JP2009076576A5 - - Google Patents

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Publication number
JP2009076576A5
JP2009076576A5 JP2007242505A JP2007242505A JP2009076576A5 JP 2009076576 A5 JP2009076576 A5 JP 2009076576A5 JP 2007242505 A JP2007242505 A JP 2007242505A JP 2007242505 A JP2007242505 A JP 2007242505A JP 2009076576 A5 JP2009076576 A5 JP 2009076576A5
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JP
Japan
Prior art keywords
light emitting
emitting device
light
wiring pattern
sealing resin
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JP2007242505A
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Japanese (ja)
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JP2009076576A (en
JP5538671B2 (en
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Priority to JP2007242505A priority Critical patent/JP5538671B2/en
Priority claimed from JP2007242505A external-priority patent/JP5538671B2/en
Publication of JP2009076576A publication Critical patent/JP2009076576A/en
Publication of JP2009076576A5 publication Critical patent/JP2009076576A5/ja
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Publication of JP5538671B2 publication Critical patent/JP5538671B2/en
Expired - Fee Related legal-status Critical Current
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Claims (13)

基板上に、複数の配線パターンが配置され、A plurality of wiring patterns are arranged on the substrate,
前記配線パターンにおける長手方向に沿って、複数の発光素子が複数列となるように配置され、A plurality of light emitting elements are arranged in a plurality of rows along the longitudinal direction of the wiring pattern,
前記各列の発光素子は、その側面が互いに対向しないようにちどり状に配置され、The light emitting elements in each row are arranged in a dust shape so that the side surfaces do not face each other,
前記発光素子と前記配線パターンとがボンディングワイヤで接続され、The light emitting element and the wiring pattern are connected by a bonding wire,
前記複数の発光素子と前記ボンディングワイヤの全体を覆うように封止樹脂で封止され、Sealed with a sealing resin so as to cover the plurality of light emitting elements and the entire bonding wire,
極性が異なる２つの電極外部接続ランドを備えた発光装置。A light-emitting device including two electrode external connection lands having different polarities. 基板上に、複数の配線パターンが配置され、
前記配線パターンにおける長手方向に沿って、複数の発光素子が複数列となるように配置され、
前記発光素子と前記配線パターンとがボンディングワイヤで接続され、
前記複数の発光素子と前記ボンディングワイヤの全体を覆うように封止樹脂で封止され、
極性が異なる２つの電極外部接続ランドを備え、
前記配線パターンの端部または隅部に、前記封止樹脂に覆われないテストパターン接続ランドをさらに備えた発光装置。 On a base plate, a plurality of wiring patterns are placed,
A plurality of light emitting elements are arranged in a plurality of rows along the longitudinal direction of the wiring pattern,
It said light emitting element and said wiring pattern are connected by bonding wires,
Sealed with a sealing resin so as to cover the entirety of the bonding wire and the plurality of light emitting elements,
It has two electrode external connection lands with different polarities ,
A light-emitting device further comprising a test pattern connection land not covered with the sealing resin at an end or corner of the wiring pattern . 前記基板上に、ワイヤボンディングおよびダイボンディングのための自動認識用パターンが設けられた請求項１または２に記載の発光装置。 Before on Kimoto plate, the light emitting device according to claim 1 or 2 automatic recognition pattern is provided for wire bonding and die bonding. 前記基板上に、センサ搭載用外部接続ランドが設けられた請求項１〜３のいずれかに記載の発光装置。 On the substrate, the light emitting device according to any one of the sensor mounting external connection land is kicked set claims 1-3. 前記センサ搭載用外部接続ランドに接続されるセンサは、温度センサである請求項４に記載の発光装置。The light-emitting device according to claim 4, wherein the sensor connected to the sensor-mounted external connection land is a temperature sensor. 前記基板の周縁部または隅部に、複数の固定用貫通穴および／または固定用切り欠け部が設けられた請求項１〜５のいずれかに記載の発光装置。 Before the periphery or the corners of Kimoto plate, the light emitting device according to any one of claims 1 to 5, a plurality of fixing through holes and / or fixing cutting chipped portion is provided. 前記基板は、コア金属の表面にホーロー層を被覆したホーロー基板である、請求項１〜６のいずれかに記載の発光装置。 The light emitting device according to claim 1, wherein the substrate is a hollow substrate in which a surface of a core metal is covered with a hollow layer . 前記コア金属は、極低炭素鋼、低炭素鋼、中炭素鋼および高炭素鋼から選ばれる少なくとも１つからなる請求項７に記載の発光装置。 The light emitting device according to claim 7 , wherein the core metal is made of at least one selected from extremely low carbon steel, low carbon steel, medium carbon steel, and high carbon steel. 前記封止樹脂の形状は、略六角形状、八角形状、円形状または長方形状のいずれかである請求項１〜８のいずれかに記載の発光装置。 The shape of the sealing resin is substantially hexagonal, octagonal, light-emitting device according to any one of claims 1-8 is either circular or rectangular shape. 前記封止樹脂は、蛍光体を含有している請求項１〜９のいずれかに記載の発光装置。 The sealing resin, the light emitting device according to any one of claims 1 to 9, which contains a phosphor. 前記配線パターンは、凹凸状である、請求項１〜１０のいずれかに記載の発光装置。The light-emitting device according to claim 1, wherein the wiring pattern is uneven. 請求項１〜１１のいずれかに記載の発光装置と、搭載面と、ソケットとを備えたＬＥＤランプ。The LED lamp provided with the light-emitting device in any one of Claims 1-11, a mounting surface, and a socket. 請求項６に記載の発光装置と、搭載面とを備え、A light emitting device according to claim 6 and a mounting surface.
前記発光装置は、前記固定用貫通穴および／または前記固定用切り欠け部を通る取り付けネジによって前記搭載面に固定されているＬＥＤランプ。The light emitting device is an LED lamp fixed to the mounting surface by a mounting screw passing through the fixing through hole and / or the fixing notch.
JP2007242505A 2007-09-19 2007-09-19 Light emitting device and LED lamp Expired - Fee Related JP5538671B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007242505A JP5538671B2 (en) 2007-09-19 2007-09-19 Light emitting device and LED lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007242505A JP5538671B2 (en) 2007-09-19 2007-09-19 Light emitting device and LED lamp

Publications (3)

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JP2009076576A JP2009076576A (en) 2009-04-09
JP2009076576A5 true JP2009076576A5 (en) 2009-09-17
JP5538671B2 JP5538671B2 (en) 2014-07-02

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US8342733B2 (en) * 2009-12-14 2013-01-01 Tyco Electronics Corporation LED lighting assemblies
JP5710126B2 (en) * 2010-01-14 2015-04-30 ザイ＆エス株式会社 LED lighting device
JP2011151268A (en) 2010-01-22 2011-08-04 Sharp Corp Light-emitting device
WO2011136236A1 (en) * 2010-04-26 2011-11-03 パナソニック電工株式会社 Leadframe, wiring board, light emitting unit, and illuminating apparatus
JP2011249737A (en) * 2010-04-26 2011-12-08 Panasonic Electric Works Co Ltd Lead frame, wiring board, and led unit using the same
JP5612991B2 (en) 2010-09-30 2014-10-22 シャープ株式会社 LIGHT EMITTING DEVICE AND LIGHTING DEVICE HAVING THE SAME
JP5836780B2 (en) * 2011-12-02 2015-12-24 日立アプライアンス株式会社 Light emitting diode module and lighting apparatus using the same
CN104718620B (en) * 2012-10-24 2018-01-02 夏普株式会社 Light-emitting device
JP6539035B2 (en) * 2014-01-08 2019-07-03 ローム株式会社 Chip parts
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JP2014187392A (en) * 2014-06-23 2014-10-02 Sharp Corp Light-emitting device and luminaire having the same
KR102426711B1 (en) 2015-11-18 2022-07-29 삼성디스플레이 주식회사 Flexible display apparatus
CN107092130A (en) * 2016-09-30 2017-08-25 深圳市玲涛光电科技有限公司 Light source assembly and its display device
JP6881874B2 (en) * 2018-03-29 2021-06-02 Hoya株式会社 Wiring board for light irradiation module and LED element
CN110323323A (en) * 2018-03-29 2019-10-11 豪雅冠得股份有限公司 Light irradiation module and LED element wiring substrate
JP2023138199A (en) * 2022-03-19 2023-10-02 Hoya株式会社 Light irradiation module and light irradiation device

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