JP2012033321A - Led lighting system - Google Patents

Led lighting system Download PDF

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Publication number
JP2012033321A
JP2012033321A JP2010170295A JP2010170295A JP2012033321A JP 2012033321 A JP2012033321 A JP 2012033321A JP 2010170295 A JP2010170295 A JP 2010170295A JP 2010170295 A JP2010170295 A JP 2010170295A JP 2012033321 A JP2012033321 A JP 2012033321A
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JP
Japan
Prior art keywords
led
substrate
unit
joining
jointing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010170295A
Other languages
Japanese (ja)
Inventor
Hiroto Baba
裕人 馬場
Tetsuya Yamane
哲也 山根
Shigeru Shimoda
茂 霜田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Sanyo Techno Solutions Tottori Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Tega Sanyo Industry Co Ltd
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Filing date
Publication date
Application filed by Sanyo Electric Co Ltd, Tega Sanyo Industry Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP2010170295A priority Critical patent/JP2012033321A/en
Publication of JP2012033321A publication Critical patent/JP2012033321A/en
Pending legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To provide a technology in a lighting system installed in nearly horizontal state on a ceiling or the like of the room in which a problem is solved that in the lighting system having a long LED substrate mounted in a long tube, the longer LED substrate is required the longer the tube becomes, thus bringing up an undesirable cost increase to manufacture such a long LED substrate, and in which the jointing strength of mutual substrates is increased.SOLUTION: An LED substrate of a long band-plate shape is constructed by jointing a plurality of unit substrates. An entrance opening communicating to a jointing end part is provided with a jointing hole narrower than the depth section in one of the unit substrate of the mutual unit substrates to be jointed, and the other unit substrate is provided with a jointing projection to be pressure insertion-engaged with the jointing hole. Both the unit substrates are jointed by insertion-engagement of the jointing hole and the jointing projection and, in that jointing state, electric circuit connections of both the unit substrates are made.

Description

本発明は、多数のLED(発光ダイオード)を配置した長尺帯板状の基板が長尺管体内
に収納されたLED照明装置に関し、特に、複数の単位基板の接続によって長尺帯板状の
基板を構成する場合の単位基板相互の接続技術に関する。
The present invention relates to an LED illuminating device in which a long strip plate-like substrate on which a large number of LEDs (light emitting diodes) are arranged is housed in a long tubular body, and in particular, by connecting a plurality of unit substrates, The present invention relates to a technique for connecting unit substrates in the case of configuring a substrate.

透明プラスチックの円筒パイプ2内に、多数のLED9を配置した長尺の支持板3(L
ED基板)が水平に取り付けられ、この支持板3の両端にそれぞれ2本の端子4、4が接
続され、円筒パイプ2の両端を塞ぐベースキャップ5、5から端子4、4が突設されたも
のがある(特許文献1参照)。
A long support plate 3 (L) in which a large number of LEDs 9 are arranged in a cylindrical pipe 2 made of transparent plastic.
ED board) is mounted horizontally, two terminals 4 and 4 are connected to both ends of the support plate 3, respectively, and terminals 4 and 4 project from base caps 5 and 5 that close both ends of the cylindrical pipe 2. There is a thing (refer patent document 1).

特開2001−351402号公報JP 2001-351402 A

特許文献1のものは、長尺のLED基板が円筒パイプ内に取り付けられたものであるた
め、円筒パイプが長くなればなるほど、長尺のLED基板が必要となり、このような長尺
の基板を作製することはコストアップに繋がり、好ましくない。
Since the thing of patent document 1 is a thing in which a long LED board was attached in the cylindrical pipe, the longer the cylindrical pipe, the longer the LED board is required. Producing it leads to an increase in cost and is not preferable.

本願発明に至る前の先行技術のLED照明装置1として、図8及び図9に示すものがあ
る。これは、多数の白色LED(発光ダイオード)2を配置した長尺のLED基板3が少
なくとも一部が透光性である直管形管体4内の長手方向(管体4の長軸方向)に延在する
よう収納され、従来使用されている直管形蛍光灯照明装置等のソケット部(図示せず)に
嵌合装着される端子部5を備えた端部キャップ6が管体4の左右両端に取り付けられ、端
子部5に半田付けされたリード線7を介してLED2へ所定の電力が供給され、LED2
が発光するものがある。
As the prior art LED lighting device 1 before reaching the present invention, there are those shown in FIGS. This is because the long LED substrate 3 on which a large number of white LEDs (light emitting diodes) 2 are arranged is at least partially translucent in the longitudinal direction in the straight tubular body 4 (long axis direction of the tubular body 4). An end cap 6 having a terminal portion 5 fitted and attached to a socket portion (not shown) of a straight-tube fluorescent lamp lighting device or the like that is housed so as to extend in the conventional manner is used for the tube body 4. Predetermined power is supplied to the LED 2 via the lead wires 7 attached to the left and right ends and soldered to the terminal portion 5.
May emit light.

この場合、LED基板3は、複数の単位基板A、B、Cの接合SSによって長尺帯板状
のLED基板3を構成する方法が採用されるが、この場合、単位基板A、B、C相互の接
合SSを維持すると共に、単位基板A、B、CのLED2の電気回路の接続のために、ジ
ャンパー線Jによって単位基板A、B、Cを接合SSした後、ジャンパー線Jの部分を半
田付けHして、単位基板A、B、C相互の電気的接続を確保する方法が採られていた。
In this case, the LED substrate 3 employs a method in which the long strip plate-like LED substrate 3 is formed by joining SS of a plurality of unit substrates A, B, and C. In this case, the unit substrates A, B, and C are used. While maintaining the mutual junction SS and connecting the unit substrates A, B, and C with the jumper wire J to connect the electrical circuits of the LED 2 of the unit substrates A, B, and C, the jumper wire J portion is A method of securing the electrical connection between the unit substrates A, B, and C by soldering H has been adopted.

この方法で接続した場合は、管体4へこの接合されたLED基板3を収納する際に、単
位基板A、B、C相互が引っ張られる際に、この接合SS箇所が離れて、ジャンパー線J
の半田付けHの箇所が剥がれたり切れたり等すれば、電気的支障が生じる事態が発生する
こととなる。
When connected by this method, when the united board A, B, and C are pulled together when the united LED board 3 is accommodated in the tube 4, the junction SS part is separated and the jumper wire J
If the soldering H part of the solder is peeled off or cut off, an electrical trouble will occur.

また、単位基板A、B、C相互の電気回路に亘るジャンパー線Jを半田付けHする際に
は、単位基板A、B、C相互を接合SSの方向へ押し付けつつジャンパー線Jを取り付け
、その状態で半田付けHの作業を行なう必要があるため、かなり面倒な作業となる。
Further, when soldering the jumper wire J across the electric circuit between the unit substrates A, B, and C, the jumper wire J is attached while pressing the unit substrates A, B, and C in the direction of the junction SS, Since it is necessary to perform the soldering H work in a state, it is a considerably troublesome work.

本発明は、このような点に鑑み、単位基板A、B、C相互の接合SSの状態が維持され
ると共に、単位基板A、B、C相互の電気回路が確保される技術を提供するものである。
In view of such a point, the present invention provides a technique in which the state of the junction SS between the unit substrates A, B, and C is maintained and an electric circuit between the unit substrates A, B, and C is secured. It is.

また、従来使用されていたジャンパー線Jによる接続を止めた場合でも、単位基板A、
B、C相互の接合状態が維持されると共に、単位基板A、B、C相互の電気回路が確保さ
れる技術を提供するものである。
In addition, even when the connection by the jumper wire J that has been conventionally used is stopped, the unit substrate A,
The present invention provides a technique in which the bonding state between B and C is maintained and an electric circuit between unit substrates A, B, and C is secured.

第1発明は、多数のLEDを照明側面に配置した長尺のLED基板が合成樹脂製管体内
の長手方向に延在するよう収納され、ソケット部に嵌合装着される端子部を備えた端部キ
ャップが前記管体の左右両端に取り付けられ、前記端子部を通して前記LEDへ電力が供
給されるLED照明装置において、
前記LED基板は、複数の単位基板の接合端部の接合によって長尺帯板状のLED基板
を構成し、接合される単位基板相互の一方の単位基板には前記接合端部へ連通する入り口
開口が奥部よりも狭い接合孔を備え、他方の単位基板には前記接合孔に嵌合する接合突起
を備え、前記接合孔と前記接合突起との嵌合により前記単位基板相互が接合され、この接
合状態において前記単位基板相互が電気回路接続されたことを特徴とする。
In the first aspect of the present invention, a long LED board in which a large number of LEDs are arranged on the illumination side surface is accommodated so as to extend in the longitudinal direction in the synthetic resin tube, and an end having a terminal portion that is fitted and attached to a socket portion In the LED lighting device in which the part cap is attached to the left and right ends of the tube body, and power is supplied to the LED through the terminal part,
The LED substrate constitutes a long strip plate-like LED substrate by joining the joining end portions of a plurality of unit substrates, and one unit substrate of the unit substrates to be joined has an entrance opening communicating with the joining end portion. Is provided with a joining hole narrower than the inner part, and the other unit substrate is provided with a joining projection that fits into the joining hole, and the unit substrates are joined to each other by fitting the joining hole and the joining projection. The unit substrates are connected to each other in an electric circuit in a bonded state.

第2発明は、第1発明において、前記各単位基板は配線パターンを形成する導電箔が前
記接合端部の面まで形成されており、前記接合端部面まで形成された導電箔部分での半田
付けにより、前記単位基板相互の電気回路接続がされたことを特徴とする。
According to a second aspect of the present invention, in the first aspect, the conductive foil forming the wiring pattern is formed up to the surface of the joining end portion on each unit substrate, and the solder at the conductive foil portion formed up to the joining end portion surface As a result, the unit substrates are electrically connected to each other.

第1発明によって、単位基板相互は、接合孔と接合突起の嵌合によって、分離し難い状
態の接合状態を維持できるため、単位基板相互の電気回路を接続する場合の作業が容易に
なるのみならず、接合箇所が離れて半田付け箇所が剥がれたり切れたり等する虞もなく、
単位基板相互の電気回路の維持が向上する。
According to the first aspect of the present invention, the unit substrates can be maintained in a bonded state that is difficult to separate by fitting the bonding holes and the bonding protrusions. There is no fear that the soldering part will be peeled off or cut off.
Maintenance of the electric circuit between the unit substrates is improved.

第2発明は、第1発明の効果に加えて、単位基板相互の電気回路接続は、接合端部の面
まで形成された導電箔部分において、直接半田付けにて接続することができるものとなる
ため、単位基板相互の接合部分の強度を高める効果が得られる。また、これによって、従
来使用していたジャンパー線を廃止することも可能となる。
In the second invention, in addition to the effects of the first invention, the electric circuit connection between the unit substrates can be directly soldered at the conductive foil portion formed up to the surface of the joining end. Therefore, an effect of increasing the strength of the joint portion between the unit substrates can be obtained. This also makes it possible to eliminate the previously used jumper wires.

本発明に係るLED照明装置の管体内に収納した基板の状態説明図である。It is state explanatory drawing of the board | substrate accommodated in the tubular body of the LED lighting apparatus which concerns on this invention. 図1のY方向から見た管体内に収納したLED基板の状態説明図である。It is a state explanatory drawing of the LED board accommodated in the tubular body seen from the Y direction of FIG. 本発明に係る単位基板相互の接続手段としての接合孔と接合突起との関係が台形状楔の場合の説明図である。It is explanatory drawing in case the relationship between the joining hole and joining protrusion as a connection means between unit substrates which concerns on this invention is a trapezoid wedge. 本発明に係る単位基板相互の接続手段としての接合孔と接合突起との関係が丸形楔の場合の説明図である。It is explanatory drawing in case the relationship between the joining hole as a connection means between unit substrates which concerns on this invention, and a joining protrusion is a round wedge. 本発明に係るLED照明装置の端部キャップと管体との関係を示す断面図である。It is sectional drawing which shows the relationship between the edge part cap and tube of the LED lighting apparatus which concerns on this invention. 図5のA−A断面図である。It is AA sectional drawing of FIG. 本発明に係るLED照明装置の端部キャップ、LED基板及び管体の関係を示す分解斜視図である。It is a disassembled perspective view which shows the relationship between the edge part cap, LED board, and tubular body of the LED lighting apparatus which concerns on this invention. 先行技術に係る単位基板が接続されてLED基板を構成した状態を示す説明図である。It is explanatory drawing which shows the state which connected the unit board | substrate which concerns on a prior art, and comprised the LED board. 図8の単位基板相互の接続箇所の断面図である。It is sectional drawing of the connection location of the unit substrates of FIG.

本発明は、多数のLEDを照明側面に配置した長尺のLED基板が合成樹脂製管体内の
長手方向に延在するよう収納され、ソケット部に嵌合装着される端子部を備えた端部キャ
ップが前記管体の左右両端に取り付けられ、前記端子部を通して前記LEDへ電力が供給
されるLED照明装置において、
前記LED基板は、複数の単位基板の接合端部の接合によって長尺帯板状のLED基板
を構成し、接合される単位基板相互の一方の単位基板には前記接合端部へ連通する入り口
開口が奥部よりも狭い接合孔を備え、他方の単位基板には前記接合孔に嵌合する接合突起
を備え、前記接合孔と前記接合突起との嵌合により前記単位基板相互が接合され、この接
合状態において前記単位基板相互が電気回路接続されたものであり、以下に本発明の実施
例を記載する。
The present invention includes an end portion having a terminal portion that is accommodated so that a long LED substrate in which a large number of LEDs are arranged on an illumination side surface extends in a longitudinal direction in a synthetic resin tubular body and is fitted to a socket portion. In the LED lighting device in which caps are attached to both left and right ends of the tube body, and power is supplied to the LED through the terminal portion,
The LED substrate constitutes a long strip plate-like LED substrate by joining the joining end portions of a plurality of unit substrates, and one unit substrate of the unit substrates to be joined has an entrance opening communicating with the joining end portion. Is provided with a joining hole narrower than the inner part, and the other unit substrate is provided with a joining projection that fits into the joining hole, and the unit substrates are joined to each other by fitting the joining hole and the joining projection. The unit substrates are connected to each other in an electric circuit in a bonded state, and examples of the present invention will be described below.

本発明に係るLED照明装置1は、従来使用されている直管形蛍光灯照明装置の直管形
蛍光灯に代わって、そのソケット(図示せず)に取り付けられるものであるが、これに限
定されず、本発明に係るLED照明装置1を取り付ける専用のソケットを備える照明器具
にも適用可能な照明装置となるものである。
The LED lighting device 1 according to the present invention is attached to a socket (not shown) in place of a straight tube type fluorescent lamp of a conventional straight tube type fluorescent lamp lighting device, but is not limited thereto. It becomes an illuminating device applicable also to a lighting fixture provided with the socket for exclusive use which attaches LED lighting device 1 concerning the present invention.

以下に本発明に係るLED照明装置1を図に基づき説明する。LED照明装置1は、多
数の白色LED(発光ダイオード)2を配置した長尺のLED基板3が少なくとも一部が
透光性である直管形管体4内の長手方向(管体4の長軸方向)に延在するよう収納され、
従来使用されている直管形蛍光灯照明装置等のソケット部(図示せず)に嵌合装着される
端子部5を備えた端部キャップ6が管体4の左右両端に取り付けられ、端子部5に半田付
けされたリード線7を介してLED2へ所定の電力が供給され、LED2が発光するもの
である。
Below, LED lighting device 1 concerning the present invention is explained based on a figure. In the LED lighting device 1, a long LED substrate 3 on which a large number of white LEDs (light emitting diodes) 2 are arranged is at least partially translucent in a longitudinal direction within a straight tube 4 (the length of the tube 4). Stored in the axial direction)
End caps 6 having terminal portions 5 fitted and attached to socket portions (not shown) of a straight tube type fluorescent lamp lighting device or the like that are conventionally used are attached to the left and right ends of the tube body 4, and the terminal portions A predetermined power is supplied to the LED 2 through the lead wire 7 soldered to the LED 5, and the LED 2 emits light.

LED照明装置1は、例えば、部屋の天井等に配置された直管形蛍光灯照明装置等のソ
ケット部(図示せず)に装着して、管体4が略水平状態に支持されるものであり、この状
態で、照明側面3Pが下側に向き、下方を照明するものである。
The LED lighting device 1 is mounted on a socket part (not shown) such as a straight tube fluorescent lamp lighting device arranged on the ceiling of a room, for example, and the tube body 4 is supported in a substantially horizontal state. In this state, the illumination side surface 3P is directed downward and illuminates the lower part.

管体4内には、LED基板3の他にLED駆動用回路基板8が収納されている。LED
基板3は平板状の合成樹脂製であり、その片側面(図2では下側面)が照明側面3Pとな
るように多数のLED2が配置されており、照明側面3Pの反対側となる他方側面(裏面
)には、LED2へ電力供給する電気回路素子を取り付けた平板状のLED駆動用回路基
板8が、LED基板3と並行状態にLED基板3の裏側(図2では上側)に取り付けられ
ている。実施例では図1に示すように、LED照明装置1は、部屋の天井部分等に取り付
けられて下方を照明するものであり、LED基板3の下側面が照明側面3Pとなるように
配置された構成である。
In the tube 4, an LED drive circuit board 8 is housed in addition to the LED board 3. LED
The substrate 3 is made of a flat synthetic resin, and a number of LEDs 2 are arranged so that one side surface (the lower side surface in FIG. 2) becomes the illumination side surface 3P, and the other side surface opposite to the illumination side surface 3P ( On the back surface, a flat LED driving circuit board 8 to which an electric circuit element for supplying power to the LED 2 is attached is attached to the back side (upper side in FIG. 2) of the LED board 3 in parallel with the LED board 3. . In the embodiment, as shown in FIG. 1, the LED illumination device 1 is attached to a ceiling portion of a room and illuminates the lower part, and is arranged so that the lower side surface of the LED substrate 3 becomes the illumination side surface 3P. It is a configuration.

LED基板3の照明側面3Pには、一列に電気的に直列接続された多数のLED2が直
線状に配列される状態でもって、複数列に配置されている。図示のものは、全部で306
個のLED2が3列に所定間隔でもって配置されている。実施例で示すLED照明装置1
は、長さLが略1200mmであり、この長さに対応する長さのLED基板3を1枚の基
板で形成することは、コスト的にもアップするため、実施例では3枚の単位基板A、B、
Cが直列接続されてLED基板3を構成している。このため、単位基板A、B、Cにはそ
れぞれ1列34個のLED2が3列に所定間隔でもって配置された状態であり、単位基板
A、B、Cの各列のLED2は、電気的に直列接続されて、全体として306個のLED
2が3列構成である。
On the illumination side surface 3P of the LED substrate 3, a large number of LEDs 2 electrically connected in series in a row are arranged in a straight line and arranged in a plurality of rows. The total shown is 306
The LEDs 2 are arranged in three rows with a predetermined interval. LED lighting device 1 shown in the embodiment
The length L is approximately 1200 mm, and forming the LED substrate 3 having a length corresponding to this length with a single substrate increases the cost. Therefore, in the embodiment, three unit substrates are used. A, B,
C is connected in series to constitute the LED substrate 3. Therefore, each of the unit boards A, B, and C is in a state where 34 LEDs 2 in one row are arranged in three rows at a predetermined interval, and the LEDs 2 in each row of the unit boards A, B, and C are electrically 306 LEDs connected in series
2 has a three-row configuration.

図1に示す管体4は、LED2の発光の有効透過のために、図7に示すように、略LE
D基板3に対応する位置PLから上方領域4Uを不透明とし、略LED基板3に対応する
位置PLから下方領域4Dが、透明または半透明(着色または乳白色を含む)になった透
光性をなすように、合成樹脂材の押し出し成形または引き抜き成形で形成された円筒状ま
たはそれに近い筒状である。平坦な照明側面3Pに取り付けたLED2の発光による照射
角度は、略120度であるため、平坦な照明側面3Pに取り付けた3列の両端の各列のL
ED2の光の照射角度、及び管体4での反射光を考慮すれば、管体4は、略LED基板3
に対応する位置の下方領域4Dが透光性をなす構成とすればよい。なお、上方領域4Uを
不透明とすれば、LED基板3よりも上方にあるLED駆動用回路基板8、及びそれに取
り付けられた電気回路素子が外部から見えない状態となり、外観上好ましい形態となる。
As shown in FIG. 7, the tube 4 shown in FIG.
The upper region 4U is opaque from the position PL corresponding to the D substrate 3, and the lower region 4D from the position PL substantially corresponding to the LED substrate 3 is translucent or translucent (including colored or milky white). Thus, it is a cylindrical shape formed by extrusion molding or pultrusion molding of a synthetic resin material, or a cylindrical shape close thereto. Since the irradiation angle by the light emission of the LED 2 attached to the flat illumination side surface 3P is approximately 120 degrees, L in each row at both ends of the three rows attached to the flat illumination side surface 3P.
Considering the irradiation angle of the light of the ED 2 and the reflected light from the tube 4, the tube 4 is substantially the LED substrate 3.
The lower region 4D at a position corresponding to the above may be configured to be translucent. If the upper region 4U is opaque, the LED driving circuit board 8 above the LED board 3 and the electric circuit elements attached thereto are invisible from the outside, which is a preferable form in appearance.

管体4の両端部に取り付けた端部キャップ6の端子部5は、それぞれ2本のピンを備え
たものであるが、これは従来使用されている直管形蛍光灯照明装置のソケット部(図示せ
ず)に嵌合装着されるための構成となっているためである。
The terminal portions 5 of the end caps 6 attached to both ends of the tube body 4 are each provided with two pins. This is a socket portion of a conventionally used straight tube fluorescent lamp illumination device ( This is because it is configured to be fitted and attached to a not-shown).

図6に示すように、端部キャップ6は、円筒状の管体4に合わせるために、電気絶縁材
である合成樹脂材でもって円筒状に形成されている。端子部5は、電気絶縁材の端子支持
部材14に取り付けられた状態で、端子側プラグ11Bを備えたリード線7の一端と半田
付けにて接続される。図6に示すように、端部キャップ6への端子支持部材14の取り付
けは、端子支持部材14の延長部が端部キャップ6の外側端の環状取り付け部6Aに当接
する状態で、端子支持部材14と一体に組み合わせたカップ状の金属製外観部材14Aが
、環状取り付け部6Aの外面に接着にて行なわれる。
As shown in FIG. 6, the end cap 6 is formed in a cylindrical shape with a synthetic resin material which is an electrical insulating material in order to match the cylindrical tube body 4. The terminal portion 5 is connected to one end of the lead wire 7 provided with the terminal-side plug 11B by soldering in a state where the terminal portion 5 is attached to the terminal support member 14 made of an electrical insulating material. As shown in FIG. 6, the terminal support member 14 is attached to the end cap 6 with the extension of the terminal support member 14 in contact with the annular mounting portion 6 </ b> A at the outer end of the end cap 6. A cup-shaped metal appearance member 14A integrally combined with 14 is bonded to the outer surface of the annular mounting portion 6A.

LED照明装置1の両端の端子部5へ供給される商用交流電力ACによって、LED2
が発光するようにするために、LED2へ電力供給する電気回路素子を取り付けたLED
駆動用回路基板8が設けられている。LED基板3及びLED駆動用回路基板8には、左
右の端子部5に接続されたリード線7側の端子側プラグ11Bと接続される基板側プラグ
11Aが取り付けられている。これらの基板側プラグ11Aと端子側プラグ11Bが接続
された状態で、左右の端子部5からリード線7を介して商用交流電力ACが、LED駆動
用回路基板8の電気回路素子に供給される配線となっている。この電気回路素子として、
LED駆動用回路基板8には、この左右の端子部5からリード線7を介して供給される商
用交流電力ACを整流して所定の直流DCとするための整流回路を含むAC/DC変換回
路部9と、AC/DC変換回路部9から供給される直流DCを所定電圧としてLED2に
供給する電圧制御部10を備えている。
LED 2 is supplied by commercial AC power AC supplied to terminal portions 5 at both ends of LED lighting device 1.
LED with an electric circuit element that supplies power to LED 2 in order to emit light
A driving circuit board 8 is provided. A board-side plug 11A connected to the terminal-side plug 11B on the lead wire 7 side connected to the left and right terminal portions 5 is attached to the LED board 3 and the LED drive circuit board 8. With these board-side plug 11A and terminal-side plug 11B connected, commercial AC power AC is supplied from the left and right terminal portions 5 to the electric circuit elements of the LED drive circuit board 8 via the lead wires 7. It is wiring. As this electric circuit element,
The LED drive circuit board 8 includes an AC / DC conversion circuit including a rectification circuit for rectifying the commercial AC power AC supplied from the left and right terminal portions 5 via the lead wires 7 to obtain a predetermined DC voltage. Unit 9 and a voltage control unit 10 that supplies the direct current DC supplied from the AC / DC conversion circuit unit 9 to the LED 2 as a predetermined voltage.

図5〜図7に示すように、LED基板3を円筒状の管体4内に支持するために、円筒状
の管体4の内面対向位置には、管体4の長さ方向(管4の軸方向)へ延びた相対向する一
対の支持溝4Aが、管体4の形成と同時に形成されている。一対の支持溝4Aは、それぞ
れ管体4の長さ方向(管4の軸方向)へ延びた対向する一対のリブ4B、4B間に形成さ
れており、一対のリブ4B、4Bの間隔は、LED基板3の厚さよりも若干大きい寸法の
間隔を存して、管体4の成形と同時に、管体4の全長に亘って形成されている。LED基
板3は、管体4の開口端から一対の支持溝4Aに挿入され支持される。
As shown in FIGS. 5 to 7, in order to support the LED substrate 3 in the cylindrical tube body 4, there is a length direction of the tube body 4 (tube 4) at a position facing the inner surface of the cylindrical tube body 4. A pair of opposed support grooves 4 </ b> A extending in the axial direction) is formed simultaneously with the formation of the tube body 4. The pair of support grooves 4A is formed between a pair of opposing ribs 4B and 4B extending in the length direction of the tube body 4 (the axial direction of the tube 4), and the interval between the pair of ribs 4B and 4B is as follows. The tube body 4 is formed over the entire length of the tube body 4 at the same time as the tube body 4 is formed with a space slightly larger than the thickness of the LED substrate 3. The LED substrate 3 is inserted into and supported by the pair of support grooves 4A from the opening end of the tube body 4.

LED駆動用回路基板8を裏側に取り付けたLED基板3は、図7に示すように、管体
4の一端開口からLED基板3の長手方向に沿った両端部3Aを管体4内の一対の支持溝
4Aにスライドにて挿入し、LED基板3を管体4内に収納する。この収納状態において
、端部キャップ6の環状取り付け部6Bを管体4の左右の開口端部に挿入し、管体4の左
右の開口端部が端部キャップ6の環状フランジ6Cに当接した位置に端部キャップ6が取
り付けられる。この取り付けを達成するために、端部キャップ6の環状取り付け部6Bに
は、一対のリブ4B、4Bが挿入される切り欠き6Dが形成されている。
As shown in FIG. 7, the LED board 3 with the LED drive circuit board 8 attached to the back side has a pair of ends 3 </ b> A along the longitudinal direction of the LED board 3 from one end opening of the pipe body 4. The LED substrate 3 is accommodated in the tube body 4 by slidingly inserted into the support groove 4A. In this stored state, the annular mounting portions 6B of the end cap 6 are inserted into the left and right open ends of the tube body 4, and the left and right open end portions of the tube body 4 are in contact with the annular flange 6C of the end cap 6. An end cap 6 is attached to the position. In order to achieve this attachment, the annular attachment portion 6B of the end cap 6 is formed with a notch 6D into which the pair of ribs 4B and 4B are inserted.

管体4の左右の開口端部への端部キャップ6の取り付けにおいて、管体4内の一対の支
持溝4Aに挿入支持されたLED基板3が、管体4内の所定位置に収まり位置決めされる
ようにするために、切り欠き6Dの中央部には、基板ストッパ部6Eが端部キャップ6に
形成されている。これによって、管体4の左右の開口端部への端部キャップ6の取り付け
によって、LED基板3が管体4の左右のいずれかの方向へずれておれば、図6に示すよ
うに、LED基板3の長尺方向の端部3Bが基板ストッパ部6Eに当接して、LED基板
3が管体4の左右の中央位置へ位置決めされる状態となる。この位置決めは、LED2の
発光が、管体4の全長から均一に得られるようにするために有効である。
When the end caps 6 are attached to the left and right opening ends of the tube body 4, the LED substrate 3 inserted and supported in the pair of support grooves 4 </ b> A in the tube body 4 is placed in a predetermined position in the tube body 4 and positioned. For this purpose, a substrate stopper 6E is formed on the end cap 6 at the center of the notch 6D. Thus, if the LED substrate 3 is displaced in either the left or right direction of the tube body 4 by attaching the end caps 6 to the left and right opening ends of the tube body 4, as shown in FIG. The end 3 </ b> B in the longitudinal direction of the substrate 3 contacts the substrate stopper 6 </ b> E, and the LED substrate 3 is positioned at the left and right central positions of the tube body 4. This positioning is effective so that the light emission of the LED 2 can be obtained uniformly from the entire length of the tube body 4.

図5及び図6に示すように、端部キャップ6の内側には、環状取り付け部6Bで囲まれ
た内方領域には、環状取り付け部6Bから突出しない範囲で、リード線7の途中を屈曲係
止する係止部15を備え、この屈曲係止によってリード線7と端子部5との半田付け箇所
へ掛かるリード線7の引っ張りや撓み等の作用力を吸収するようにしている。
As shown in FIG. 5 and FIG. 6, inside the end cap 6, the inner region surrounded by the annular mounting portion 6 </ b> B is bent in the middle of the lead wire 7 so as not to protrude from the annular mounting portion 6 </ b> B. An engaging portion 15 for engaging is provided, and by this bending engagement, acting force such as pulling or bending of the lead wire 7 applied to the soldered portion between the lead wire 7 and the terminal portion 5 is absorbed.

係止部15は、向かい合った一対の第1係止部15A、15Aと、第2係止部15B、
15Bによって構成している。第1係止部15A、15Aは、端部キャップ6内の内外隔
壁16に形成した孔16Aの端部で形成され、この孔16Aに臨むように第2係止部15
B、15Bが形成されている。このため、端子部5から延びた2本のリード線7は、それ
ぞれ孔16Aの近傍で内外隔壁16を貫通して第2係止部15B、15Bに係止するよう
に屈曲した後、端子側プラグ11Bへ延びる。この状態で、2本のリード線7はそれぞれ
第1係止部15A、15Aに係止すると共に孔16Aに一部が侵入する状態で、第2係止
部15B、15Bに係止した状態となる。第1係止部15A、15Aと、第2係止部15
B、15Bへのリード線7の係止は、第2係止部15B、15B間からリード線7を屈曲
させつつ挿入係止することによって達成できる。
The locking portion 15 includes a pair of first locking portions 15A and 15A facing each other, a second locking portion 15B,
15B. The first locking portions 15A and 15A are formed at the end portions of the holes 16A formed in the inner and outer partition walls 16 in the end cap 6, and the second locking portions 15 so as to face the holes 16A.
B and 15B are formed. Therefore, the two lead wires 7 extending from the terminal portion 5 are bent so as to pass through the inner and outer partition walls 16 in the vicinity of the holes 16A and to be locked to the second locking portions 15B and 15B, respectively. It extends to the plug 11B. In this state, the two lead wires 7 are locked to the first locking portions 15A and 15A, respectively, and are partially locked into the holes 16A and locked to the second locking portions 15B and 15B. Become. The first locking portions 15A, 15A and the second locking portion 15
B and 15B can be locked by inserting and locking the lead wire 7 while bending the lead wire 7 from between the second locking portions 15B and 15B.

リード線7は、第2係止部15B、15B間からリード線7を図6のように屈曲させつ
つ、第1係止部15A、15Aと、第2係止部15B、15Bへ挿入係止することによっ
て、リード線7の係止が達成できる。
The lead wire 7 is inserted and locked to the first locking portions 15A and 15A and the second locking portions 15B and 15B while bending the lead wire 7 between the second locking portions 15B and 15B as shown in FIG. By doing so, locking of the lead wire 7 can be achieved.

上記のように構成される長尺のLED基板3は、長尺の管体4内の一対の支持溝4Aに
支持されるが、管体4が長くなればなるほど、長尺のLED基板3が必要となり、このよ
うな長尺のLED基板3を作製することはコストアップに繋がり、好ましくない。これを
解決するために、本発明は、複数の単位基板の接合によって長尺帯板状のLED基板3を
構成する。以下に、単位基板をA、B、Cの3枚で構成した実施例の具体的な構成を説明
する。
The long LED substrate 3 configured as described above is supported by a pair of support grooves 4A in the long tubular body 4, but the longer the tubular body 4, the longer the long LED substrate 3 becomes. Therefore, it is not preferable to produce such a long LED substrate 3 because it leads to an increase in cost. In order to solve this, in the present invention, a long strip plate-like LED substrate 3 is configured by joining a plurality of unit substrates. Hereinafter, a specific configuration of the embodiment in which the unit substrate is configured by three pieces of A, B, and C will be described.

LED基板3は、複数の単位基板A、B、Cの接合によって長尺帯板状のLED基板3
が構成され、接合される単位基板(例えばA、Bとする)相互の一方の単位基板(例えば
A)には接合端部へ連通開口した入り口開口Eが奥部Fよりも狭い接合孔Gを備え、他方
の単位基板(例えばB)には、接合孔Gに圧入嵌合する接合突起Mを備えている。単位基
板(例えばA、Bとする)相互の接続手段としての接合孔Gと接合突起Mとして、図3に
は、台形状楔の形態を示しており、図4には、丸形楔の形態を示している。
The LED substrate 3 is a long strip plate-like LED substrate 3 by joining a plurality of unit substrates A, B, and C.
The unit substrate to be bonded (for example, A and B) has a bonding hole G in which one of the unit substrates (for example, A) is connected to the bonding end portion and the entrance opening E is narrower than the depth F. The other unit substrate (for example, B) is provided with a joining projection M that is press-fitted into the joining hole G. FIG. 3 shows a trapezoidal wedge shape and FIG. 4 shows a round wedge shape as a joint hole G and a joint projection M as connection means between unit substrates (for example, A and B). Is shown.

このように形成された状態で、一方の単位基板(例えばA)の接合孔Gに対して、他方
の単位基板(例えばB)の接合突起Mを上方から重ねるように対応させた状態で、接合突
起Mを接合孔Gに指で押し圧して押し込む。これによって接合突起Mと接合孔Gが嵌合し
、一方の単位基板(例えばA)の接合端部面TMと、他方の単位基板(例えばB)の接合
端部面TMが接触状態となり、一方の単位基板(例えばA)と他方の単位基板(例えばB
)が接合される。
In the state formed in this way, the bonding is performed in a state in which the bonding protrusion M of the other unit substrate (for example, B) is made to overlap the bonding hole G of the other unit substrate (for example, A) from above. The protrusion M is pressed into the joint hole G with a finger. As a result, the bonding protrusion M and the bonding hole G are fitted, and the bonding end surface TM of one unit substrate (for example, A) and the bonding end surface TM of the other unit substrate (for example, B) are brought into contact with each other. Unit substrate (for example, A) and the other unit substrate (for example, B)
) Are joined.

この接合状態において、一方の単位基板(例えばA)の各列のLED2の配線パターン
の導電箔DHと、他方の単位基板(例えばB)の各列のLED2の配線パターンの導電箔
DHとが、電気的に接続される。この電気的接続は、図9に示すようにジャンパー線Jと
半田付けHにて行なうことができるが、接合突起Mと接合孔Gの嵌合が確保されているた
め、ジャンパー線Jを廃止することもできる。実施例の導電箔DHは、銅箔で形成してい
る。
In this bonded state, the conductive foil DH of the wiring pattern of the LED 2 in each column of one unit substrate (for example, A) and the conductive foil DH of the wiring pattern of the LED 2 in each column of the other unit substrate (for example, B) are Electrically connected. This electrical connection can be made by jumper wire J and soldering H as shown in FIG. 9, but since the fitting between the joint protrusion M and the joint hole G is ensured, the jumper wire J is abolished. You can also The conductive foil DH of the example is formed of a copper foil.

本発明では、単位基板A、B、C相互の接合部分の電気的接続が十分となる構成によっ
て、このジャンパー線Jを全く省略しても、十分な電気的接続が維持できる構成を提案し
ている。以下この構成を説明する。
In the present invention, a configuration is proposed in which sufficient electrical connection can be maintained even if this jumper wire J is omitted at all by the configuration in which the electrical connection of the junctions between the unit substrates A, B, and C is sufficient. Yes. This configuration will be described below.

一方の単位基板(例えばA)の各列のLED2の配線パターンの導電箔DHは、図3及
び図4に示すように、接合端部にまで延びた接合端部分DH1を形成している。また、他
方の単位基板(例えばB)の各列のLED2の配線パターンの導電箔DHは、図3及び図
4に示すように、接合端部にまで延びた接合端部分DH2を形成している。この導電箔D
Hの双方の接合端部分DH1とDH2は、配線パターンの導電箔DHが形成されたLED
基板3の裏側(照明側面3Pの反対側)のみでもよい。この場合は、接合突起Mと接合孔
Gが嵌合して一方の単位基板(例えばA)と他方の単位基板(例えばB)とが接合された
状態で、近接または接触状態となる導電箔DHの接合端部分DH1とDH2とを、図2に
示すように半田付けHにて接続する。
As shown in FIGS. 3 and 4, the conductive foil DH of the wiring pattern of the LEDs 2 in each column of one unit substrate (for example, A) forms a joint end portion DH1 extending to the joint end. Further, the conductive foil DH of the wiring pattern of the LED 2 in each column of the other unit substrate (for example, B) forms a junction end portion DH2 extending to the junction end as shown in FIGS. . This conductive foil D
Both joint end portions DH1 and DH2 of H are LEDs on which a conductive foil DH having a wiring pattern is formed.
Only the back side of the substrate 3 (the side opposite to the illumination side surface 3P) may be used. In this case, the conductive foil DH that is in the proximity or contact state in a state in which the bonding protrusion M and the bonding hole G are fitted and one unit substrate (for example, A) and the other unit substrate (for example, B) are bonded to each other. The joining end portions DH1 and DH2 are connected by soldering H as shown in FIG.

本発明では、一方の単位基板(例えばA)と他方の単位基板(例えばB)との接合強度
アップの手段として、図3に一部拡大として示すように、一方の単位基板(例えばA)の
導電箔DHの端部分DH1は、一方の単位基板(例えばA)の接合端部面TMから照明側
面3Pに一部が掛かるように、接合端部面TMを覆うように形成し、接合端部面TMを覆
う部分に窪みKを形成する状態である。また、他方の単位基板(例えばB)の導電箔DH
の端部分DH2は、他方の単位基板(例えばB)の接合端部面TMから照明側面3Pに一
部が掛かるように、接合端部面TMを覆うように形成し、接合端部面TMを覆う部分に窪
みKを形成する状態である。このような形態は、一方の単位基板(例えばA)と他方の単
位基板(例えばB)との接合端部面TMに、導電箔DHの一部分が存在するスルーホール
が窪みKによって形成された状態となる。
In the present invention, as a means for increasing the bonding strength between one unit substrate (for example, A) and the other unit substrate (for example, B), as shown in FIG. The end portion DH1 of the conductive foil DH is formed so as to cover the joint end surface TM so that a part of the unit substrate (for example, A) is joined to the illumination side surface 3P from the joint end surface TM. This is a state in which a depression K is formed in a portion covering the surface TM. Also, the conductive foil DH of the other unit substrate (for example, B)
The end portion DH2 of the other unit substrate (for example, B) is formed so as to cover the joint end surface TM so that a part of the end surface DH2 covers the illumination side surface 3P from the joint end surface TM of the other unit substrate (for example, B). This is a state in which the depression K is formed in the covered portion. In such a form, a through hole in which a part of the conductive foil DH exists is formed by the depression K in the joint end surface TM between one unit substrate (for example, A) and the other unit substrate (for example, B). It becomes.

この構成によって、接合突起Mと接合孔Gが嵌合して一方の単位基板(例えばA)と他
方の単位基板(例えばB)とが接合された状態で、近接または接触状態となる導電箔DH
の接合端部分DH1とDH2とを半田付けHする。このとき一方の単位基板(例えばA)
と他方の単位基板(例えばB)の接合端部面TMの窪みKに半田Hが流れ込み、窪みK内
でも半田付けHがなされる状態となり、接合端部分DH1とDH2とが半田Hによって広
範囲に接合される。このため、一方の単位基板(例えばA)と他方の単位基板(例えばB
)の接合部分の強度が増し、この接合部分の補強効果が得られるものとなる。この構成に
よって、ジャンパー線Jを廃止しても、電気的接続の維持が十分なものとなる。
With this configuration, the conductive foil DH that is in the proximity or contact state in a state in which the joining protrusion M and the joining hole G are fitted and one unit substrate (for example, A) and the other unit substrate (for example, B) are joined.
The joining end portions DH1 and DH2 are soldered H. At this time, one unit substrate (for example, A)
The solder H flows into the depression K on the joining end surface TM of the other unit substrate (for example, B), and the soldering H is performed in the depression K, so that the joining end portions DH1 and DH2 are spread over a wide range by the solder H. Be joined. For this reason, one unit substrate (for example, A) and the other unit substrate (for example, B)
) Increases the strength of the joined portion, and the reinforcing effect of the joined portion can be obtained. With this configuration, even if the jumper wire J is abolished, the electrical connection can be sufficiently maintained.

上記では、単位基板(例えばA、Bとする)相互の接合形態を図3及び図4に示してい
るが、一方の単位基板(例えばA)に入り口開口Eが奥部Fよりも狭い接合孔Gを備え、
他方の単位基板(例えばB)に接合孔Gに圧入嵌合する接合突起Mを備える構成を基本と
すれば、図3及び図4に示している形態に拘らず、他の形態とすることもできる。また、
単位基板B、C相互の接合形態も、上記同様である。
In the above description, the unit substrate (for example, A and B) is shown in FIG. 3 and FIG. 4, but the entrance opening E is narrower than the depth F in one unit substrate (for example, A). With G,
If it is based on the structure provided with the joint protrusion M press-fitted into the joint hole G on the other unit substrate (for example, B), it may be in another form regardless of the form shown in FIGS. it can. Also,
The bonding form between the unit substrates B and C is the same as described above.

本発明に係るLED照明装置1は、上記実施例に示した直管形LED照明装置1の構成
に限らず、本発明の技術範囲において種々の構成のLED照明装置を包含するものである
The LED lighting device 1 according to the present invention is not limited to the configuration of the straight tube LED lighting device 1 shown in the above embodiment, but includes LED lighting devices having various configurations within the technical scope of the present invention.

1・・・・・LED照明装置
2・・・・・LED
3・・・・・LED基板
3A・・・・LED基板3の長手方向に沿った両端部
3B・・・・LED基板3の長手方向端部
3P・・・・照明側面
4・・・・・管体
4A・・・・溝
4B・・・・リブ
5・・・・・端子部
6・・・・・端部キャップ
6A・・・・環状取り付け部
6B・・・・環状取り付け部
6C・・・・環状フランジ
6D・・・・切り欠き
6E・・・・ストッパ部
7・・・・・リード線
8・・・・・LED駆動用回路基板
9・・・・・AC/DC変換回路部
10・・・・電圧制御部
11A・・・基板側プラグ
11B・・・端子側プラグ
14・・・・端子支持部材
14A・・・金属製外観部材
15・・・・係止部
15A・・・第1係止部
15B・・・第2係止部
16・・・・隔壁
16A・・・孔
A、B、C・・・単位基板
E・・・・・入り口開口
F・・・・・奥部
G・・・・・接合孔
H・・・・・半田または半田付け
J・・・・・ジャンパー線
M・・・・・接合突起
DH・・・・導電箔
DH1とDH2・・・・接合端部分
K・・・・・窪み
TM・・・・接合端部面
1 ... LED lighting device 2 ... LED
3... LED board 3 A... Both end portions along the longitudinal direction of LED substrate 3 3 B... Longitudinal end portion 3 P of LED substrate 3. Tube 4A ... groove 4B ... rib 5 ... terminal 6 ... end cap 6A ... annular mounting 6B ... annular mounting 6C ...・ ・ Annular flange 6D ・ ・ ・ ・ Notch 6E ・ ・ ・ ・ Stopper 7 ・ ・ ・ Lead wire 8 ・ ・ ・ LED drive circuit board 9 ・ ・ ・ AC / DC conversion circuit 10 ..... Voltage control part 11A ... Board side plug 11B ... Terminal side plug 14 ... Terminal support member 14A ... Metal appearance member 15 ... Locking part 15A ... No. 1 latching part 15B ... 2nd latching part 16 ... partition 16A ... hole A, B, C ... single Board E ... Entrance opening F ... Back G ... Joint hole H ... Solder or soldering J ... Jumper wire M ... Join Protrusion DH ··· Conductive foil DH1 and DH2 ··· Joint end portion K ··· Depression TM ··· Joint end surface

Claims (2)

多数のLEDを照明側面に配置した長尺のLED基板が合成樹脂製管体内の長手方向に
延在するよう収納され、ソケット部に嵌合装着される端子部を備えた端部キャップが前記
管体の左右両端に取り付けられ、前記端子部を通して前記LEDへ電力が供給されるLE
D照明装置において、
前記LED基板は、複数の単位基板の接合端部の接合によって長尺帯板状のLED基板
を構成し、接合される単位基板相互の一方の単位基板には前記接合端部へ連通する入り口
開口が奥部よりも狭い接合孔を備え、他方の単位基板には前記接合孔に嵌合する接合突起
を備え、前記接合孔と前記接合突起との嵌合により前記単位基板相互が接合され、この接
合状態において前記単位基板相互が電気回路接続されたことを特徴とするLED照明装置
A long LED substrate having a large number of LEDs arranged on the side surface of the illumination is accommodated so as to extend in the longitudinal direction in the synthetic resin tube, and an end cap having a terminal portion fitted and attached to a socket portion is the tube. LE attached to the left and right ends of the body and supplying power to the LED through the terminal portion
In the D lighting device,
The LED substrate constitutes a long strip plate-like LED substrate by joining the joining end portions of a plurality of unit substrates, and one unit substrate of the unit substrates to be joined has an entrance opening communicating with the joining end portion. Is provided with a joining hole narrower than the inner part, and the other unit substrate is provided with a joining projection that fits into the joining hole, and the unit substrates are joined to each other by fitting the joining hole and the joining projection. An LED lighting apparatus, wherein the unit substrates are connected to each other in an electric circuit in a bonded state.
前記各単位基板は配線パターンを形成する導電箔が前記接合端部面まで形成されており
、前記接合端部面まで形成された導電箔部分での半田付けにより、前記単位基板相互の電
気回路接続がされたことを特徴とする請求項1に記載のLED照明装置。
Each unit substrate has a conductive foil that forms a wiring pattern formed up to the joint end surface, and the unit substrates are connected to each other by soldering at the conductive foil portion formed up to the joint end surface. The LED lighting device according to claim 1, wherein:
JP2010170295A 2010-07-29 2010-07-29 Led lighting system Pending JP2012033321A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010170295A JP2012033321A (en) 2010-07-29 2010-07-29 Led lighting system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010170295A JP2012033321A (en) 2010-07-29 2010-07-29 Led lighting system

Publications (1)

Publication Number Publication Date
JP2012033321A true JP2012033321A (en) 2012-02-16

Family

ID=45846531

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010170295A Pending JP2012033321A (en) 2010-07-29 2010-07-29 Led lighting system

Country Status (1)

Country Link
JP (1) JP2012033321A (en)

Cited By (7)

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JP2014022267A (en) * 2012-07-20 2014-02-03 Toshiba Lighting & Technology Corp Led module, tube type lamp, and luminaire
WO2014069089A1 (en) * 2012-11-02 2014-05-08 シャープ株式会社 Light source device
JP2014143111A (en) * 2013-01-24 2014-08-07 Stanley Electric Co Ltd LED module
JP2015056309A (en) * 2013-09-12 2015-03-23 ミネベア株式会社 Luminaire
JP2015065084A (en) * 2013-09-25 2015-04-09 パナソニックIpマネジメント株式会社 Light source for lighting and lighting device
US10914438B2 (en) * 2015-10-26 2021-02-09 Jeremy P. Hoffman LED light linear strip, mounting structure and clip assembly
JP2021150153A (en) * 2020-03-18 2021-09-27 シャープ株式会社 Light source device

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014022267A (en) * 2012-07-20 2014-02-03 Toshiba Lighting & Technology Corp Led module, tube type lamp, and luminaire
WO2014069089A1 (en) * 2012-11-02 2014-05-08 シャープ株式会社 Light source device
CN104769352A (en) * 2012-11-02 2015-07-08 夏普株式会社 Light source device
JP5859140B2 (en) * 2012-11-02 2016-02-10 シャープ株式会社 Light source device
JP2016035936A (en) * 2012-11-02 2016-03-17 シャープ株式会社 Light source device
JP2014143111A (en) * 2013-01-24 2014-08-07 Stanley Electric Co Ltd LED module
JP2015056309A (en) * 2013-09-12 2015-03-23 ミネベア株式会社 Luminaire
JP2015065084A (en) * 2013-09-25 2015-04-09 パナソニックIpマネジメント株式会社 Light source for lighting and lighting device
US10914438B2 (en) * 2015-10-26 2021-02-09 Jeremy P. Hoffman LED light linear strip, mounting structure and clip assembly
JP2021150153A (en) * 2020-03-18 2021-09-27 シャープ株式会社 Light source device
JP7379229B2 (en) 2020-03-18 2023-11-14 シャープ株式会社 light source device

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