 8b Second step guide hole 9 Guide hole 10 Bulkhead 11 Wire A Probe card P Probe

Claims (4)

  A probe card guide plate having an upper guide plate and a bottom guide plate, wherein the upper guide plate and the bottom guide plate are provided with guide holes, and the guide holes provided in the bottom guide plate are the first-stage guide holes and 2 A probe card guide plate having a two-stage guide hole structure, wherein a plurality of second-stage guide holes are provided on the bottom surface of the first-stage guide hole.   The first step guide hole provided in the bottom guide plate is substantially rectangular, and second step holes are provided at predetermined intervals on the bottom surface of the first step guide hole. The probe guide plate as described.   3. The probe guide plate according to claim 2, wherein a plurality of the first-stage guide holes are provided in the bottom guide plate, and a space between adjacent first-stage guide holes functions as a partition wall. A method of processing a guide plate having an upper guide plate and a bottom guide plate, wherein a first guide hole and a partition wall are formed on the bottom guide plate by counterboring, and the first guide hole is formed by drilling. A method for processing a probe guide plate, comprising forming a plurality of second-stage holes on a bottom surface.

Images