JPS6269582A - Forming method for circuit of printed board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Table of contents] - Overview - Field of industrial application - Prior art - Problems to be solved by the invention - Means for solving the problems - Actions - Examples (Part 1. 2. Figure 3) - Effects of the invention [Summary] A basic wiring pattern is formed on an insulating substrate in advance,
By cutting (breaking) wiring patterns that are unnecessary for circuit formation using a laser beam, it is possible to easily form various desired circuit patterns from the same type of circuit board.

[Industrial application field]

The present invention relates to a method for forming a circuit on a printed board, and is particularly effective for digital circuits such as logic circuits and memory circuits, similar circuits, high-mix low-volume production, prototyping, etc. The present invention relates to a pattern forming method.

[Conventional technology]

The method of forming a circuit on a printed board involves forming a thin conductive film on an insulating substrate by vapor deposition, etc., applying a photoresist film on top of this, and then exposing a pattern to the photoresist film through a phenomenon and etching process. There is a method in which a thick film circuit pattern is printed on an insulating substrate by a screen printing method, and then formed through drying and firing steps.

For example, in the case of the latter (thick film circuit), the main steps are the following steps (at to (h)).

(a): Circuit diagram creation, (b): Pattern design, (C): Artwork film production, (d) Niscreen printing plate production (mask creation in case of thin film), (e): Circuit pattern formation (insulation sexual substrate-hini), el
: Printing e2: Drying (for example, about 150°C) e3: Baking (
- For example, about 800 to 900℃) (f): Completed circuit board formation, (g): Mounted electronic components, (h): Bathocaging (protective film formation, sealing inside the case,
coating formation, etc.).

In this way, in the conventional method, one type of artwork member such as a screen printing plate is required for one type of circuit board, that is, a corresponding artwork member is required for each different type of circuit board. Each member is required individually, and a method is adopted in which only the circuit patterns necessary for circuit formation are formed.

Further, as another conventional example, a conventional method disclosed in Japanese Patent Application Laid-open No. 55-125698 proposes a method in which discontinuous first A conductive pattern, an insulating part including a portion crossing over the first conductive pattern, and a continuous second conductive pattern extending in a direction orthogonal to the first conductive pattern via the insulating part are prepared in advance. and selecting a third conductor pattern that connects the first conductor patterns or between the first conductor pattern and the second conductor pattern in the same direction as the first conductor pattern. A method is adopted in which a desired circuit pattern is formed by forming the circuit pattern.

[Problem that the invention seeks to solve]

The conventional method described in the first part above is suitable for mass production of the same product, but for different types of circuit boards, artwork materials (exposure masks, screen printing plates, etc.) are required for each board.
There is a problem in that it requires a lot of man-hours (turns) and costs to produce the artwork member. In addition, another conventional method (Japanese Unexamined Patent Publication No. 5
No. 5-125698), in order to form a desired circuit pattern, a third
Since it is necessary to newly form a conductor pattern and selectively connect discontinuous points, this case also has the problem of requiring a large amount of man-hours and costs.

The present invention has been created in view of these problems, and is capable of creating a desired circuit pattern in a short time (short order) in high-mix, low-volume production or prototyping of printed boards, digital circuits, similar circuits, etc. ) and to provide a method that can be formed at low cost.

[Means for solving problems]

In order to solve the above problems, in the present invention, lands A1 to A1 are arranged vertically and horizontally at predetermined intervals at intersections of orthogonal grids.
2, vertical and horizontal connection patterns B1 and B2 that connect all of these lands, and vertical and horizontal connection patterns B1 and B that are interposed between the lands A1 and A12 and extend vertically and horizontally.
A basic wiring pattern 12 consisting of vertical and horizontal intermediate patterns CI and C2 that connect two vertical and horizontal intermediate patterns CI and C2, and an insulator that is interposed at the intersection of the vertical and horizontal intermediate patterns CI and C2 and insulates only the intersection from each other. is formed in advance on an insulating substrate 12, and unnecessary patterns are selectively disconnected by using a laser beam or the like to form a circuit in the basic wiring pattern 12,
Provided is a method for forming a circuit on a printed board, which is characterized by forming a desired circuit pattern.

[For production]

A basic wiring pattern (12) is formed in advance on an insulating substrate (11), and unnecessary patterns for circuit formation are cut (disconnected) using a laser beam to create a desired pattern from the same type of circuit board. Various circuit patterns can be easily formed.

〔Example〕

1 to 3 are explanatory diagrams of the method of the present invention.

FIG. 1 is an explanatory diagram of an embodiment of the method of the present invention, which shows a diagram (a) showing a basic wiring pattern, a diagram (b) showing a basic wiring pattern removed part (broken line part), and a diagram showing a part formed by unnecessary pattern removal. FIG. 2 is an explanatory diagram of an application example of the method of the present invention, and FIG. 3 is an example of a mask for forming the basic wiring pattern of FIG. 1 (A). FIG.

This example is an example of a single-sided printed board (10) in which a thick film pattern is formed on an insulating substrate, as shown in FIG. 1, and as shown in FIG. Basic wiring pattern (basic pattern) 12 on insulating substrate 11
is formed in advance. As shown in FIG. 1(a), this basic pattern 12 has a predetermined minimum unit interval (for example, 2.
54 m or 2.5011 pinch), parts mounting lands (first
In Figure (a), only parts mounting lands A1 to A12 are shown), and vertical and horizontal connection patterns Bl that connect all adjacent lands.

B2 (only one location is shown for each as a representative),
A first layer conductor pattern consisting of a first vertical and horizontal intermediate pattern C1 that is interposed between each land (A1 to A12) and extends in the horizontal direction and connects the vertical and horizontal connection patterns (B1) between the phase tiles; The lands (A1 to A12) are interposed between each other and extend in the vertical direction to connect the horizontal and vertical connection patterns (B2), and are connected only to the first vertical and horizontal intermediate pattern C1 and their intersections via an insulator. and a second layer conductor pattern which is insulated from each other and formed as a second vertical and horizontal intermediate pattern C2. In addition, in the case of this basic pattern 12, the case where the wiring pattern between lands is one through is illustrated, but this can be changed to two through between lands, or a mixed wiring of two through and one through. It is also possible to use various basic patterns such as patterns.

This basic pattern 12 can be formed by a conventional pattern forming method. For example, when forming a thick basic pattern, it can be formed using each mask (in this case, a screen printing plate) shown in FIG. That is, the first layer conductor pattern is printed on the insulating substrate 11 (FIG. 1) using the mask for the first layer conductor pattern shown in FIG. 3
Insulator D (first
Figure) is printed on a predetermined location of the first layer conductor pattern, dried and fired, and then the second layer conductor pattern is printed using the mask for the second layer conductor pattern shown in Figure 3 (c). death,
By completely drying and firing this, a basic pattern 12 as shown in FIG. 1(a) can be formed. Note that the order in which the first and second layer conductor patterns are formed may be reversed. One of the advantages of the method of the present invention is that once an artwork member such as a mask is produced, it can be used commonly for forming different types of circuit boards, and a new one can be created each time for each type of circuit board. There is no need to create a unique artwork member.

Now, in order to form a desired circuit pattern by the method of the present invention, a wiring pattern unnecessary for circuit pattern formation is selected in the basic wiring pattern 12 shown in FIG.
By removing (breaking) this using a laser beam, a desired circuit pattern can be easily formed. For example, if the pattern cut portion shown by symbol E (only one representative point is shown) in FIG. 1(b) is cut (broken) with a laser beam, a circuit pattern as shown in FIG. 1(c) will be formed. be able to. In this example, as shown by diagonal lines in FIG. A4, and land A7 is connected to land A9 via the first vertical and horizontal intermediate pattern C1.
It is connected to the. In this way, various desired circuit patterns can be formed from the same type of basic wiring pattern 12 in a very short time (short order).

Note that YAG laser light is preferable as the laser light for cutting unnecessary patterns. The method of cutting with a laser beam is to recognize the circuit diagram using a design automation system for pattern design, process the information of the pattern removal section with a computer, and use a numerical control (NC) method based on the output information. If the laser is controlled by this method, it is possible to precisely cut the pattern removal portions at a large number of locations in a very short time.

FIG. 2 is an explanatory diagram of an application example of the method of the present invention as described above. In the figure, reference numeral 15 indicates the entire printed board, 16 indicates a standard circuit area where the circuit is standardized and no circuit changes are made, and 17 indicates a circuit change area where the circuit can be changed as necessary.

If the method of the present invention is applied to the circuit modification area 17 of such a printed board 15, it is possible to create a circuit board with the same circuit for the most part and a circuit that differs locally from a circuit board having the same type of basic wiring pattern. It can be obtained easily and at low cost.

Note that the present invention is not limited to the above embodiments,
For example, a conductor pattern with a three-layer configuration or a conductor pattern with various wiring configurations may be used as the basic wiring pattern.
Furthermore, it is possible to apply the present invention to the entire printed circuit board or a part thereof, regardless of the size of the printed circuit board and whether the wiring is on one side or on two sides.

Moreover, as a pattern cutting method, it is also possible to use a sandblasting method other than laser.

〔Effect of the invention〕

As explained above, according to the present invention, a basic wiring pattern is formed on an insulating substrate in advance, and unnecessary pattern portions are cut out using a laser beam or the like for the desired circuit shape. Since various different types of circuit patterns can be easily formed from different types of circuit boards, there is no need to design patterns for each similar circuit (different type of circuit), and there is no need to create artwork components each time.
This makes it possible to significantly shorten the time for circuit formation (short-handling) and reduce costs, and also achieves significant effects such as shortening the delivery time of products when designing circuits. .

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram of an embodiment of the method of the present invention, FIG. 2 is an explanatory diagram of an application example of the method of the present invention, and FIG. 3 is a diagram showing an example of a mask for forming the basic wiring pattern (12) of FIG. 1. It is. In Figure 1.2, 10 and 15 are printed boards, 11 is an insulating board, 12 is a basic wiring pattern (basic pattern), 16 is a standard circuit area, 17 is a circuit modification area, and A1 to A12 are parts mounting lands. (or through-hole land), B1 and B2 are vertical and horizontal connection patterns in the vertical and horizontal directions, C1 and 02 are first and second vertical and horizontal intermediate patterns, D is an insulator, and E is a pattern cut portion, respectively. Illustration of an application example of the method of the present invention for pattern cutting 'IgT capital

Claims (1)

[Scope of Claims] 1. Lands (A1 to A12) arranged vertically and horizontally at predetermined intervals at intersections of orthogonal lattices, and vertical and horizontal connection patterns (B1, B2) that connect all of these lands; Vertical and horizontal intermediate patterns (C1, C2) interposed between the lands (A1 to A12) and extending vertically and horizontally to connect each of the vertical and horizontal connection patterns (B1, B2), and the vertical and horizontal intermediate patterns (C1, C2) A basic wiring pattern (12) is formed in advance on an insulating substrate (11), and consists of an insulator (D) that is interposed at the intersections of and insulates only the intersections from each other; A method for forming a circuit on a printed board, which comprises selectively removing disconnections in the pattern (12) that are unnecessary for circuit formation using a laser beam or the like to form a desired circuit pattern.