JP6517845B2 - スケジューラ、基板処理装置、及び基板搬送方法 - Google Patents

スケジューラ、基板処理装置、及び基板搬送方法 Download PDF

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JP6517845B2
JP6517845B2 JP2017005729A JP2017005729A JP6517845B2 JP 6517845 B2 JP6517845 B2 JP 6517845B2 JP 2017005729 A JP2017005729 A JP 2017005729A JP 2017005729 A JP2017005729 A JP 2017005729A JP 6517845 B2 JP6517845 B2 JP 6517845B2
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substrate
unit
processing
graph network
processing apparatus
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JP2018117000A5 (https=
JP2018117000A (ja
Inventor
宏司 野々部
宏司 野々部
隆 三ツ谷
隆 三ツ谷
竜也 小泉
竜也 小泉
邦夫 大石
邦夫 大石
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Ebara Corp
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Ebara Corp
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Priority to JP2017005729A priority Critical patent/JP6517845B2/ja
Priority to KR1020170167286A priority patent/KR102168365B1/ko
Priority to TW107101114A priority patent/TWI718356B/zh
Priority to US15/868,753 priority patent/US10824135B2/en
Priority to CN201810040900.7A priority patent/CN108335997B/zh
Publication of JP2018117000A publication Critical patent/JP2018117000A/ja
Publication of JP2018117000A5 publication Critical patent/JP2018117000A5/ja
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Publication of JP6517845B2 publication Critical patent/JP6517845B2/ja
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form
    • G05B19/4155—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form characterised by program execution, i.e. part program or machine function execution, e.g. selection of a program
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0476—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32252—Scheduling production, machining, job shop
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Quality & Reliability (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • General Factory Administration (AREA)
  • Robotics (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Control Of Conveyors (AREA)
JP2017005729A 2017-01-17 2017-01-17 スケジューラ、基板処理装置、及び基板搬送方法 Active JP6517845B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2017005729A JP6517845B2 (ja) 2017-01-17 2017-01-17 スケジューラ、基板処理装置、及び基板搬送方法
KR1020170167286A KR102168365B1 (ko) 2017-01-17 2017-12-07 스케줄러, 기판 처리 장치 및 기판 반송 방법
US15/868,753 US10824135B2 (en) 2017-01-17 2018-01-11 Scheduler, substrate processing apparatus, and substrate conveyance method
TW107101114A TWI718356B (zh) 2017-01-17 2018-01-11 排程器、基板處理裝置、以及基板搬運方法
CN201810040900.7A CN108335997B (zh) 2017-01-17 2018-01-16 调度器、基板处理装置以及基板搬运方法
US17/036,189 US11099546B2 (en) 2017-01-17 2020-09-29 Scheduler, substrate processing apparatus, and substrate conveyance method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017005729A JP6517845B2 (ja) 2017-01-17 2017-01-17 スケジューラ、基板処理装置、及び基板搬送方法

Related Child Applications (1)

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JP2019079417A Division JP6697107B2 (ja) 2019-04-18 2019-04-18 スケジューラ、基板処理装置、及び基板搬送方法

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JP2018117000A JP2018117000A (ja) 2018-07-26
JP2018117000A5 JP2018117000A5 (https=) 2018-12-13
JP6517845B2 true JP6517845B2 (ja) 2019-05-22

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US (2) US10824135B2 (https=)
JP (1) JP6517845B2 (https=)
KR (1) KR102168365B1 (https=)
CN (1) CN108335997B (https=)
TW (1) TWI718356B (https=)

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KR102363113B1 (ko) * 2018-03-01 2022-02-15 가부시키가이샤 에바라 세이사꾸쇼 스케줄러, 기판 처리 장치, 및 기판 반송 방법
CN109742041B (zh) * 2019-01-07 2020-11-24 成都中电熊猫显示科技有限公司 基板传送的控制方法及设备
US12287624B2 (en) * 2020-07-27 2025-04-29 Applied Materials, Inc. Time constraint management at a manufacturing system
JP7311553B2 (ja) * 2021-03-29 2023-07-19 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法及びプログラム
JP7324811B2 (ja) 2021-09-22 2023-08-10 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法、及びプログラム

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KR102363113B1 (ko) * 2018-03-01 2022-02-15 가부시키가이샤 에바라 세이사꾸쇼 스케줄러, 기판 처리 장치, 및 기판 반송 방법
JP7247743B2 (ja) * 2019-05-20 2023-03-29 東京エレクトロン株式会社 基板処理装置及び基板処理方法

Also Published As

Publication number Publication date
TW201833998A (zh) 2018-09-16
TWI718356B (zh) 2021-02-11
KR102168365B1 (ko) 2020-10-22
US11099546B2 (en) 2021-08-24
CN108335997A (zh) 2018-07-27
CN108335997B (zh) 2023-05-09
JP2018117000A (ja) 2018-07-26
KR20180084616A (ko) 2018-07-25
US20180203434A1 (en) 2018-07-19
US10824135B2 (en) 2020-11-03
US20210011462A1 (en) 2021-01-14

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