JP2019087658A - LED module - Google Patents
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- JP2019087658A JP2019087658A JP2017215475A JP2017215475A JP2019087658A JP 2019087658 A JP2019087658 A JP 2019087658A JP 2017215475 A JP2017215475 A JP 2017215475A JP 2017215475 A JP2017215475 A JP 2017215475A JP 2019087658 A JP2019087658 A JP 2019087658A
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Abstract
Description
ＬＥＤモジュール
本発明は、複数のＬＥＤを実装した回路基板の配線を抵抗等で跨ぐＬＥＤモジュールに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED module in which a wiring of a circuit board on which a plurality of LEDs are mounted is straddled by a resistor or the like.
様々な電子部品を搭載したプリント基板では、２本の配線をショートさせないため、表面実装用の抵抗（以下「ジャンパー抵抗」という）を使用して、一方の配線が他方の配線を跨ぐことがある。同様に、多数のＬＥＤが実装され、放熱性が高く、発光面側だけに配線が設けられているＬＥＤモジュール用の回路基板でも、ジャンパー抵抗で配線を跨ぐことがある（例えば、特許文献１の図２）。 In a printed circuit board on which various electronic components are mounted, one wiring may cross the other wiring using a surface mounting resistor (hereinafter referred to as “jumper resistance”) in order to prevent shorting of the two wirings. . Similarly, even in a circuit board for an LED module in which a large number of LEDs are mounted, the heat dissipation is high, and the wiring is provided only on the light emitting surface side, the wiring may be straddled by the jumper resistance (for example, Figure 2).
ＬＥＤモジュールは、回路基板がＬＥＤの発熱により高温となるため、通常のプリント基板に比べ動作時の条件が厳しくなりやすい。このようななかで、ジャンパー抵抗を備えたＬＥＤモジュールを温度サイクル試験に投入したところ、シャンパー抵抗の半田接続部にクラックが入り、不点灯となる不具合が発生した。 In the LED module, the circuit board is heated to a high temperature due to the heat generation of the LED, so the operating condition is likely to be severer than that of a normal printed circuit board. Under such circumstances, when an LED module provided with a jumper resistance was put into a temperature cycle test, a crack was formed in the solder connection portion of the champagne resistance, and a problem of non-lighting occurred.
そこで、本発明は、上記課題に鑑みてなされたものであり、一部のジャンパー抵抗の半田接続部にクラックが発生しても、不点灯となりにくいＬＥＤモジュールを提供することを目的とする。 Then, this invention is made in view of the said subject, and even if a crack generate | occur | produces in the solder connection part of one part jumper resistance, it aims at providing the LED module which becomes difficult to become unlit.
上記目的を達成するため、本発明のＬＥＤモジュールは、上面に配線が形成されるとともに複数のＬＥＤが実装された回路基板を含むＬＥＤモジュールにおいて、第１ジャンパー抵抗と第２ジャンパー抵抗を含み、前記第１ジャンパー抵抗と前記第２ジャンパー抵抗は、前記回路基板の前記上面で並列接続し、１つの配線を跨ぎ、それぞれの長手方向が互いにほぼ直交することを特徴とする。 In order to achieve the above object, an LED module according to the present invention includes a first jumper resistor and a second jumper resistor in an LED module including a circuit board having a wiring formed on the upper surface and a plurality of LEDs mounted thereon, The first jumper resistor and the second jumper resistor are connected in parallel at the upper surface of the circuit board, straddling one wire, and longitudinal directions of the wires are substantially orthogonal to each other.
本発明のＬＥＤモジュールに含まれる回路基板の上面には、複数のＬＥＤが実装されている。各ＬＥＤは、回路基板の上面に形成された配線と接続している。さらに、この回路基板の上面には、第１ジャンパー抵抗と第２ジャンパー抵抗が実装される。第１ジャンパー抵抗と第２ジャンパー抵抗は、並列接続するとともに、１つの配線を跨ぎ、平面視したとき長手方向が直交している。 A plurality of LEDs are mounted on the top surface of the circuit board included in the LED module of the present invention. Each LED is connected to a wire formed on the top surface of the circuit board. Further, on the top surface of the circuit board, a first jumper resistor and a second jumper resistor are mounted. The first jumper resistor and the second jumper resistor are connected in parallel, straddle one wire, and the longitudinal directions are orthogonal to each other in plan view.
回路基板の縦方向と横方向で熱膨張率が異なる場合、例えば、第１ジャンパー抵抗の長手方向が熱膨張率の小さい方向に対し平行で、第２ジャンパー抵抗の長手方向が熱膨張率の大きい方向と平行であるとすると、温度サイクル試験のように熱膨張と熱収縮が繰り返されると、第２ジャンパー抵抗の方が第１ジャンパー抵抗より半田接続部にクラックが入り易くなる。言い換えると、温度サイクル試験等において、第２ジャンパー抵抗に接続不良が生じても、第１ジャンパー抵抗に接続不良が起こらない状態が生じる。 When the coefficient of thermal expansion differs between the longitudinal direction and the lateral direction of the circuit board, for example, the longitudinal direction of the first jumper resistor is parallel to the direction with a smaller coefficient of thermal expansion and the longitudinal direction of the second jumper resistor has a larger coefficient of thermal expansion Assuming that it is parallel to the direction, when thermal expansion and thermal contraction are repeated as in a temperature cycle test, the second jumper resistor is more likely to crack in the solder connection than the first jumper resistor. In other words, even if a connection failure occurs in the second jumper resistance in a temperature cycle test or the like, a state in which the connection failure does not occur in the first jumper resistance occurs.
前記回路基板は、金属又はセラミックを用いても良い。 The circuit board may use metal or ceramic.
前記回路基板は、上面に１層構造の配線が形成されていても良い。 The circuit board may have a single-layer wiring formed on the top surface.
前記複数のＬＥＤは、第１ＬＥＤ列と、前記第１ＬＥＤ列とは電気的に接続しない第２ＬＥＤ列とを備えていても良い。 The plurality of LEDs may include a first LED string and a second LED string that is not electrically connected to the first LED string.
前記第１ＬＥＤ列と前記第２ＬＥＤ列は、発光色が異なっていても良い。 The first LED array and the second LED array may have different emission colors.
本発明のＬＥＤモジュールは、回路基板の熱膨張率が縦方向と横方向で異なる場合、熱膨張と熱収縮が繰り返された結果、並列接続されるとともに直交配置された２つのシャンパー抵抗のうち一方の接続部だけにクラックが入ったとしても、他方のシャンパー抵抗は高い確率で接続不良を起こさない。したがって、本発明のＬＥＤモジュールは、熱膨張と熱収縮が繰り返されても不点灯となりにくい。 In the LED module according to the present invention, when the thermal expansion coefficients of the circuit board are different in the longitudinal direction and the lateral direction, as a result of repeated thermal expansion and thermal contraction, one of two shunt resistances connected in parallel and orthogonally arranged Even if there is a crack only in the connection part of the above, the other champagne resistance does not cause a connection failure with high probability. Therefore, the LED module of the present invention is unlikely to be unlit even if thermal expansion and contraction are repeated.
以下、図１〜６を参照しながら本発明の好適な実施形態について詳細に説明する。なお、図面の説明において、同一又は相当要素には同一の符号を付し、重複する説明は省略する。（）には特許請求の範囲に記載した発明特定事項を示す。 Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to FIGS. In the description of the drawings, the same or corresponding elements are denoted by the same reference numerals and redundant description will be omitted. () Shows the invention specific matters described in the claims.
図１は、本発明の実施形態として示すＬＥＤモジュール１０の平面図である。ＬＥＤモジュール１０に含まれる回路基板１１上には、８個のＬＥＤ１２、８個のＬＥＤ１３、ジャンパー抵抗１４ａ（第１ジャンパー抵抗）、１４ｂ（第２ジャンパー抵抗）、１５ａ（第１ジャンパー抵抗）、１５ｂ（第２ジャンパー抵抗）、が実装されている。さらに、回路基板１１上には、電極パターンとして、接続電極１２ａ、１２ｂ、１３ａ、１３ｂ、電源電極１６ａ、１６ｂ、１７ａ、１７ｂ、配線１８が形成されている。 FIG. 1 is a plan view of an LED module 10 shown as an embodiment of the present invention. On the circuit board 11 included in the LED module 10, eight LEDs 12, eight LEDs 13, jumper resistors 14a (first jumper resistor), 14b (second jumper resistor), 15a (first jumper resistor), 15b (2nd jumper resistance) is mounted. Furthermore, on the circuit board 11, connection electrodes 12a, 12b, 13a, 13b, power supply electrodes 16a, 16b, 17a, 17b and wires 18 are formed as electrode patterns.
図１の詳細な説明の前に、図２〜５により、ＬＥＤモジュール１０に含まれる回路基板１１の電極パターン及び回路、ＬＥＤ１２、１３について説明する。 Before detailed description of FIG. 1, the electrode patterns and circuits of the circuit board 11 and the LEDs 12 and 13 included in the LED module 10 will be described with reference to FIGS.
図２は、図１に示すＬＥＤモジュール１０に含まれる回路基板１１の平面図である。回路基板１１の周辺部には、正方形の電源電極１６ａ、１６ｂ、１７ａ、１７ｂが形成されている。中央部には、ＬＥＤ１２、１３（図１参照）のアノードに接続する接続電極１２ａ、１３ａ、及び、ＬＥＤ１２、１３のカソードに接続する接続電極１２ｂ、１３ｂが形成されている。接続電極１２ａ、１２ｂは、長方形で、対をなし、平行に配置されている。同様に、接続電極１３ａ、１３ｂも、それぞれ長方形で、対をなし、平行に配置されている。 FIG. 2 is a plan view of the circuit board 11 included in the LED module 10 shown in FIG. At the periphery of the circuit board 11, square power supply electrodes 16a, 16b, 17a, 17b are formed. In the central portion, connection electrodes 12a and 13a connected to the anodes of the LEDs 12 and 13 (see FIG. 1) and connection electrodes 12b and 13b connected to the cathodes of the LEDs 12 and 13 are formed. The connection electrodes 12a and 12b are rectangular, paired, and arranged in parallel. Similarly, the connection electrodes 13a and 13b are also rectangular, arranged in pairs, and in parallel.
図３は、ＬＥＤモジュール１０の回路図である。図中、（ａ）は、８個のＬＥＤ１２が直列接続したＬＥＤ列１６（第１ＬＥＤ列）を示し、（ｂ）は、８個のＬＥＤ１３が直列接続したＬＥＤ列１７（第２ＬＥＤ列）を示している。ＬＥＤ列１６では、初段のＬＥＤ
１２のアノードが電源端子１６ａに接続し、最終段のＬＥＤ１２のカソードが電源端子１６ｂに接続している。途中、７段目のＬＥＤ１２と８段目のＬＥＤ１２の間には、並列接続したジャンパー抵抗１４ａ、１４ｂが挿入されている。同様に、ＬＥＤ列１７では、初段のＬＥＤ１３のアノードが電源端子１７ａに接続し、最終段のＬＥＤ１３のカソードが電源端子１７ｂに接続している。途中、４段目のＬＥＤ１３と５段目のＬＥＤ１３の間には、並列接続したジャンパー抵抗１５ａ、１５ｂが挿入されている。
FIG. 3 is a circuit diagram of the LED module 10. In the figure, (a) shows an LED array 16 (first LED array) in which eight LEDs 12 are connected in series, and (b) shows an LED array 17 (second LED array) in which eight LEDs 13 are connected in series. ing. In the LED row 16, the first stage LEDs
The anode of 12 is connected to the power supply terminal 16a, and the cathode of the final-stage LED 12 is connected to the power supply terminal 16b. In the middle, jumper resistors 14a and 14b connected in parallel are inserted between the seventh stage LED 12 and the eighth stage LED 12. Similarly, in the LED array 17, the anode of the first-stage LED 13 is connected to the power supply terminal 17a, and the cathode of the last-stage LED 13 is connected to the power supply terminal 17b. On the way, between the LED 13 of the fourth stage and the LED 13 of the fifth stage, jumper resistors 15a and 15b connected in parallel are inserted.
なお、ジャンパー抵抗１４ａ、１４ｂは、両端部に端子を備えた表面実装用抵抗であり、配線として使用するだけなら０Ω（抵抗値が無視できるもの）であっても良い。ジャンパー抵抗１４ａ、１４ｂが電流制限に用いられる場合は、一方のジャンパー抵抗（例えば１４ｂ）に接続不良が起こっても、ＬＥＤ１２が暗くなるだけで不点灯とはならず、故障したことが見た目で分かる。ジャンパー抵抗１５ａ、１５ｂについても同様である。 The jumper resistors 14a and 14b are surface mounting resistors provided with terminals at both ends, and may be 0 Ω (where the resistance value can be ignored) if used only as a wire. When the jumper resistors 14a and 14b are used for current limitation, even if a connection failure occurs in one of the jumper resistors (for example 14b), the LED 12 only becomes dark and does not turn off, and it is visually understood that it has failed . The same applies to the jumper resistors 15a and 15b.
図４は、ＬＥＤモジュール１０に含まれるＬＥＤ１２の平面図である。図４に示すように、ＬＥＤ１２を上面から眺めると、正方形の封止樹脂４１と、封止樹脂４１を取り囲む枠状の白色反射樹脂４２とが観察される。封止樹脂４１は、蛍光体を含有するシリコン樹脂であり、白色反射樹脂４２は、酸化チタン粒子を含有するシリコン樹脂である。なお、図４では、参考のため、ＬＥＤ１２の裏面に形成されるアノード１２ｃ及びカソード１２ｄを破先で描いている。ＬＥＤ１３ついては、ＬＥＤ１２に対し封止樹脂４１に含まれる蛍光体が異なるだけなので、対応する部材等を図中（）で示した。 FIG. 4 is a plan view of the LED 12 included in the LED module 10. As shown in FIG. 4, when the LED 12 is viewed from the top, a square sealing resin 41 and a frame-like white reflective resin 42 surrounding the sealing resin 41 are observed. The sealing resin 41 is a silicone resin containing a phosphor, and the white reflective resin 42 is a silicone resin containing titanium oxide particles. In FIG. 4, for reference, the anode 12 c and the cathode 12 d formed on the back surface of the LED 12 are drawn with a broken edge. About LED13, since only the fluorescent substance contained in sealing resin 41 differs with respect to LED12, the corresponding member etc. were shown by () in the figure.
図５は、図４のＡＡ´線に沿って描いたＬＥＤ１２の断面図である。図５に示すように、ＬＥＤ１２は、サブマウント基板４４の上面にＬＥＤダイ４３が実装され、下面に突起電極からなるアノード１２ｃ及びカソード１２ｄが形成されている。封止樹脂４１は、サブマウント基板４４の上面とＬＥＤダイ４３の上部を覆い、白色反射樹脂４２は、封止樹脂４１の周囲を取り囲んでいる。断面図についても、ＬＥＤ１３は、ＬＥＤ１２に対し封止樹脂４１に含まれる蛍光体が異なるだけなので、対応する部材等を図中（）で示した。 FIG. 5 is a cross-sectional view of the LED 12 drawn along the line AA ′ of FIG. As shown in FIG. 5, in the LED 12, the LED die 43 is mounted on the upper surface of the submount substrate 44, and an anode 12 c and a cathode 12 d formed of protruding electrodes are formed on the lower surface. The sealing resin 41 covers the top surface of the submount substrate 44 and the top of the LED die 43, and the white reflective resin 42 surrounds the periphery of the sealing resin 41. Also in the cross-sectional view, the corresponding members and the like are indicated by () in the drawing because the LED 13 is different from the LED 12 only in the phosphor contained in the sealing resin 41.
前述したようにＬＥＤ１２とＬＥＤ１３は、封止樹脂４１に含まれる蛍光体のみが異なる。ＬＥＤ１２は、ＬＥＤダイ４３が放射する青色発光の一部を波長変換し、暖色（２０００Ｋ°〜３０００Ｋ°程度）で発光する。ＬＥＤ１３は、ＬＥＤダイ４３が放射する青色発光の一部を波長変換し、寒色（概ね５０００Ｋ°以上）で発光する。 As described above, the LED 12 and the LED 13 differ only in the phosphor contained in the sealing resin 41. The LED 12 wavelength-converts part of the blue light emitted by the LED die 43 and emits light in a warm color (about 2000 K ° to 3000 K °). The LED 13 converts the wavelength of a part of the blue light emitted by the LED die 43, and emits a cold color (approximately 5000 K ° or more).
再び図２に戻り、回路基板１１の上面に形成された電極パターンを説明する。図３で説明したように、回路基板１１上では８個のＬＥＤ１２が直列接続している。これに対応して、図２でも、初段のＬＥＤ１２のアノード１２ｃが接続する接続電極１２ａは、配線１８を介して電源電極１６ａに接続し、最終段のＬＥＤ１２のカソード１２ｄが接続する接続電極１２ｂは、配線１８を介して電源電極１６ｂに接続していることが示されている。同様に、初段のＬＥＤ１３のアノード１３ｃが接続する接続電極１３ａは、配線１８を介して電源電極１７ａに接続し、最終段のＬＥＤ１３のカソード１３ｄが接続する接続電極１３ｂは、配線１８を介して電源電極１７ｂに接続している。 Referring back to FIG. 2 again, an electrode pattern formed on the upper surface of the circuit board 11 will be described. As described in FIG. 3, eight LEDs 12 are connected in series on the circuit board 11. Corresponding to this, also in FIG. 2, the connection electrode 12a to which the anode 12c of the first stage LED 12 is connected is connected to the power supply electrode 16a via the wiring 18, and the connection electrode 12b to which the cathode 12d of the last stage LED 12 is connected is It is shown that the wiring 18 is connected to the power supply electrode 16b. Similarly, the connection electrode 13a to which the anode 13c of the first-stage LED 13 is connected is connected to the power supply electrode 17a via the wiring 18, and the connection electrode 13b to which the cathode 13d of the final-stage LED 13 is connected is It is connected to the electrode 17b.
ＬＥＤ１２が直列接続する部分（図３のＬＥＤ列１６を構成する部分）では、原則的に、配線１８を介して、一のＬＥＤ１２のカソード１２ｄが接続する接続電極１２ｂが、次段のＬＥＤ１２のアノード１２ｃが接続する接続電極１２ａに接続する。しかしながら、図３（ａ）と対応して、回路基板１１上でも、６段目のＬＥＤ１２のカソード１２ｄが接続する接続電極１２ｂは、７番目のＬＥＤ１２のアノード１２ｃが接続する接続電極１２ａに、ジャンパー抵抗１４ａ、１４ｂを介して接続する。すなわち、６番目のＬＥＤ１２のカソード１２ｄが接続する接続電極１２ｂと７番目のＬＥＤ１２のアノード１２ｃが接続する接続電極１２ａとの間には、シャンパー抵抗１４ａ、１４ｂを実装するためのラン
ド１４ｃ、１４ｄ、１４ｅ、１４ｆが形成されている。
In the portion where the LEDs 12 are connected in series (the portion that configures the LED array 16 in FIG. 3), in principle, the connection electrode 12 b to which the cathode 12 d of one LED 12 is connected via the wiring 18 is the anode of the next stage LED 12 It connects to the connection electrode 12a which 12c connects. However, the connection electrode 12b connected to the cathode 12d of the sixth LED 12 is also connected to the connection electrode 12a connected to the anode 12c of the seventh LED 12 on the circuit board 11 in correspondence with FIG. 3A. It connects via resistance 14a, 14b. That is, the lands 14c, 14d, and 14d for mounting the shampoo resistors 14a and 14b between the connection electrode 12b to which the cathode 12d of the sixth LED 12 is connected and the connection electrode 12a to which the anode 12c of the seventh LED 12 is connected. 14e and 14f are formed.
同様に、ＬＥＤ１３が直列接続する部分（図３のＬＥＤ列１７を構成する部分）では、原則的に、配線１８を介して、一のＬＥＤ１３のカソード１３ｄが接続する接続電極１３ｂが、次段のＬＥＤ１３のアノード１３ｃが接続する接続電極１３ａに接続する。しかしながら、図３（ｂ）と対応して、回路基板１１上でも、４段目のＬＥＤ１３のカソード１３ｄが接続する接続電極１３ｂは、５番目のＬＥＤ１３のアノード１３ｃが接続する接続電極１３ａに、ジャンパー抵抗１５ａ、１５ｂを介して接続する。すなわち、４番目のＬＥＤ１３のカソード１３ｄが接続する接続電極１３ｂと５番目のＬＥＤ１３のアノード１３ｃが接続する接続電極１３ａとの間には、シャンパー抵抗１５ａ、１５ｂを実装するためのランド１５ｃ、１５ｄ、１５ｅ、１５ｆが形成されている。 Similarly, in the part where the LEDs 13 are connected in series (the part that configures the LED row 17 in FIG. 3), in principle, the connection electrode 13b to which the cathode 13d of one LED 13 is connected via the wiring 18 is the next stage. It connects to the connection electrode 13a which the anode 13c of LED13 connects. However, the connection electrode 13b connected to the cathode 13d of the fourth LED 13 is also connected to the connection electrode 13a connected to the anode 13c of the fifth LED 13 on the circuit board 11 in correspondence with FIG. 3B. It connects via resistance 15a, 15b. That is, lands 15c, 15d, and 15d for mounting the champagne resistances 15a and 15b between the connection electrode 13b to which the cathode 13d of the fourth LED 13 is connected and the connection electrode 13a to which the anode 13c of the fifth LED 13 is connected. 15e and 15f are formed.
再び図１に戻り、ＬＥＤモジュール１０についてさらに詳しく説明する。ＬＥＤモジュール１０に含まれる回路基板１１は、Ａｌをベースとし、上面に絶縁層を備えている。絶縁層としては、Ａｌ表面を酸化させたもの、絶縁部材を印刷したもの、薄い樹脂基板を貼り付けたものなどがある。回路基板１１の中央部では、暖色発光するＬＥＤ１２と寒色発光するＬＥＤ１３が市松模様となるよう配置されている。配線１８は、回路基板１１の上面に一層構造で形成されている。 Returning to FIG. 1 again, the LED module 10 will be described in more detail. The circuit board 11 included in the LED module 10 is based on Al, and has an insulating layer on the top surface. As the insulating layer, there are those in which the Al surface is oxidized, those in which an insulating member is printed, and those in which a thin resin substrate is attached. In the central portion of the circuit board 11, the warm-emitting LEDs 12 and the cold-emitting LEDs 13 are arranged in a checkered pattern. The wiring 18 is formed on the upper surface of the circuit board 11 in a single layer structure.
市松模様を形成するようにしながら、ＬＥＤ１２及びＬＥＤ１３をそれぞれ直列接続（図３参照）させようとすると、配線が一層構造であるため、ＬＥＤ１２からなる直列回路の配線１８と、ＬＥＤ１３からなる配線１８とが交差してしまう。このため、ＬＥＤモジュール１０では、回路基板１１表面の２か所にジャンパー部品（ジャンパー抵抗１４ａ、１４ｂ、１５ａ、１５ｂ）を配置し、配線１８の交差を回避している。すなわち、ジャンパー抵抗１４ａ、１４ｂは、ＬＥＤ１３からなる直列回路（図３（ｂ）のＬＥＤ列１７）を構成する配線１８を跨ぎ、シャンパー抵抗１５ａ、１５ｂは、ＬＥＤ１２からなる直列回路（図３（ａ）のＬＥＤ列１６）を構成する配線１８を跨いでいる。 When trying to connect the LEDs 12 and the LEDs 13 in series (see FIG. 3) while forming a checkered pattern, the wires have a single-layer structure, so the wires 18 of the series circuit of the LEDs 12 and the wires 18 of the LEDs 13 Crosses. For this reason, in the LED module 10, jumper parts (jumper resistors 14a, 14b, 15a, 15b) are disposed at two places on the surface of the circuit board 11 to avoid crossing of the wires 18. That is, the jumper resistances 14a and 14b straddle the wiring 18 constituting the series circuit (the LED array 17 in FIG. 3B) including the LEDs 13, and the champagne resistances 15a and 15b include the series circuit including the LEDs 12 (FIG. Straddling the wiring 18 which constitutes the LED row 16).
このとき、ＬＥＤ１２からなる直列回路を構成するジャンパー抵抗１４ａ、１４ｂは、並列接続するとともに、平面視したとき長手方向が直交している。同様に、ＬＥＤ１３からなる直列回路を構成するジャンパー抵抗１５ａ、１５ｂは、並列接続するとともに、平面視したとき長手方向が直交している。 At this time, the jumper resistors 14a and 14b that constitute the series circuit of the LEDs 12 are connected in parallel, and the longitudinal directions are orthogonal to each other in plan view. Similarly, the jumper resistors 15a and 15b constituting a series circuit of the LEDs 13 are connected in parallel, and their longitudinal directions are orthogonal to each other in plan view.
例えば、回路基板１１の縦方向（図１では右斜め上に向かう方向）の熱膨張率が横方向（図１では左斜め上に向かう方向）の熱膨張率より小さいとすると、シャンパー抵抗１４ａ、１５ａの長手方向が熱膨張率の小さい方向に対し平行で、シャンパー抵抗１４ｂ、１５ｂの長手方向が熱膨張率の大きい方向と平行になる。この結果、ＬＥＤモジュール１０は、温度サイクル試験に投入されてもジャンパー抵抗１４ａ、１５ａと回路基板１１とのハンダ接続部にクラックが入りにくくなる。すなわち、温度サイクル試験において、ジャンパー抵抗１４ｂ、１５ｂに接続不良が生じる状況になっても、ジャンパー抵抗１４ａ、１５ａは、接続不良が起こりにくい状態を保てる。したがって、ＬＥＤモジュール１０は、熱膨張と熱収縮が繰り返される過酷な環境下でも、不点灯という致命的な事態に至りにくくなる。 For example, assuming that the thermal expansion coefficient of the circuit board 11 in the longitudinal direction (the direction toward the upper right in FIG. 1) is smaller than the thermal expansion coefficient in the lateral direction (the direction toward the upper left in FIG. 1) The longitudinal direction of 15a is parallel to the direction of small coefficient of thermal expansion, and the longitudinal direction of the champagne resistances 14b and 15b is parallel to the direction of large coefficient of thermal expansion. As a result, in the LED module 10, the solder connection portion between the jumper resistors 14a and 15a and the circuit board 11 is unlikely to be cracked even if it is subjected to the temperature cycle test. That is, in the temperature cycle test, even if connection failure occurs in the jumper resistors 14b and 15b, the jumper resistors 14a and 15a can maintain a state in which connection failure does not easily occur. Therefore, the LED module 10 does not easily lead to a fatal situation of non-lighting even under a severe environment where thermal expansion and thermal contraction are repeated.
比較のため、熱膨張率が大きい方向にのみジャンパー抵抗を備えたＬＥＤモシュール６０を図６に示す。図６は、比較例として示すＬＥＤモジュール６０の平面図である。ＬＥＤモジュール６０は、ＬＥＤ１２からなる直列回路を構成するジャンパー部品が１個のジャンパー抵抗６４であることと、ＬＥＤ１３からなる直列回路を構成するジャンパー部品が１個のジャンパー抵抗６５であることとを除き、ＬＥＤモジュール１０と同じ構造となっている。 For comparison, FIG. 6 shows an LED model 60 provided with a jumper resistance only in the direction in which the thermal expansion coefficient is large. FIG. 6 is a plan view of an LED module 60 shown as a comparative example. The LED module 60 has one jumper resistor 64 which constitutes a series circuit composed of the LEDs 12 and one jumper resistor 65 constitutes a series circuit composed of the LEDs 13. , And the same structure as the LED module 10.
ＬＥＤモジュール６０においても、前述の場合と同様に、回路基板１１は、横方向（図６では左斜め上に向かう方向）の熱膨張率が大きくなっているものとする。このとき、シャンパー抵抗６４、６５の長手方向は、この熱膨張率の大きい方向と平行になる。すなわち、ＬＥＤモジュール６０は、温度サイクル試験に投入されると、長手方向の熱膨張率が大きいため、ジャンパー抵抗６４、６５と回路基板１１とのハンダ接続部にクラックが入りやすくなる。すなわち、ＬＥＤモジュール６０は、ＬＥＤモジュール１０と比べ、迂回手段（熱膨張率の小さい方向と平行なジャンパー抵抗１４ａ、１５ａ）がないので温度サイクル試験において不点灯が起こりやすい。 Also in the LED module 60, as in the case described above, the circuit board 11 has a large coefficient of thermal expansion in the lateral direction (the direction toward the upper left in FIG. 6). At this time, the longitudinal direction of the shampoo resistances 64 and 65 is parallel to the direction in which the thermal expansion coefficient is large. That is, when the LED module 60 is subjected to the temperature cycle test, the solder connection portion between the jumper resistors 64 and 65 and the circuit board 11 is easily cracked because the thermal expansion coefficient in the longitudinal direction is large. That is, compared with the LED module 10, since the LED module 60 does not have bypass means (the jumper resistances 14a and 15a parallel to the direction with a smaller coefficient of thermal expansion), lighting failure easily occurs in the temperature cycle test.
以上のように、ＬＥＤモジュール１０は、熱膨張率の小さい方向と平行なジャンパー抵抗１４ａ、１５ａで迂回手段を準備しているため、ＬＥＤモジュール６０に比べ温度サイクル試験をはじめとする熱膨張と熱収縮が繰り返される過酷な環境下において致命的な接続不良を起こりにくくしている。いいかえると、通常、方向に係る熱膨張率の大小関係は明らかになっていない（管理されていない）ため、ＬＥＤモジュール１０では、少なくとも一方のジャンパー抵抗１４ａ又は１４ｂについて接続不良を起こしにくくさせるため、２つのジャンパー抵抗１４ａ、１４ｂを直交配置している。 As described above, the LED module 10 prepares the detouring means by the jumper resistors 14a and 15a parallel to the direction with a smaller coefficient of thermal expansion, so thermal expansion and thermal expansion including the thermal cycle test as compared with the LED module 60 In a severe environment where contractions are repeated, fatal connection failures are less likely to occur. In other words, since the magnitude relationship of the thermal expansion coefficient related to the direction is not generally clarified (not managed), in the LED module 10, at least one jumper resistor 14a or 14b is less likely to cause connection failure. Two jumper resistors 14a and 14b are arranged in an orthogonal manner.
なお、ＬＥＤモジュール１０では、回路基板１１は、金属ベースとしており、延伸方向により熱膨張率が方向によって異なる。しかしながら、通常、ＬＥＤモジュールに含まれる回路基板は、熱伝導性が高ければ必ずしも金属ベースである必要はなく、例えば、基板材料をセラミクスとしても良い。金属ベースと同様に、セラミクスからなる回路基板でも、スルーホールが作りにくいためジャンパー用部品（抵抗）が有効になる。すなわち、セラミクスからなる回路基板でも、回路基板１１と同様に縦方向と横方向で熱膨張率が異なる場合には、ジャンパー抵抗を並列接続するとともに直交配置すると、ＬＥＤモジュール１０と同様に不点灯対策が可能になる。 In the LED module 10, the circuit board 11 is metal-based, and the coefficient of thermal expansion differs depending on the extending direction. However, in general, the circuit board included in the LED module does not necessarily have to be metal-based as long as the thermal conductivity is high, and for example, the substrate material may be ceramic. As with the metal base, even with a ceramic circuit board, it is difficult to form through holes, and parts for jumpers (resistance) become effective. That is, even if the circuit board made of ceramics has a thermal expansion coefficient different between the vertical direction and the horizontal direction like the circuit board 11, if the jumper resistances are connected in parallel and orthogonally arranged, as in the case of the LED module 10 Becomes possible.
また、原理的には、多層配線技術を使えば、ジャンパー抵抗を不要にできる。同様に、金属又はセラミクスからなるベース部にスルーホールを形成することも可能である。このような技術を使っても、具体的な設計によってはジャンパー抵抗が必要となる場合がある。しかしながら、回路基板１１のように一方の面にのみ一層構造の配線を設けるようにすると、回路基板１１の構造及びその製造工程が著しく簡単化する。すなわち、このような構成の回路基板１１において、本発明を適用する意義が大きくなる。 Also, in principle, using multilayer wiring technology can eliminate the need for a jumper resistor. Similarly, it is also possible to form through holes in the base made of metal or ceramic. Even with such a technique, depending on the specific design, a jumper resistance may be required. However, if the wiring having a single layer structure is provided only on one side like the circuit board 11, the structure of the circuit board 11 and the manufacturing process thereof are significantly simplified. That is, the significance of applying the present invention to the circuit board 11 having such a configuration is increased.
また、本発明のＬＥＤモジュールは、１本のＬＥＤ列しか備えていなくても、回路基板上に駆動回路などを搭載したりするとジャンパー抵抗が必要となる場合がある。このときも、ジャンパー抵抗を並列接続させながら直交させると不点灯対策ができる。これに対し、ＬＥＤモジュール１０には、不点灯対策と併せて調色機能が備えられている。すなわち、ＬＥＤモジュール１０は、暖色で発光するＬＥＤ１２がＬＥＤ列１６を構成し、寒色で発光するＬＥＤ１３がＬＥＤ列１７を構成し、ＬＥＤ１２とＬＥＤ１３が市松模様状に配置され、この結果、ジャンパー抵抗１４ａ等を必要とするようになった。そして、ＬＥＤモジュール１０は、この構造により、ＬＥＤ列１６とＬＥＤ列１７の発光強度を調整することで発光色を調整可能とし、この際の混色性を高めることができる。 In addition, even if only one LED array is provided, the LED module of the present invention may require a jumper resistance if a drive circuit or the like is mounted on a circuit board. Also at this time, if the jumper resistances are connected in parallel and orthogonalized, it is possible to take measures against non-lighting. On the other hand, the LED module 10 is provided with a color matching function together with the non-lighting countermeasure. That is, in the LED module 10, the LEDs 12 emitting warm light constitute the LED array 16, the LEDs 13 emitting cold color constitute the LED array 17, the LEDs 12 and the LEDs 13 are arranged in a checkered pattern, and as a result, the jumper resistance 14a Came to need etc. With this structure, the LED module 10 can adjust the light emission color by adjusting the light emission intensity of the LED array 16 and the LED array 17, and the color mixing property at this time can be enhanced.
１０、６０…ＬＥＤモジュール、
１１…回路基板、
１２、１３…ＬＥＤ、
１２ａ、１２ｂ、１３ａ、１３ｂ…接続電極、
１２ｃ、１３ｃ…アノード、
１２ｄ、１３ｄ…カソード、
１４ａ、１４ｂ、１５ａ、１５ｂ…ジャンパー抵抗（第１、２ジャンパー抵抗）、
１４ｃ〜１４ｆ、１５ｃ〜１５ｆ…ランド、
１６、１７…ＬＥＤ列（第１、２ＬＥＤ列）、
１６ａ、１６ｂ、１７ａ、１７ｂ…電源電極、
４１…封止樹脂、
４２…白色反射樹脂、
４３…ＬＥＤダイ、
４４…サブマウント基板、
６４、６５…ジャンパー抵抗。
10, 60 ... LED module,
11: Circuit board,
12, 13 ... LED,
12a, 12b, 13a, 13b ... connection electrodes,
12c, 13c ... anode,
12d, 13d ... cathode,
14a, 14b, 15a, 15b ... jumper resistance (first and second jumper resistances),
14c-14f, 15c-15f ... land,
16, 17 ... LED rows (first and second LED rows),
16a, 16b, 17a, 17b: power supply electrodes,
41 ... sealing resin,
42: White reflective resin,
43 ... LED die,
44 ... submount substrate,
64, 65 ... jumper resistance.
Claims (5)
第１ジャンパー抵抗と第２ジャンパー抵抗を含み、
前記第１ジャンパー抵抗と前記第２ジャンパー抵抗は、前記回路基板の前記上面で並列接続し、１つの配線を跨ぎ、それぞれの長手方向が互いにほぼ直交する
ことを特徴とするＬＥＤモジュール。 In an LED module including a circuit board having a wiring formed on the upper surface and a plurality of LEDs mounted thereon,
Including a first jumper resistor and a second jumper resistor,
The LED module according to claim 1, wherein the first jumper resistor and the second jumper resistor are connected in parallel at the upper surface of the circuit board, straddle one wire, and the longitudinal directions thereof are substantially orthogonal to each other.
The LED module according to claim 4, wherein the first LED array and the second LED array have different emission colors.
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