JP6511762B2 - 発光素子実装基板 - Google Patents

発光素子実装基板 Download PDF

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Publication number
JP6511762B2
JP6511762B2 JP2014205060A JP2014205060A JP6511762B2 JP 6511762 B2 JP6511762 B2 JP 6511762B2 JP 2014205060 A JP2014205060 A JP 2014205060A JP 2014205060 A JP2014205060 A JP 2014205060A JP 6511762 B2 JP6511762 B2 JP 6511762B2
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JP
Japan
Prior art keywords
pad portions
copper foil
electrode pad
row
mounting substrate
Prior art date
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Active
Application number
JP2014205060A
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English (en)
Japanese (ja)
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JP2016076552A5 (enExample
JP2016076552A (ja
Inventor
典明 奥田
典明 奥田
光広 下嶋
光広 下嶋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Mitsubishi Electric Lighting Corp
Original Assignee
Mitsubishi Electric Corp
Mitsubishi Electric Lighting Corp
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Publication date
Application filed by Mitsubishi Electric Corp, Mitsubishi Electric Lighting Corp filed Critical Mitsubishi Electric Corp
Priority to JP2014205060A priority Critical patent/JP6511762B2/ja
Publication of JP2016076552A publication Critical patent/JP2016076552A/ja
Publication of JP2016076552A5 publication Critical patent/JP2016076552A5/ja
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Publication of JP6511762B2 publication Critical patent/JP6511762B2/ja
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  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Structure Of Printed Boards (AREA)
  • Led Device Packages (AREA)
JP2014205060A 2014-10-03 2014-10-03 発光素子実装基板 Active JP6511762B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014205060A JP6511762B2 (ja) 2014-10-03 2014-10-03 発光素子実装基板

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Application Number Priority Date Filing Date Title
JP2014205060A JP6511762B2 (ja) 2014-10-03 2014-10-03 発光素子実装基板

Publications (3)

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JP2016076552A JP2016076552A (ja) 2016-05-12
JP2016076552A5 JP2016076552A5 (enExample) 2017-10-05
JP6511762B2 true JP6511762B2 (ja) 2019-05-15

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JP2014205060A Active JP6511762B2 (ja) 2014-10-03 2014-10-03 発光素子実装基板

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JP (1) JP6511762B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021087475A (ja) 2019-12-02 2021-06-10 株式会社大一商会 遊技機
JP2021087474A (ja) 2019-12-02 2021-06-10 株式会社大一商会 遊技機
JP2021142016A (ja) * 2020-03-11 2021-09-24 株式会社大一商会 遊技機
JP2021142020A (ja) * 2020-03-11 2021-09-24 株式会社大一商会 遊技機
JP2021142021A (ja) * 2020-03-11 2021-09-24 株式会社大一商会 遊技機
JP2021186278A (ja) * 2020-05-29 2021-12-13 株式会社大一商会 遊技機
JP2022006265A (ja) * 2020-06-24 2022-01-13 株式会社大一商会 遊技機
JP2022006266A (ja) * 2020-06-24 2022-01-13 株式会社大一商会 遊技機
JP2022006267A (ja) * 2020-06-24 2022-01-13 株式会社大一商会 遊技機
CN114535734B (zh) * 2020-11-25 2024-01-26 东莞市中麒光电技术有限公司 一种led的激光焊接方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6269582A (ja) * 1985-09-21 1987-03-30 富士通株式会社 プリント板の回路形成方法
JPH0344080A (ja) * 1989-07-11 1991-02-25 Hitachi Cable Ltd 半導体装置
JP5128881B2 (ja) * 2007-08-31 2013-01-23 パナソニック株式会社 実装用基板及び発光モジュール
JP5053829B2 (ja) * 2007-12-28 2012-10-24 パナソニック株式会社 基板及び発光モジュール
KR101192181B1 (ko) * 2010-03-31 2012-10-17 (주)포인트엔지니어링 광 소자 디바이스 및 그 제조 방법
JP2011258381A (ja) * 2010-06-08 2011-12-22 Sharp Corp 配線基板及び照明装置
JP2012094661A (ja) * 2010-10-26 2012-05-17 Toshiba Lighting & Technology Corp 発光装置及び照明装置
JP2012124248A (ja) * 2010-12-07 2012-06-28 Toppan Printing Co Ltd Ｌｅｄチップ搭載用リードフレーム基板及びその製造方法並びにｌｅｄパッケージ
JP5812845B2 (ja) * 2011-12-19 2015-11-17 新光電気工業株式会社 発光素子搭載用パッケージ及び発光素子パッケージ並びにそれらの製造方法
JP6096413B2 (ja) * 2012-01-25 2017-03-15 新光電気工業株式会社 配線基板、発光装置及び配線基板の製造方法
JP6157062B2 (ja) * 2012-05-15 2017-07-05 三菱電機株式会社 プリント配線板及び光源モジュール及び照明器具及び製造方法
JP5991065B2 (ja) * 2012-07-31 2016-09-14 日亜化学工業株式会社 発光装置
JP5985341B2 (ja) * 2012-10-03 2016-09-06 シャープ株式会社 導電フレームおよび光源基板の製造方法
JP2014107369A (ja) * 2012-11-27 2014-06-09 Citizen Holdings Co Ltd 半導体発光装置

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JP2016076552A (ja) 2016-05-12

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