JP7044412B1 - Manufacturing method of LED light source device and LED light source device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an LED light source device capable of reducing the distance between LED chips and increasing the density of LED chips. SOLUTION: The mounting board 10 has a plurality of wirings 31 to 34 arranged on the mounting board 10, and a plurality of types of LED chips 41 to 44 connected to the plurality of wirings 31 to 34, respectively. In the LED light source device, the plurality of wirings 31 to 34 have at least the first wiring 31, the second wiring 31, and the third wirings 33, 34, and the first wiring 31 and the second wiring 31. Is an LED light source device that straddles the third wiring 33 and 34 and is connected by a bonding wire 201. [Selection diagram] Fig. 5

Description

The present invention relates to an LED light source device and a method for manufacturing an LED light source device.

Conventionally, there is known an LED light source device in which four types of LED chips (blue LED chip, red LED chip, green LED chip, white LED chip) that emit different colors of light are mounted on the same plane of a substrate (blue LED chip, red LED chip, green LED chip, white LED chip). For example, see Patent Document 1).

JP-A-2019-102396

In recent years, in stage lighting and the like, there is a need for an LED light source device capable of emitting four or more colors while being relatively small by narrowing the distance between LED chips and making them densely packed. Here, in an LED light source device having a plurality of types of LED chips that emit different colors, the current value of the LED chips of each color is independently controlled so that tens of thousands of color variations can be changed. Usually, electrodes and wiring systems are separately arranged for each type of LED chip. However, when a plurality of types of LED chips are used as in Patent Document 1, the wiring pattern becomes complicated as the types of LED chips increase, and it may be necessary to cross the wirings for different types of LED chips. be. Conventionally, in such a case, a method is adopted in which wirings for different types of LED chips are divided into different layers and crossed by using a multilayer board, but in this case, a constant method is used to form a via hole. It is necessary to provide a beer land of a size on the wiring. Therefore, in the conventional LED light source device, it is necessary to widen the distance between the wirings by the amount of the via land, and there is a problem that the density of the LED chips cannot be improved. Further, also in the LED chip arranging portion, there is a problem that the heat radiating property of the heat generated by the LED chip is deteriorated because the layers are multi-layered and the layers are connected by via holes.

An object of the present invention is to provide an LED light source device capable of reducing the distance between LED chips and increasing the density of LED chips.

The LED light source device according to the present invention includes a mounting board which is a single-layer board and a mounting board.
With a plurality of wirings arranged on the mounting board,
An LED light source device including a plurality of sets of first to fourth color LED chips, wherein the plurality of wirings are a first wiring connected to a first color LED chip and a second color LED chip. It has a second wiring connected to, a third wiring connected to the LED chip of the third color, and a fourth wiring connected to the LED chip of the fourth color, and the first of the plurality of sets. Or, the LED chip of the fourth color has the light emitting part of the first row arranged in the first direction without being adjacent to the LED chip of the same color, and the LED chip of the same color in the first direction without being adjacent to the LED chip of the same color. The light emitting part of the first row and the light emitting part of the second row include the light emitting part of the second row arranged in the same color even in the second direction orthogonal to the first direction. The LED chips of the first to fourth colors are arranged so as not to be adjacent to the LED chips, and the first to fourth wirings are wired so as to extend in the first direction. The LED chips of the light emitting unit in the first row and the light emitting unit in the second row are connected in series with the LED chips of the same color in the other light emitting units, and are connected to the LED chip of the light emitting unit in the first row and the second row. The LED chip of the light emitting portion of the row is connected by a bonding wire so as to straddle the wiring of the LED chip having a color different from that of the LED chip .
In the LED light source device, the first to fourth color LED chips may be configured to include a green LED chip, a red LED chip, a blue LED chip, and a yellow LED chip .
In the LED light source device, a solder resist layer is formed on a wiring layer on which the plurality of wirings are formed, and the solder resist layer is a portion where the first to fourth wirings are connected to the bonding wire. It can be configured to have the removed portion removed in .
In the LED light source device, the distance between the plurality of adjacent wirings may be less than 0.2 mm .

According to the present invention, it is possible to provide an LED light source device in which the distance between LED chips is small and the density of LED chips is improved.

It is a top view of the LED light source device which concerns on this embodiment. It is an enlarged view of the II part of FIG. FIG. 2 is also a diagram illustrating a wiring portion covered with a solder resist layer. FIG. 3 is a diagram in which the description of a part of the reference numerals is omitted. It is a side sectional view along the VV line of FIG. It is a figure for demonstrating the wiring connection method of the conventional LED light source apparatus. (A) is a diagram for explaining the wiring interval of the conventional LED light source device, and (B) is a diagram for explaining the wiring interval of the LED light source device according to the present embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of the LED light source device 1 according to the present embodiment. 2 is an enlarged view of the II portion of FIG. 1, and FIG. 3 is a diagram showing the wiring portion covered with the solder resist layer in FIG. 2. Further, FIG. 5 is a side sectional view taken along the line VV of FIG.

As shown in FIGS. 1 to 5, the LED light source device 1 according to the present embodiment includes a mounting substrate 10, an insulating layer 20, a wiring layer 30, and four types of LED chips 41 to irradiate light in different wavelength ranges. 44 (green LED chip 41, red LED chip 42, blue LED chip 43 and yellow LED chip 44), external electrodes 51 to 54, 61 to 64 connected to each of the LED chips 41 to 44, a dam material 70, and the dam material 70. It has a solder resist layer 80 and a sealing resin layer 90.

In the present embodiment, the mounting substrate 10 is a plate material made of a metal having excellent thermal conductivity and electrical characteristics. For example, there are three types of heat spreaders (upper plate, middle plate, and lower plate) having a water-cooled structure whose surface is made of copper or aluminum. It is composed of a laminated structure made of a copper plate) and a metal plate made of copper or aluminum (for example, a thickness of 0.5 to 2.00 mm). It should be noted that a material having low thermal conductivity, such as a glass epoxy resin, is not preferable because it has poor heat dissipation and causes a donut phenomenon in which the amount of light in the center of light emission is reduced. Further, as the mounting substrate 10, a highly thermally conductive insulating substrate (for example, AlN, GaN, SiC, etc.) can also be used. In this case, the insulating layer 20 described later can be eliminated.

As shown in FIG. 5, the insulating layer 20 is formed on the mounting substrate 10. The insulating layer 20 is a layer for electrically insulating the mounting substrate 10 and the wiring layer 30, and can be composed of a glass epoxy resin or a polyimide resin as a main component. Since the glass epoxy resin has low thermal conductivity (for example, about 1 W / mK), the thermal conductivity can be increased (for example, about 10 to 20 W / mK) by adding a filler. Further, the insulating layer 20 may be composed of an organic resin such as a silicone resin as a main component.

Further, a wiring layer 30 is formed on the insulating layer 20. In the present embodiment, as shown in FIG. 3, the wiring layer 30 has a wiring 31 electrically connected to the green LED chip 41, a wiring 32 electrically connected to the red LED chip 42, and a blue LED chip 43. A wiring 33 electrically connected to the yellow LED chip 44 and a wiring 34 electrically connected to the yellow LED chip 44 are included. Further, in the wiring layer 30, an LED arranging portion 35 for arranging the green LED chip 41, an LED arranging portion 36 for arranging the red LED chip 42, and an LED arranging portion for arranging the blue LED chip 43 are provided. 37 and an LED arranging portion 38 for arranging the yellow LED chip 44 are also included.

In the present embodiment, as shown in FIGS. 3 and 4, wirings 31 to 34 and LED arrangement portions 35 to 38 corresponding to the four types of LED chips 41 to 44 are arranged in the wiring layer 30. It forms a complicated wiring pattern. The wiring pattern of the wiring layer 30 can be formed by removing unnecessary portions by photo-etching the copper foil. In FIG. 1, the wiring layer 30 is not shown. The material used for the wiring layer 30 is not limited to the copper foil film, and for example, a metal such as silver paste or copper paste can be used. The connection method between the wirings 31 to 34 in the wiring layer 30 will be described later.

In the LED light source device 1 according to the present embodiment, four types of LED chips 41 to 44 are arranged on the LED arrangement portions 35 to 38 of the wiring layer 30, respectively. The four types of LED chips 41 to 44 are vertical (upper and lower surface electrodes) type bare LED chips that emit light of different colors (wavelength ranges), and are mounted by being arranged on the LED arrangement portions 35 to 38. Will be done. Further, in the present embodiment, the LED chip 41 is a green LED chip that emits green light, the LED chip 42 is a red LED chip that emits red light, and the LED chip 43 is a blue LED chip that emits blue light. The chip 44 is a yellow LED chip that emits yellow light. However, the LED chips 41 to 44 are not limited to the LED chips described above, and may be LED chips that emit light of a color different from that of the LED chips described above. Further, as the LED chips 41 to 44, commercially available LED chips may be used. In the present embodiment, the LED chips 41 to 44 are arranged on the LED arrangement portions 35 to 38 corresponding to the LED chips 41 to 44, so that the wirings 31 to 34 corresponding to the LED chips 41 to 44 are arranged. Is electrically connected to the external electrodes 51 to 54 and 61 to 64 corresponding to the LED chips 41 to 44, respectively. That is, in the present embodiment, as shown in FIG. 1, the external electrodes 51 to 54, 61 to each of the types of the LED chips 41 to 44 can be flowed so that different values of current can flow for each type of the LED chips 41 to 44. 64 and wiring systems 31 to 38 are separately arranged. Further, either of the external electrodes 51 to 54 and 61 to 64 may be separated and one of them may be a common electrode.

Further, as shown in FIG. 5, a solder resist layer 80 is formed on the wiring layer 30. The solder resist layer 80 contains a silicone resin, a glass epoxy resin, and a polyamide resin as main components, and has a function of protecting the wiring layer 30. Further, in the present embodiment, the solder resist layer 80 contains a white inorganic pigment such as titanium oxide (TiO ₂ ), zinc oxide, and alumina, and also has a function as a reflective material. In FIG. 2, the wiring layer 30 of the portion covered with the white solder resist layer 80 is not shown, but in FIG. 3, the solder resist layer 80 is covered for convenience of explanation. The wiring layer 30 of the portion is shown by a broken line.

In the present embodiment, as shown in FIGS. 2 to 5, in the solder resist layer 80, the portions for connecting the wirings 31 to 34 with the bonding wires 201 to 204 are removed by photoedging, and the removed portions 81 to 84 are removed. Is formed as. For example, in the example shown in FIGS. 2 to ₅ , the removed portions 815 and _{816 are} formed in order to connect the wiring ₃₁₃ and the wiring ₃₁₄ with the bonding wire 2013. Further, in the present embodiment, the portion of the solder resist layer 80 corresponding to the LED arranging portions 35 to 38 in which the LED chips 41 to 44 are installed is also removed by photo edging and formed as the removed portions 81 to 84. There is. For example, in the examples shown in FIGS. 2 and ₃ , the removal portion 813 is formed in order to arrange the green LED chip 41 ₁ in the LED arrangement portion ₃₅₁ . Further, the portions corresponding to the external electrodes 51 to 54 and 61 to 64 are also removed by photo edging and formed as the removed portions. The wire bonding portions 81 to 84, the LED chip arranging portions 35 to 38, and the external electrodes 51 to 54, 61 to 64 opened in the solder resist layer 80 are plated with NiCrAu, NiPaAu, or the like in order to ensure connectivity. Surface treatment is preferred.

In the LED light source device 1 according to the present embodiment, the wirings 31 to 34 are electrically connected to each other by the bonding wires 201 to 204 in the formed removed portions 81 to 84. For example, in the example shown in FIGS. ₂ to ₅ , the wiring 313 exposed in the removal portion ₈₁₅ is connected to the wiring ₃₁₄ exposed in the removal portion ₈₁₆ by a bonding wire 2013.

Further, in the LED light source device 1 according to the present embodiment, in the formed removed portions 81 to 84, the wirings 31 to 34 in the same wiring system are connected to each other by the bonding wires 201 to 204, so that light of the same color is emitted. The LED chips 41 to 44 that emit light are connected in series to the external electrodes 51 to 54 and 61 to 64. For example, in the example shown in FIG. 4, the wiring 31 ₁ exposed by the removal portion ₈₁₁ and the wiring 31 ₂ exposed by the removal portion _{812 are} connected by _a bonding wire 2011, and the LED arrangement is performed in the removal portion 813. It is connected to the _bottom electrode of the green LED chip 411 arranged in the portion ₃₅₁ . Further, the _upper surface electrode of the green LED chip 411 exposed in the removed portion ₈₁₃ and the wiring 31 ₃ exposed in the removed portion 814 _are connected by a bonding wire ₂₀₁₂ , and the wiring 31 exposed in the removed portion ₈₁₅ . ₃ and the wiring _{3 14} exposed by the removed portion 816 _are connected by a bonding wire 2013. Further, the wiring ₃₁₄ is connected to the _lower surface electrode of the green LED chip ₄₂₁ arranged in the LED arranging portion ₃₅₂ in the removal portion 817. Further, the upper surface electrode of the green LED chip ₄₂₁ exposed in the removed portion ₈₁₇ and the wiring ₃₁₅ exposed in the removed portion _{818 are} connected by a bonding wire 2014, and the wiring 31 exposed in the removed portion _{891 5} and the wiring ₃₁₆ exposed by the removed portion 81 ₁₀ are connected by a bonding wire ₂₀₁₅ . Further _, the wiring ₃₁₆ is connected to the bottom electrode of the green LED chip 413 arranged in the LED arranging portion ₃₅₃ in the removal portion 81 ₁₁ . Further _, the upper surface electrode of the green LED chip 413 exposed by the removed portion 81 ₁₁ and the wiring ₃₁₇ exposed by the removed portion 81 ₁₂ are connected by the bonding wire ₂₀₁₆ . As described above, in the present embodiment, the wirings 31 ₁ to ₃₁₇ connecting the green LED chips 41 ₁ to ₄₁₄ are connected via the bonding wires 201 ₁ to ₂₀₁₆ to emit light of the same color. The green LED chips 41 ₁ to ₄₁₄ can be connected in series to the external electrodes 51 and 61 by the same wiring system. Similarly, in the other wirings 32 to 34, the LED chips 42 to 44 that emit light of the same color can be connected in series to the external electrodes 52 to 54, 62 to 64 in the same wiring system.

Further, in the LED light source device 1 according to the present embodiment, the bonding wires 201 to 204 are bonded to each other so that the bonding wires 201 to 204 connected to the wirings 31 to 34 straddle the other wirings 31 to 34. It is connected by ~ 204, and the wirings 31 to 34 and the bonding wires 201 to 204 are crossed on the same plane of the mounting board 10. For example, in the example shown in FIG. 5, the wiring 3 1 3 and the wiring ₃ 14 are connected by the bonding wire 2013 so as to straddle the wiring 33 ₃ and the wiring ₃ 34, so that the wiring _{3 3 3} and the wiring _{3 34 3 are} connected to each other. It intersects with the bonding wire ₂₀₁₃ . As described above, in the LED light source device 1 according to the present embodiment _, the wirings ₃₁₃ and the wirings 314 at distant positions can be electrically connected across the wirings ₃₃₃ and ₃₄₃ . In the present embodiment, it is possible to easily construct a wiring system by using a single-layer board even in a complicated wiring pattern that conventionally requires the use of a multi-layer board.

That is, in the conventional LED light source device, as shown in FIG. 5, when the wiring 3 1 ₃ and the wiring _{3 14 at distant positions are connected by sandwiching the wiring 333 and the wiring 3 34 ,} as shown in FIG. In addition, a configuration was adopted in which wiring was crossed in different layers by using a multilayer board having a multilayer structure. For example, in the example shown in FIG. 6, when wiring A and wiring B are connected so as to intersect with wiring D arranged on the same surface (first layer), via holes A and via holes are connected to wiring A and wiring B. By forming each B and forming the wiring C connecting the via hole A and the via hole B in the second layer above the first layer, it was necessary to intersect the wirings connected to different LED chips. .. On the other hand, in the present embodiment, since it is not necessary to use such a multi-layer structure, it is possible to easily construct a wiring system having a complicated wiring pattern even in a single-layer substrate. In FIG. 6, the wiring formed in the first layer is shown in black, the wiring formed in the second layer is shown in white, and the portion where the wiring in the first layer and the wiring in the second layer overlap is shown in gray. (The same applies to FIG. 7).

Further, as shown in FIG. 6, when a multilayer board is used in a conventional LED light source device, the LED chip arrangement portion is formed in the second layer, and the LED chip is arranged on the second layer, so that the LED chip generates heat. In order to dissipate heat from the mounting board, it is necessary to transfer the heat to the mounting board through the via hole, and the heat dissipation efficiency is higher than when a single-layer board such as the LED light source device 1 according to the present embodiment is used. There was a problem that the LED chips were lowered and the LED chips could not be arranged densely. On the other hand, in the LED light source device 1 according to the present embodiment, since the single-layer substrate can be used, the heat generated by the LED chips 41 to 44 can be efficiently transferred to the mounting substrate and dissipated. From the viewpoint of temperature control (heat generation control) of the LED light source device 1, it is possible to increase the density of the LED chips 41 to 44. Note that FIG. 6 is a diagram for explaining a wiring connection method of the conventional LED light source device.

Further, as compared with the conventional LED light source device, the LED light source device 1 according to the present embodiment can exert the following effects. That is, in the conventional LED light source device, when a via hole is formed, a via land is formed around the via hole. However, as shown in FIG. 7A, the distance between the via land and the wiring is set to prevent a short circuit. It is necessary to leave a certain interval (for example, 0.1 mm or more in this embodiment). For example, the outer diameter of the via land is about 0.4 mm at the smallest, and when 0.2 mm wiring is used to improve the density of the LED chips, the outer diameter of the via land becomes larger than the width of the wiring. It was necessary to widen the width between the wires by the amount of. For example, in the example shown in FIG. 7A, when the width of the wiring is 0.2 mm, the outer diameter of the via land is 0.4 mm, and the distance between the via land and the wiring is 0.1 mm, the width W1 between the LED chips is , A (0.1 mm) × 10 + b (0.2 mm) × 4 = 1.8 mm.

On the other hand, in the LED light source device 1 according to the present embodiment, it is not necessary to form a via hole as shown in FIG. 6, and the two wirings 31 to 34 are connected by using bonding wires 201 to 204. Therefore, in the LED light source device 1 according to the present embodiment, as shown in FIG. 7B, the distance between the wirings can be narrowed, the width of the wiring is 0.2 mm, and the interval between the wirings is 0. When it is .1 mm, the width W2 between the LED chips is a (0.1 mm) × 5 + b (0.2 mm) × 4 = 1.3 mm, which is narrower than 1.8 mm of the conventional LED light source device. can. As described above, in the LED light source device 1 according to the present embodiment, the distance between the wirings 31 to 34 can be shortened and the distance between the LED chips 41 to 44 can be shortened. Therefore, a plurality of types of LED chips 41 to 44 can be shortened. Can be mounted at high density at short intervals. Note that FIG. 7A is a diagram for explaining the wiring interval of the conventional LED light source device, and FIG. 7B is a diagram for explaining the wiring interval of the LED light source device according to the present embodiment.

Further, in the LED light source device 1 according to the present embodiment, since the mounting substrate 10 can have a single-layer structure, the heat generated by the LED chips 41 to 44 is transferred to the metal mounting substrate via the insulating layer 20. It is diffused to 10 and dissipated. On the other hand, the conventional LED light source device has a multi-layer structure and the LED chip is arranged on the uppermost layer. Therefore, as compared with the LED light source device 1 according to the present embodiment, between the LED chip and the mounting substrate. A large number of insulating layers of one or more layers are interspersed with the LED, or the LED is connected to the lower layer through a via, and the heat dissipation performance is lowered by that amount. Therefore, in the conventional LED light source device, if a plurality of LED chips are densely packed, the temperature becomes high, and there is a problem that it is difficult to reduce the size from the viewpoint of temperature control. On the other hand, the LED light source device 1 according to the present embodiment has high heat dissipation performance, and is also suitable for miniaturization from such a point.

Further, in the LED light source device 1 according to the present embodiment, only the portion of the solder resist layer 80 that connects the wirings 31 to 34 with the bonding wires 201 to 204 is removed, and the other portion is covered with the solder resist layer 80. This prevents the bonding wires 201 to 204 from coming into contact with the other wirings 31 to 34. For example, in the example shown in FIG. 5, the wiring 333 and the wiring ₃₄₃ are covered with the solder resist layer 80, so that the wiring _{331 3 and} the wiring _{314 are} connected by the bonding wire ₂₀₁₃ . And the wiring ₃₄₃ can be prevented from coming into contact with the bonding wire ₂₀₁₃ .

Further, in the LED light source device 1 according to the present embodiment, as shown in FIG. 5, a sealing resin layer 90 is formed on the solder resist layer 80. For the sealing resin layer 90, it is preferable to use a highly translucent resin containing a silicone resin or a glass epoxy resin as a main component. As shown in FIG. 5, the sealing resin layer 90 protects the bonding wires 201 to 204 from external impact by burying the bonding wires 201 to 204 in the layer, and the bonding wires 201 to 204 are cut. Prevent it from being stolen. Further, since the solder resist layer 80 is not formed in the removed portions 81 to 84, the sealing resin layer 90 directly connects the LED chips 41 to 44 mounted on the wirings 31 to 34 and the LED wiring layers 35 to 38. It also has a function of covering and protecting the wirings 31 to 34 and the LED chips 41 to 44.

Next, a method of manufacturing the LED light source device 1 according to the present embodiment will be described. In the LED light source device 1 according to the present embodiment, first, the insulating layer 20 is formed on the mounting substrate 10. Next, a copper foil is attached onto the insulating layer 20 and an unnecessary portion is removed by photoetching to form a wiring layer 30 having a desired wiring pattern. Subsequently, the solder resist layer 80 is formed on the entire surface of the mounting substrate 10 by applying a liquid resin such as a silicone resin containing a white inorganic pigment such as titanium oxide or affixing it with a seal on the wiring layer 30. Will be done. Further, in the solder resist layer 80, the portion corresponding to the LED arrangement portions 35 to 38, the portion connecting the wiring 31 to 34 and the bonding wire 201 to 204, and the external electrodes 51 to 54, 61 to 64 are supported. By removing the portion by photo etching, the removed portions 81 to 84 are formed. Further, the wirings 31 to 34 exposed in the removed portions 81 to 84, the LED arrangement portions 35 to 38, and the external electrodes 51 to 54, 61 to 64 are plated with NiCrAu, NiPaAu, or the like.

Then, among the removed portions 81 to 84, the corresponding LED chips 41 to 44 are installed in the portions where the LED arranging portions 35 to 38 are exposed. Further, in the portions of the wires 31 to 34 exposed in the removed portions 81 to 84, the wirings 31 to 34 and the bonding wires 201 to 204 are connected. For example, as shown in FIG. 5, the wiring 31 ₃ exposed in the removed portions 81 to 84 and the wiring ₃ 14 are welded to the bonding wire 2013, respectively, so that the wiring 31 straddles the wiring _{33 3} and the wiring ₃₄₃ . ₃ and wiring _{3 14} are connected by a bonding wire 2013. Further, a dam material 70 is formed on the solder resist layer 80 with a silicone resin or the like. Further, by filling the dam material 70 with the sealing resin, the sealing resin layer 90 that protects the LED chips 41 to 44 and the bonding wires 201 to 204 is formed. In this way, the LED light source device 1 according to the present embodiment is manufactured.

As described above, the LED light source device 1 according to the present embodiment connects the wirings 31 to 34 with the bonding wires 201 to 204 so as to straddle the other wirings 31 to 34, thereby connecting the wirings 31 to 34 with other wirings. Wiring 31 to 34 located at distant positions can be connected to each other with 31 to 34 in between, and even for complicated wiring patterns that conventionally required the use of a multilayer board, a wiring system using a single layer board. Can be easily constructed. In particular, in an LED light source device having four or more types of LED chips, the wiring pattern becomes complicated and it is difficult to construct a wiring system without crossing the wiring. Even when four or more types of LED chips 41 to 44 are used, the wiring systems 81 to 88 and 201 to 204 can be easily constructed.

Further, in the LED light source device 1 according to the present embodiment, since it is not necessary to adopt a multilayer board, it is not necessary to form a via hole on the board, and as shown in FIG. 7A, only the via holes and the via lands are required. There is no need to widen the wiring interval. Therefore, in the LED light source device 1 according to the present embodiment, the distance between the wirings 31 to 34 can be shortened, and the distance between the LED chips 41 to 44 can also be shortened, so that the LED chips 41 to 44 can be made dense. It can be integrated and the LED light source device 1 can be miniaturized.

Although the preferred embodiment of the present invention has been described above, the technical scope of the present invention is not limited to the description of the above embodiment. Various changes and improvements can be added to the above-described embodiments, and those in which such changes or improvements have been made are also included in the technical scope of the present invention.

In the above-described embodiment, a configuration in which the vertical (upper and lower surface electrodes) type LED chips 41 to 44 are connected to the wiring layer 30 with a bonding wire is exemplified, but the configuration is not limited to this configuration, and the horizontal (surface two electrodes) type is used. The LED chips 41 to 44 may be connected to the wiring layer 30 with a bonding wire, or the phase-down type LED chips 41 to 44 may be mounted on a flip chip.

Further, in the above-described embodiment, a configuration using four types of LED chips that emit light of different colors (wavelength range) of the green LED chip 41, the red LED chip 42, the blue LED chip 43, and the yellow LED chip 44 has been exemplified. However, the configuration is not limited to this, and for example, a configuration using two or three types or five or more types of LED chips can be used. Further, it is also possible to use a configuration in which an LED chip capable of exciting a phosphor (for example, only a blue LED chip having the same specifications) is used. In this case, for example, each blue LED chip is individually surrounded by a dam material, and the dam is filled with a transparent resin containing a phosphor that emits light such as red or green, so that a plurality of colors can be emitted. .. Then, when the wiring system is divided for each LED chip having a different color development and the wirings of the respective wiring systems are connected to each other, the bonding wire is connected so as to straddle the other wirings as described in the above embodiment. Can be done.

1 ... LED light source device 10 ... Mounting board 20 ... Insulation layer 30 ... Wiring layer 31-34 ... Wiring 35-38 ... LED arrangement part 41-44 ... LED chip 51-54, 61-64 ... External electrode 70 ... Dam material 80 ... Solder resist layer 81-84 ... Removal part 90 ... Sealing resin layer

Claims (4)

A mounting board that is a single-layer board and
With a plurality of wirings arranged on the mounting board,
An LED light source device having a plurality of sets of first to fourth color LED chips.
The plurality of wirings are the first wiring connected to the LED chip of the first color , the second wiring connected to the LED chip of the second color, and the third wiring connected to the LED chip of the third color. , And a fourth wire connected to the fourth color LED chip ,
The plurality of sets of the first to fourth color LED chips are adjacent to the light emitting part of the first row arranged in the first direction without being adjacent to the LED chips of the same color and to be adjacent to the LED chips of the same color. Including the second row of light emitting parts, which are arranged in the first direction without any problem.
The first to fourth light emitting units in the first row and the light emitting units in the second row are not adjacent to the LED chips of the same color even in the second direction orthogonal to the first direction. Colored LED chips are placed,
The first to fourth wirings are wired so as to extend in the first direction.
The LED chips of the light emitting unit in the first row and the light emitting unit in the second row are connected in series with the LED chips of the same color in the other light emitting units.
The LED chip of the light emitting unit in the first row and the LED chip of the light emitting unit in the second row are connected by a bonding wire so as to straddle the wiring of the LED chip having a color different from that of the LED chip. .. The LED light source device according to claim 1, wherein the first to fourth color LED chips include a green LED chip, a red LED chip, a blue LED chip, and a yellow LED chip . A solder resist layer is formed on the wiring layer on which the plurality of wirings are formed.
The LED light source device according to claim 1 or 2 , wherein the solder resist layer has a removed portion from which the first to fourth wires are removed at a portion connected to the bonding wire. The LED light source device according to any one of claims 1 to 3 , wherein the distance between the plurality of adjacent wirings is less than 0.2 mm.

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