JP6511762B2 - Light emitting element mounting substrate - Google Patents

Description

  The present invention relates to a light emitting element mounting substrate.

  Conventionally, as disclosed in, for example, JP-A-2014-22267, there is known an LED module in which a plurality of LEDs are mounted along the longitudinal direction of the LED mounting substrate. In this prior art, a series circuit connecting a plurality of LEDs in series is provided on a longitudinal LED mounting substrate.

JP 2014-22267 A

  There are various specifications of the entire luminaire, the specifications of the LEDs, and the specifications of the DC power supply circuit for lighting the LEDs. Even if the number of LEDs mounted is the same, the circuit topology of the LEDs, that is, the number of parallel and series connections of the LEDs may differ. Conventionally, since different copper foil patterns were provided on the LED mounting substrate for each LED circuit connection form, versatility was low, and it was necessary to manufacture a plurality of LED module substrates for each LED circuit connection.

  The present invention has been made to solve the problems as described above, and it is an object of the present invention to provide a light emitting element mounting substrate with improved versatility in forming a circuit connecting light emitting elements.

A light emitting element mounting substrate according to the present invention comprises a substrate body having an electrically insulating surface, a conductive layer provided on the surface and including a plurality of electrode pad portions, and covering at least a part of the conductive layer. An electrically insulating layer for exposing the plurality of electrode pad portions, the plurality of electrode pad portions comprising a plurality of anode pad portions adjacent to each other to form a first row; And a plurality of cathode pad portions adjacent to each other to form a second row juxtaposed along the first row, wherein the conductive layer electrically connects the plurality of anode pad portions to each other. And electrically connecting the plurality of cathode pad portions to each other, and electrically connecting the plurality of adjacent anode pad portions and the plurality of cathode pad portions, the conductive layer being First row and said second And a plurality of first openings spaced apart from one another to form a third row extending along the first row and the second row, each of the plurality of first openings being The plurality of anode pad portions and the plurality of cathode pad portions are electrically connected to each other by reaching the surface of the substrate body and the conductive layer covers the periphery of each of the plurality of first openings without gaps. The electrically insulating layer covers a portion of the conductive layer excluding the plurality of anode pad portions and the plurality of cathode pad portions, and the electrically insulating layer includes the plurality of anode pad portions and the electrically insulating layer. A plurality of second openings are provided to expose the plurality of cathode pad portions.

  According to the present invention, since the number of parallel connection and the number of serial connection of light emitting elements can be changed by cutting the conductive layer, a versatile light emitting element mounting substrate can be provided.

It is a top view of the LED mounting board concerning embodiment of this invention. It is the top view which saw through a part of LED mounting substrate concerning embodiment of this invention. It is sectional drawing in alignment with the AA 'line of the LED mounting substrate in FIG. It is a figure which shows the usage example of the LED mounting board concerning embodiment of this invention. It is a perspective view which shows the usage example of the LED mounting board concerning embodiment of this invention. It is a figure which shows the LED module comprised with the LED mounting board | substrate shown in FIG. It is a circuit diagram of the LED module shown in FIG. It is a figure which shows the other usage example of the LED mounting board concerning embodiment of this invention. It is a figure which shows the other usage example of the LED mounting board concerning embodiment of this invention.

  FIG. 1 is a plan view of an LED mounting board 10 according to an embodiment of the present invention. FIG. 2 is a plan view seen through a portion of the LED mounting substrate 10 according to the embodiment of the present invention (specifically, within the broken line P area in FIG. 1), through the solder resist 4 in the P area. The copper foil pattern 2 in the lower layer is illustrated. FIG. 3 is a cross-sectional view taken along the line A-A 'of the LED mounting substrate 10 in FIG. The LED mounting substrate 10 includes a substrate body 1 having an electrically insulating surface 11, a copper foil pattern 2 which is a layer made of a conductive material, a plurality of electrode pad pairs 3 and a solder which is a layer made of an electrically insulating material. And a resist 4. Since the solder resist 4 covers most of the copper foil pattern 2, the copper foil pattern 2 is hidden in FIG. 1, and the copper foil pattern 2 is illustrated in FIGS. 2 and 3.

  As shown in the perspective view of FIG. 2, the electrode pad pair 3 includes a first electrode pad portion 31 and a second electrode pad portion 32 respectively. By mounting a plurality of light emitting elements on the LED mounting substrate 10, one light source module is provided.

  As understood from the perspective view of FIG. 2 and the sectional view of FIG. 3, the copper foil pattern 2 is provided on the surface 11 of the substrate body 1. A solder resist 4 is provided on the copper foil pattern 2. The solder resist 4 has a plurality of first resist openings 41 and a plurality of second resist openings 42. The first resist opening 41 and the second resist opening 42 expose a part of the copper foil pattern 2 underlying the solder resist 4.

  The copper foil pattern 2 has a plurality of copper foil openings 21 reaching the surface 11 of the substrate body 1. Inside the copper foil opening 21, a solder resist embedded portion 43 in which the same material as the solder resist 4 is embedded is provided. As shown in the perspective view of FIG. 2, the copper foil pattern 2 covers the periphery of the copper foil opening 21 without any gap, so that the plurality of first electrode pad portions 31 and the plurality of second electrode pad portions 32 electrically communicate with each other. It is connected to the. The plurality of first resist openings 41 and second resist openings 42 are provided so as to sandwich the copper foil opening 21. The adjacent first electrode pad portions 31 are preferably arranged at equal intervals, and the adjacent second electrode pad portions 32 are preferably arranged at equal intervals.

  In the present embodiment, in the copper foil pattern 2, the “portion exposed from the first resist opening 41” is the first electrode pad portion 31, and the “portion exposed from the second resist opening 42” is the second electrode pad It is assumed that it is the part 32. That is, in the present embodiment, the first electrode pad portion 31 and the second electrode pad portion 32 are a part of the copper foil pattern 2. Therefore, in the perspective view of FIG. 2, the regions corresponding to the first electrode pad portion 31 and the second electrode pad portion 32 are illustrated by broken lines. The first electrode pad portion 31 and the second electrode pad portion 32 sandwich the copper foil opening 21 in the planar direction of the substrate body 1.

  One of the first electrode pad portion 31 and the second electrode pad portion 32 is soldered to the anode electrode of the LED, and the other is soldered to the cathode electrode of the LED. One first electrode pad portion 31 and one second electrode pad portion 32 positioned to sandwich one copper foil opening 21 constitute one electrode pad pair 3. A plurality of electrode pad pairs 3 are arranged along the longitudinal direction of the substrate body 1.

  The copper foil pattern 2 formed on the substrate body 1 is formed by a known patterning technique. A plurality of copper foil openings 21 are provided in the central portion of the substrate body 1 at predetermined intervals determined in advance along the longitudinal direction. The plurality of copper foil openings 21 reach the surface 11 of the substrate body 1. The solder resist 4 is removed from the peripheral portion of the substrate body 1 so that the substrate body 1 is exposed. The plurality of first electrode pad portions 31 are electrically connected to each other by the copper foil pattern 2 of one connection. The plurality of second electrode pad portions 32 are also electrically connected to each other by a single copper foil pattern 2. The copper foil pattern 2 is also provided between the plurality of copper foil openings 21.

  In the present embodiment, the copper foil pattern 2 is a group of conductive layers covering the surface 11 of the substrate body 1 entirely and continuously, and the copper foil pattern 2 covers the periphery of the copper foil opening 21 without any gap. . Therefore, the space between the adjacent first electrode pads 31 is filled with the copper foil pattern 2 without any gap, and the space between the adjacent second electrode pads 32 is also filled with the copper foil pattern 2 without any space. However, the present invention is not limited to this, and the copper foil pattern 2 electrically connects the plurality of first electrode pad portions 31 to each other and electrically connects the plurality of second electrode pad portions 32 to each other. I hope there is. Further, the copper foil pattern 2 may be any one as long as it electrically connects the adjacent first electrode pad portion 31 and second electrode pad portion 32. That is, the copper foil pattern 2 electrically connects the one first electrode pad portion 31 and the second electrode pad portion 32 positioned diagonally opposite to the one first electrode pad portion 31. I hope there is. As long as these electrical paths are provided, any number and any shape of holes or notches may be provided at any location of the copper foil pattern 2.

  From the viewpoint of electrical insulation, it is preferable to provide the solder resist embedded portion 43 in the copper foil opening 21. If this point is explained in full detail, when the solder resist 4 covers the copper foil pattern 2, the solder resist 4 is filled also in the copper foil opening 21 formed in the copper foil pattern 2, so that the solder resist embedded portion 43 may be formed. By covering the end face of the copper foil pattern 2 with the solder resist 4 as well, electrical insulation is secured. The first electrode pad portion 31 and the second electrode pad portion 32 are opposed to each other through the copper foil opening 21 and the solder resist embedded portion 43 filling the inside thereof. A plurality of first resist openings 41 and second resist openings 42 are provided along the longitudinal direction of the substrate body 1 at a predetermined constant distance. The first and second electrode pad portions 31 and 32 are portions of the copper foil pattern 2 exposed from the plurality of first resist openings 41 and second resist openings 42 respectively. The solder resist 4 is sandwiched between the copper foil opening 21 and the first electrode pad portion 31 and between the copper foil opening 21 and the second electrode pad portion 32.

  Next, a method of using the LED mounting substrate 10 will be described. By removing a part of the copper foil pattern 2 connecting the electrode pad pair 3 and a part of the solder resist 4, a desired LED circuit connection is formed. The LED module substrate thus formed is used as a united substrate for forming a desired circuit connection, that is, the number of parallel and serial connections.

  FIG. 4 is a view showing an example of use of the LED mounting board 10 according to the embodiment of the present invention. FIG. 5 is a perspective view of the solder resist 4 in the P region of FIG. The first removing portion 6 in FIG. 4 is a part of the copper foil pattern 2 connecting the first electrode pad portion 31 and the second electrode pad portion 32 and the solder resist 4 on the copper foil pattern 2. , It is a portion removed by laser processing. The first removal portion 6 extends in the direction in which the copper foil openings 21 are aligned, and connects the adjacent copper foil openings 21. Since the first removing portion 6 is a portion from which the solder resist 4 and the copper foil pattern 2 are removed, the substrate body 1 is exposed from the first removing portion 6. The first electrode pad portion 31 and the second electrode pad portion 32 which face each other across the copper foil opening 21 are electrically insulated from each other by the first removing portion 6.

  The second removing portion 7 is a portion obtained by removing a portion of the copper foil pattern 2 connecting the adjacent second electrode pad portions 32 and the solder resist 4 on the copper foil pattern 2 by laser processing. . One end of the second removal portion 7 is connected to one end of the copper foil opening 21, that is, one end of the solder resist embedded portion 43. The other end of the second removing portion 7 extends toward the edge of the substrate body 1 and reaches the solder resist 4 protruding outside the end of the copper foil pattern 2. Since the second removing portion 7 is a portion from which the solder resist 4 and the copper foil pattern 2 are removed, the substrate body 1 is exposed from the second removing portion 7. The second removing portion 7 electrically insulates two adjacent second electrode pad portions 32 at a specific position.

  The third removing portion 8 is a portion obtained by removing a portion of the copper foil pattern 2 connecting the adjacent first electrode pad portions 31 and the solder resist 4 on the copper foil pattern 2 by laser processing or the like. is there. One end of the third removal portion 8 is connected to one end of the copper foil opening 21, that is, one end of the solder resist embedded portion 43. The other end of the third removing portion 8 extends toward the edge of the substrate body 1. The direction in which the third removal portion 8 extends is opposite to the direction in which the second removal portion 7 extends. The other end of the third removal portion 8 reaches the solder resist 4 protruding outside the end of the copper foil pattern 2. The third removing portion 8 is a portion from which the solder resist 4 and the copper foil pattern 2 are removed, so the substrate body 1 is exposed from the third removing portion 8. The third electrode removing portion 8 electrically insulates the adjacent first electrode pad portions 31 at the specific position.

  The third removing portion 8 and the second removing portion 7 are separated from each other. The copper foil pattern 2 remains between the adjacent second removing portion 7 and third removing portion 8. The remaining first copper foil pattern 2 electrically connects the first electrode pad portion 31 and the second electrode pad portion 32 which are adjacent to each other with the second removal portion 7 and the third removal portion 8 interposed therebetween. Thus, by forming the first removing portion 6, the second removing portion 7, and the third removing portion 8 with respect to the LED mounting substrate 10 of FIG. 1, the LED mounting substrate 10 of FIG. It can be processed to form a 4-parallel 3-series connected LED module as shown in the circuit diagram.

  FIG. 6 is a view showing an LED module 52 configured by the LED mounting substrate 10 shown in FIG. FIG. 7 is a circuit diagram of the LED module 52 shown in FIG. The LED module 52 is obtained by mounting twelve LEDs 50 on the LED mounting substrate 10 processed as shown in FIG. 4. In addition, you may use an organic EL element instead of LED50 as a light emitting element.

  The LED 50 is mounted such that the anode and the cathode are respectively connected to the first electrode pad portion 31 and the second electrode pad portion 32 which face each other with the copper foil opening 21 interposed therebetween. Thereby, as shown in FIG. 6 and FIG. 7, the LED module 52 in which the LEDs 50 are connected in parallel in four parallel is manufactured. In FIG. 7, the first and second electrode pad portions 31 and 32 are described by white circles. Further, in FIG. 7, regions of the copper foil pattern 2 electrically connected to each other without being divided by the first to third removal portions 6 to 8 are wires connecting the first and second electrode pad portions 31 and 32 adjacent to each other. It corresponds.

  The first removal portion 6 exposes the substrate body 1 by removing the solder resist 4 and the copper foil pattern 2 between the adjacent copper foil openings 21, and the solder resist embedded in the copper foil opening 21 is embedded. The insertion unit 43 is left as it is. In this case, the first removed portion 6 and the solder resist embedded portion 43 are alternately arranged, and the solder resist embedded portion 43 which is an insulator between the first electrode pad portion 31 and the second electrode pad portion 32. Can leave. However, the present invention is not limited to this. The solder resist buried portion 43 may be removed, and in this case, the first removal portion 6 extends continuously between the plurality of electrode pad pairs 3.

  FIG. 8 and FIG. 9 are diagrams showing another usage example of the LED mounting board 10 according to the embodiment of the present invention. In addition, although the perspective view equivalent to FIG. 5 is shown about the other usage example of FIG. 8 and FIG. 9 for the simplification of description, in fact, as shown in FIG. Covering the peripheral area of pair 3. FIG. 8 shows a circuit connection of the LED 50 in which two parallel and six series connections are made. In the example of use shown in FIG. 8, a portion of the copper foil pattern 2 and a portion of the solder resist 4 are removed by laser processing to form a first removing portion 6, a second removing portion 7 and a third removing portion 8. It is formed, and a place different from that shown in FIG. 4 is removed.

  FIG. 9 shows 12 series-connected circuit connections of the LEDs 50. The example of use shown in FIG. 9 is one in which the second removal portion 7 and the third removal portion 8 are formed by removing a part of the copper foil pattern 2 and a part of the solder resist 4 by laser processing. The point different from that shown in 4 is removed.

  According to the present embodiment, by dividing the copper foil pattern 2 with the copper foil opening 21 as a starting point, it is possible to form an electrode pad for the anode and an electrode pad for the cathode. Depending on how many copper foil openings 21 are connected, it is possible to arbitrarily change how many electrode pad pairs 3 are connected in parallel, so that versatile light emission can change the number of parallel connection of LED elements and the number of series connection. An element mounting substrate is provided. That is, when the number of LEDs 50 mounted is the same and the number of LEDs connected in parallel is different, it is not necessary to manufacture a plurality of substrates for each circuit. A desired circuit can be formed by removing a part of the copper foil pattern 2 and a part of the solder resist 4 from one LED mounting substrate 10.

  In the above embodiment, in the LED mounting substrate 10 on which 12 LEDs 50 can be mounted at maximum, the case where 3 parallels of 4 parallels are connected will be described using FIGS. 4 to 7. The case of connection is described, and an example of use in the case of 12 series connection is described with reference to FIG. However, the present invention is not limited to this. The LED mounting substrate 10 may be used to make three parallel four series connections and six parallel two series connections. Further, the number of mounted LEDs is not limited to twelve. When n is an arbitrary integer of 2 or more, the number of mounted LEDs may be changed to n. In this case, the number of copper foil openings 21 and electrode pad pairs 3 may be n.

  In the above embodiment, the plurality of first electrode pad portions 31 are linearly arranged in a line along one long side of the LED mounting substrate 10, and the plurality of second electrode pads 32 are the one side of the LED mounting substrate 10. It is arranged in a line and in a straight line along the other long side opposite to the long side. However, the present invention is not limited to the arrangement in which the row of the plurality of first electrode pad portions 31 and the row of the plurality of second electrode pads 32 are arranged in parallel in this manner. The rows of the first and second electrode pad portions 31 and 32 may form a curved line, or the rows of the first and second electrode pad portions 31 and 32 may be non-parallel to form an angle. In the above-mentioned embodiment, although the 1st electrode pad part 31 and the 2nd electrode pad part 32 were made to line up one by one in linear form, respectively, the present invention is not limited to this. A plurality of rows of the first electrode pad portion 31 and the second electrode pad portion 32 may be arranged in one substrate main body 1.

  In the LED mounting substrate 10 according to the embodiment, the substrate body 1 has a rectangular shape in plan view in order to arrange a plurality of LEDs in one direction as one example. However, the present invention is not limited to this, and the plan view shape of the substrate body 1 may be square, any polygon, circle, oval, or any other various shapes.

  In addition, although a part of copper foil pattern 2 was made into the electrode pad part in embodiment, this invention is not limited to this. The first and second electrode pad portions 31 and 32 may be formed of a conductive material other than copper foil, and the copper foil pattern 2 is filled so as to fill the space between the first and second electrode pad portions 31 and 32 other than copper foil. It may be formed to form an electrical connection.

  In the above-mentioned embodiment, although the method of performing laser processing was explained as a means to remove copper foil pattern 2 and solder resist 4, the present invention is not limited to this. You may carry out by NC router processing, grinding processing, cutting processing, etc.

DESCRIPTION OF SYMBOLS 1 board | substrate body, 2 copper foil pattern, 3 electrode pad pair, 4 solder resist, 6 1st removal part, 7 2nd removal part, 8 3rd removal part, 10 LED mounting board, 11 surface, 21 copper foil opening, 31 1st electrode pad portion, 32 2nd electrode pad portion, 41 1st resist opening, 42 2nd resist opening, 43 solder resist embedded portion, 50 LED, 52 LED module

Claims (3)

A substrate body having an electrical insulating property of the surface,
A conductive layer provided on the surface and including a plurality of electrode pad portions;
An electrically insulating layer that exposes the plurality of electrode pad portions while covering at least a part of the conductive layer;
Equipped with
Wherein the plurality of electrode pad portion includes a plurality of anode pad portions adjacent to each other so as to form a first row, a second row arranged along the first row next to the first row formed It includes a plurality of cathode pad portions adjacent to each other in Suyo, a,
The conductive layer electrically connects the plurality of anode pad portions to each other, electrically connects the plurality of cathode pad portions to each other, and the plurality of adjacent anode pad portions and the plurality of cathodes Electrically connect with the pad part,
The conductive layers are spaced apart from one another to form a third row extending along the first row and the second row between the first row and the second row. A first opening, each of the plurality of first openings reaching the surface of the substrate body,
The plurality of anode pad portions and the plurality of cathode pad portions are electrically connected to each other by the conductive layer covering the periphery of each of the plurality of first openings without gaps.
The electrically insulating layer covers a portion of the conductive layer excluding the plurality of anode pad portions and the plurality of cathode pad portions.
The light emitting element mounting substrate, wherein the electrically insulating layer has a plurality of second openings for exposing the plurality of anode pad portions and the plurality of cathode pad portions. The light emitting element mounting substrate according to claim 1 , wherein the inside of the plurality of first openings is filled with the electrical insulating layer. The light emitting element mounting substrate according to claim 1 or 2 , wherein the plurality of anode pad portions are arranged at equal intervals, and the plurality of cathode pad portions are arranged at the same interval as the plurality of anode pad portions.

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