JP6104616B2 - LED module - Google Patents

Description

  The present invention relates to a ring-shaped LED module provided in an LED lighting device.

  2. Description of the Related Art Some LED lighting devices that use power-saving and long-life LEDs as a light source include an LED module in which a plurality of LEDs (light emitting diodes) are mounted on a ring-shaped LED substrate. In the production of such a ring-shaped LED module, if a continuous LED substrate 102 is obtained continuously from a rectangular substrate as shown in FIG. 15, the portion shown by hatching in FIG. There is a problem that is bad.

  Therefore, for example, as shown in FIG. 16, the arc-shaped LED board 202 divided into eight parts or the arc-shaped LED board 302 divided into four parts as shown in FIG. It is configured (see, for example, Patent Document 1).

Utility Model Registration No. 3154761

  However, even if a method of assembling a plurality of arc-shaped LED substrates 202 and 302 to form ring-shaped LED modules 201 and 301 as shown in FIGS. 16 and 17, a plurality of arc-shaped LED substrates 202 is used. , 302 are produced from a single substrate, the yield is poor, and there is a problem that the material cost increases because more parts are discarded.

  In addition, when a plurality of arc-shaped LED boards 202 and 302 shown in FIGS. 16 and 17 are put into the mount reflow process in an imposition state, it is necessary to provide a discarded board and make the whole into a square shape, which is wasteful for the material Will increase. In this case, there is a method in which a single board of each arc-shaped LED board is not provided with a discarded board and is put into the mount reflow process using a dedicated jig for the mount reflow process, but the initial cost and the mounting man-hour increase. There's a problem. When such a method is adopted, it is necessary to manage the chromaticity rank, the luminous flux rank, the Vf (forward voltage) rank, and the like of a plurality of LEDs mounted on each single LED substrate in an assembly process which is a subsequent process. Therefore, there is a problem that the management is difficult.

  The present invention has been made in view of the above problems, and the object of the present invention is to reduce the material cost and the initial cost by reducing the number of discarded substrates and increasing the yield, as well as the chromaticity rank and luminous flux rank of the LED. An object of the present invention is to provide an LED module capable of facilitating management of Vf rank and the like.

  In order to achieve the above object, an invention according to claim 1 is an LED module configured in a ring shape by assembling a plurality of LED substrates on which LEDs are mounted, and each LED substrate is formed into a substantially rectangular shape. Two opposite long sides are set as substantially parallel straight lines, one short side is set as a straight line perpendicular to the two long sides, and a notch is formed on the other side, The LED board is connected by fitting a right side on the short side of another LED board into the notch.

The invention described in claim 2 is characterized in that, in the invention described in claim 1, the LED module is configured in a polygonal ring shape by connecting two adjacent LED substrates by connectors .

  According to the present invention, since each of the plurality of LED substrates is formed into a substantially rectangular shape, it is possible to minimize the number of discarded substrates when obtaining a plurality of LED substrates from one substrate, and to increase the yield and material cost. Can be kept low.

  In addition, a single substrate in which a plurality of LED substrates are arranged in an orderly manner can be put into the mount reflow process, and the initial cost and the number of assembly steps can be reduced by minimizing the number of discarded substrates. In this case, the LED chromaticity rank, luminous flux rank, Vf rank, and the like of each LED substrate can be managed in the imposition state, which facilitates the management.

  In addition, a ring-shaped LED module is formed by fitting a right side on the short side of another LED board into a notch formed on one side on the short side of each of a plurality of LEDs and connecting both boards. Can be assembled.

It is a top view which shows the imposition state of the LED board in Embodiment 1 of this invention. It is a top view of the LED board of the LED module which concerns on Embodiment 1 of this invention. FIG. 3 is an enlarged detail view of a part A in FIG. 2. It is a top view of the LED module which concerns on Embodiment 1 of this invention. It is the B section enlarged detail drawing of FIG. It is a top view of the LED module which concerns on Embodiment 2 of this invention. It is a top view which shows the imposition state of the LED board in Embodiment 2 of this invention. It is the C section enlarged detail drawing of FIG. It is a top view of the LED module which concerns on Embodiment 3 of this invention. It is a top view which shows the imposition state of the LED board in Embodiment 3 of this invention. It is the D section enlarged detail drawing of FIG. It is a top view of the LED module which concerns on Embodiment 4 of this invention. It is a top view which shows the imposition state of the LED board in Embodiment 4 of this invention. It is the E section enlarged detail drawing of FIG. It is a top view of the conventional LED board (no division | segmentation). It is a top view of the conventional split type LED module (8 divisions). It is a top view of the conventional split type LED module (4 divisions).

  Embodiments of the present invention will be described below with reference to the accompanying drawings.

<Embodiment 1>
1 is a plan view showing an imposition state of an LED substrate according to Embodiment 1 of the present invention, FIG. 2 is a plan view of the LED substrate of the LED module according to Embodiment 1 of the present invention, and FIG. FIG. 4 is a plan view of the LED module, and FIG. 5 is an enlarged detail view of part B of FIG.

As shown in FIG. 4, the LED module 1 according to the present embodiment is configured in an octagonal ring shape by connecting eight LED substrates 2, and each LED substrate 2 is 1 as shown in FIG. 1. Manufactured in imposition by punching a single substrate. Specifically, the eight LED substrates 2 in the imposition state are arranged in four rows in the vertical direction and in two rows in the horizontal direction, and these are put into the mount reflow process in the imposition state.

  Thus, as shown in FIG. 1, the eight LED boards 2 in the imposition state are separated and used one by one, but each LED board 2 is formed into a substantially rectangular shape as shown in FIG. On top of this, a plurality of LEDs 3 are mounted in an arc shape at appropriate intervals.

Here, as shown in FIG. 2, in each LED board 2 formed in a substantially rectangular shape, two opposite sides a and b are substantially parallel straight lines, and one of the short sides (see FIG. 2). The left side 2) is a straight line perpendicular to the two long sides a and b, and the other side (the right end in FIG. 2) is formed with a notch 2a. As shown in FIGS. 4 and 5, this notch 2 a is fitted with a vertical side c of another LED substrate 2 connected to the LED substrate 2, and the angle thereof is as shown in FIG. 3. (360 ° / 8) = 45 °. If the number of LED substrates 2 is n, the angle α of the notch 2a is set to α = (360 ° / n).

  Thus, as shown in FIG. 4, the LED module 1 according to the present embodiment has another LED substrate 2 adjacent to a notch 2a formed on one side d on the short side of each LED substrate 2. A vertical side c on the short side of the LED board 2 is fitted (see FIG. 5), and the LED boards 2 are connected to each other by a connector 4 to form an octagonal ring shape. The LED boards 2 are electrically connected to each other by the connector 4. Is done.

  As described above, in the present embodiment, since each of the eight LED substrates 2 is formed into a substantially rectangular shape, the number of discarded substrates when obtaining eight LED substrates 2 from one substrate can be minimized. Increases yield and lowers material costs.

  In addition, one LED substrate 2 with eight LED substrates 2 arranged in an orderly manner as shown in FIG. 1 can be put into the mount reflow process, and the initial cost and assembly man-hour can be reduced by minimizing the number of discarded substrates. Can be reduced. In this case, since the chromaticity rank, the luminous flux rank, the Vf rank, etc. of the LEDs 3 of each LED substrate 2 can be managed in the imposition state, the effect of facilitating the management can be obtained.

<Embodiment 2>
Next, a second embodiment of the present invention will be described below with reference to FIGS.

  FIG. 6 is a plan view of the LED module according to Embodiment 2 of the present invention, FIG. 7 is a plan view showing the imposition state of the LED substrate in Embodiment 2 of the present invention, and FIG. FIG.

  The LED module 1 according to the present embodiment is configured in a hexagonal ring shape by connecting six LED substrates 2, and the configuration of each LED substrate 2 is the same as that of the first embodiment. However, the angle of the notch 2a of each LED board 2 is set to (360 ° / 6) = 60 ° as shown in FIG. Further, the six LED substrates 2 are arranged in three vertical rows and two horizontal rows as shown in FIG. 7 in the imposition state, and are put into the mount reflow process in this imposition state.

  Thus, as shown in FIG. 6, the LED module 1 according to the present embodiment has another LED substrate 2 adjacent to a notch 2 a formed on one side d on the short side of each LED substrate 2. A vertical side c on the short side is fitted and the LED boards 2 are connected to each other by a connector 4 to form a hexagonal ring shape, and the LED boards 2 are electrically connected to each other by the connector 4.

  The LED module 1 according to the present embodiment is different from the first embodiment only in the number of LED substrates 2 constituting the LED module 1, and the basic configuration is the same as that of the first embodiment. Also, the same effect as in the first embodiment can be obtained.

<Embodiment 3>
Next, a third embodiment of the present invention will be described below with reference to FIGS.

  FIG. 9 is a plan view of an LED module according to Embodiment 3 of the present invention, FIG. 10 is a plan view showing an imposition state of the LED substrate in Embodiment 3 of the present invention, and FIG. FIG.

  The LED module 1 according to the present embodiment is configured in a pentagonal ring shape by connecting five LED substrates 2, and the configuration of each LED substrate 2 is the same as that of the first embodiment. However, the angle of the notch 2a of each LED board 2 is set to (360 ° / 5) = 72 ° as shown in FIG. In the imposition state, the five LED substrates 2 are arranged in five vertical rows and one horizontal row as shown in FIG. 10, and are put into the mount reflow process in this imposition state.

  Thus, as shown in FIG. 9, the LED module 1 according to the present embodiment has another LED substrate 2 adjacent to the notch 2 a formed on one side d of the short side pattern of each LED substrate 2. The LED board 2 is connected to each other by a connector 4, and the LED boards 2 are electrically connected to each other by the connector 4.

  The LED module 1 according to the present embodiment also differs from the first embodiment only in the number of LED substrates 2 constituting the LED module 1, and the basic configuration is the same as that of the first embodiment. Also, the same effect as in the first embodiment can be obtained.

<Embodiment 4>
Next, a fourth embodiment of the present invention will be described below with reference to FIGS.

  FIG. 12 is a plan view of an LED module according to Embodiment 4 of the present invention, FIG. 13 is a plan view showing an imposition state of the LED substrate in Embodiment 4 of the present invention, and FIG. 14 is an enlarged detail of portion D in FIG. FIG.

  The LED module 1 according to the present embodiment is configured in a decagonal ring shape by connecting ten LED substrates 2, and the configuration of each LED substrate 2 is the same as that of the first embodiment. However, the angle of the notch 2a of each LED board 2 is set to (360 ° / 10) = 36 ° as shown in FIG. In addition, the ten LED boards 2 are arranged in five vertical rows and two horizontal rows as shown in FIG. 11 in the imposition state, and are put into the mount reflow process in this imposition state.

  Thus, as shown in FIG. 12, the LED module 1 according to the present embodiment has another LED substrate 2 adjacent to the notch 2a formed on one side d of the short side pattern of each LED substrate 2. A vertical side c on the short side of the LED board 2 is fitted and the LED boards 2 are connected to each other by a connector 4 to form a decagonal ring shape, and the LED boards 2 are electrically connected to each other by the connector 4.

  The LED module 1 according to the present embodiment also differs from the first embodiment only in the number of LED substrates 2 constituting the LED module 1, and the basic configuration is the same as that of the first embodiment. Also, the same effect as in the first embodiment can be obtained.

1 LED module 2 LED board 2a LED board notch 3 LED
4 Connector a, b Long side of LED board c, d Short side of LED board

Claims (2)

In an LED module configured in a ring shape by assembling a plurality of LED substrates on which LEDs are mounted,
Each LED board is formed into a substantially rectangular shape, two opposite long sides are set as substantially parallel straight lines, and one short side is set as a straight line perpendicular to the two long sides. The LED module is characterized in that a notch is formed in the other side, and the right side on the short side of the other LED substrate is fitted into the notch to connect the two LED substrates. The LED module according to claim 1, wherein the LED modules are configured in a polygonal ring shape by connecting two adjacent LED substrates with connectors .

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