JP6506899B2 - 発光装置、集積型発光装置および発光モジュール - Google Patents

発光装置、集積型発光装置および発光モジュール Download PDF

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Publication number
JP6506899B2
JP6506899B2 JP2016197968A JP2016197968A JP6506899B2 JP 6506899 B2 JP6506899 B2 JP 6506899B2 JP 2016197968 A JP2016197968 A JP 2016197968A JP 2016197968 A JP2016197968 A JP 2016197968A JP 6506899 B2 JP6506899 B2 JP 6506899B2
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Prior art keywords
light
light emitting
emitting device
emitting element
wavelength
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JP2016197968A
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Japanese (ja)
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JP2017073549A (ja
Inventor
山田　元量
元量 山田
有一 山田
有一 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
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Nichia Corp
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Application filed by Nichia Corp filed Critical Nichia Corp
Priority to BR112018006931-0A priority Critical patent/BR112018006931B1/pt
Priority to TW109137811A priority patent/TWI799754B/zh
Priority to RU2018112372A priority patent/RU2717381C2/ru
Priority to KR1020160129813A priority patent/KR102632427B1/ko
Priority to US15/288,501 priority patent/US11101247B2/en
Priority to PCT/JP2016/004528 priority patent/WO2017061127A1/en
Priority to EP16192778.5A priority patent/EP3154096B1/en
Priority to CA2999401A priority patent/CA2999401A1/en
Priority to TW105132674A priority patent/TWI712181B/zh
Priority to AU2016238924A priority patent/AU2016238924B2/en
Priority to CN201611144127.6A priority patent/CN106571421B/zh
Priority to CN202110686880.2A priority patent/CN113437202A/zh
Publication of JP2017073549A publication Critical patent/JP2017073549A/ja
Publication of JP6506899B2 publication Critical patent/JP6506899B2/ja
Application granted granted Critical
Priority to US17/382,699 priority patent/US11515296B2/en
Priority to US17/974,666 priority patent/US11978725B2/en
Priority to US18/650,941 priority patent/US20240282758A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Planar Illumination Modules (AREA)
  • Led Devices (AREA)
JP2016197968A 2015-10-08 2016-10-06 発光装置、集積型発光装置および発光モジュール Active JP6506899B2 (ja)

Priority Applications (15)

Application Number Priority Date Filing Date Title
TW105132674A TWI712181B (zh) 2015-10-08 2016-10-07 發光裝置、整合式發光裝置、及發光模組
TW109137811A TWI799754B (zh) 2015-10-08 2016-10-07 整合式發光裝置、及發光模組
RU2018112372A RU2717381C2 (ru) 2015-10-08 2016-10-07 Светоизлучающее устройство, интегрированное светоизлучающее устройство и светоизлучающий модуль
KR1020160129813A KR102632427B1 (ko) 2015-10-08 2016-10-07 발광 디바이스, 통합 발광 디바이스 및 발광 모듈
US15/288,501 US11101247B2 (en) 2015-10-08 2016-10-07 Light-emitting device, integrated light-emitting device, and light-emitting module
PCT/JP2016/004528 WO2017061127A1 (en) 2015-10-08 2016-10-07 Light-emitting device, integrated light-emitting device, and light-emitting module
AU2016238924A AU2016238924B2 (en) 2015-10-08 2016-10-07 Light-emitting device, integrated light-emitting device, and light-emitting module
CA2999401A CA2999401A1 (en) 2015-10-08 2016-10-07 Light-emitting device, integrated light-emitting device, and light-emitting module
BR112018006931-0A BR112018006931B1 (pt) 2015-10-08 2016-10-07 Dispositivo emissor de luz, e, módulo emissor de luz
EP16192778.5A EP3154096B1 (en) 2015-10-08 2016-10-07 Light emitting device, integrated light emitting device and light emitting module comprising the same
CN201611144127.6A CN106571421B (zh) 2015-10-08 2016-10-08 发光装置、集成型发光装置及发光模块
CN202110686880.2A CN113437202A (zh) 2015-10-08 2016-10-08 发光装置、集成型发光装置及发光模块
US17/382,699 US11515296B2 (en) 2015-10-08 2021-07-22 Light-emitting device, integrated light-emitting device, and light-emitting module
US17/974,666 US11978725B2 (en) 2015-10-08 2022-10-27 Light-emitting device, integrated light-emitting device, and light-emitting module
US18/650,941 US20240282758A1 (en) 2015-10-08 2024-04-30 Light-emitting device, integrated light-emitting device, and light-emitting module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015200445 2015-10-08
JP2015200445 2015-10-08

Related Child Applications (1)

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JP2018079375A Division JP7175099B2 (ja) 2015-10-08 2018-04-17 発光装置、集積型発光装置および発光モジュール

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JP2017073549A JP2017073549A (ja) 2017-04-13
JP6506899B2 true JP6506899B2 (ja) 2019-04-24

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JP2016197968A Active JP6506899B2 (ja) 2015-10-08 2016-10-06 発光装置、集積型発光装置および発光モジュール
JP2018079375A Active JP7175099B2 (ja) 2015-10-08 2018-04-17 発光装置、集積型発光装置および発光モジュール
JP2021129946A Active JP7252483B2 (ja) 2015-10-08 2021-08-06 発光装置、集積型発光装置および発光モジュール

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JP2018079375A Active JP7175099B2 (ja) 2015-10-08 2018-04-17 発光装置、集積型発光装置および発光モジュール
JP2021129946A Active JP7252483B2 (ja) 2015-10-08 2021-08-06 発光装置、集積型発光装置および発光モジュール

Country Status (8)

Country Link
JP (3) JP6506899B2 (ru)
KR (1) KR102632427B1 (ru)
CN (2) CN113437202A (ru)
AU (1) AU2016238924B2 (ru)
BR (1) BR112018006931B1 (ru)
CA (1) CA2999401A1 (ru)
RU (1) RU2717381C2 (ru)
TW (2) TWI712181B (ru)

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CN116884966A (zh) 2017-07-21 2023-10-13 日亚化学工业株式会社 背光装置以及光源
CN109390327B (zh) * 2017-08-02 2020-10-30 吴裕朝 发光装置、应用其的背光模组、光源模组及其制备方法
JP7522529B2 (ja) * 2017-08-31 2024-07-25 日亜化学工業株式会社 発光装置
KR102631105B1 (ko) * 2017-08-31 2024-01-30 니치아 카가쿠 고교 가부시키가이샤 발광 장치
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JP7174216B2 (ja) * 2017-10-23 2022-11-17 日亜化学工業株式会社 発光モジュールおよび集積型発光モジュール
JP7077202B2 (ja) * 2017-10-26 2022-05-30 晶元光電股▲ふん▼有限公司 発光装置
JP6870592B2 (ja) 2017-11-24 2021-05-12 豊田合成株式会社 発光装置
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JP7180552B2 (ja) * 2019-06-21 2022-11-30 豊田合成株式会社 発光装置の製造管理方法
JP7226131B2 (ja) 2019-06-25 2023-02-21 豊田合成株式会社 発光装置及びその製造方法
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JP7143967B1 (ja) * 2020-10-20 2022-09-29 大日本印刷株式会社 面発光装置、表示装置、面発光装置用封止部材シートおよび面発光装置の製造方法
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RU2018112372A3 (ru) 2019-12-05
JP7175099B2 (ja) 2022-11-18
JP2021170688A (ja) 2021-10-28
CN106571421A (zh) 2017-04-19
AU2016238924B2 (en) 2021-06-10
RU2717381C2 (ru) 2020-03-23
TW202112181A (zh) 2021-03-16
CN113437202A (zh) 2021-09-24
KR20170044032A (ko) 2017-04-24
BR112018006931A2 (pt) 2018-10-16
KR102632427B1 (ko) 2024-01-31
CA2999401A1 (en) 2017-04-13
BR112018006931B1 (pt) 2022-11-29
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JP2017073549A (ja) 2017-04-13
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