TW200712502A - A probe card guiding plate and manufacture method thereof - Google Patents

A probe card guiding plate and manufacture method thereof

Info

Publication number
TW200712502A
TW200712502A TW095131362A TW95131362A TW200712502A TW 200712502 A TW200712502 A TW 200712502A TW 095131362 A TW095131362 A TW 095131362A TW 95131362 A TW95131362 A TW 95131362A TW 200712502 A TW200712502 A TW 200712502A
Authority
TW
Taiwan
Prior art keywords
guiding
guiding plate
probe card
manufacture method
plate
Prior art date
Application number
TW095131362A
Other languages
Chinese (zh)
Inventor
Atsushi Mine
Original Assignee
Japan Electronic Materials
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Electronic Materials filed Critical Japan Electronic Materials
Publication of TW200712502A publication Critical patent/TW200712502A/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

The present invention is related to a probe card guiding plate and manufacture method thereof for reducing the production cost of the prior arts which have a guiding plate with a plurality of guiding apertures in a two step configuration. The probe card guiding plate of the present invention comprises an upper guiding plate and a lower guiding plate, and the upper guiding plate and the lower guiding plate have a plurality of guiding apertures respectively. The every guiding aperture of the lower guiding plate has a first step guiding aperture and a second step guiding aperture to form the two step configuration while a plurality of the second step guiding apertures through an inner lower face of the first step guiding aperture.
TW095131362A 2005-08-26 2006-08-25 A probe card guiding plate and manufacture method thereof TW200712502A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005245151A JP2007057447A (en) 2005-08-26 2005-08-26 Guide plate for probe card and processing technique thereof

Publications (1)

Publication Number Publication Date
TW200712502A true TW200712502A (en) 2007-04-01

Family

ID=37771627

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095131362A TW200712502A (en) 2005-08-26 2006-08-25 A probe card guiding plate and manufacture method thereof

Country Status (3)

Country Link
JP (1) JP2007057447A (en)
TW (1) TW200712502A (en)
WO (1) WO2007023884A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106353541A (en) * 2015-07-13 2017-01-25 风琴针株式会社 Probe holding mechanism

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6706076B2 (en) 2016-01-14 2020-06-03 新光電気工業株式会社 Probe guide plate, manufacturing method thereof, and probe device
JP6706079B2 (en) 2016-01-18 2020-06-03 新光電気工業株式会社 Probe guide plate, probe device, and manufacturing method thereof
JP7075725B2 (en) 2017-05-30 2022-05-26 株式会社日本マイクロニクス Electrical connection device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05215802A (en) * 1992-02-06 1993-08-27 Ibiden Co Ltd Printed wiring board inspecting jig
JPH05302938A (en) * 1992-04-24 1993-11-16 Ibiden Co Ltd Inspection jig for printed wiring board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106353541A (en) * 2015-07-13 2017-01-25 风琴针株式会社 Probe holding mechanism

Also Published As

Publication number Publication date
WO2007023884A1 (en) 2007-03-01
JP2007057447A (en) 2007-03-08

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