JP6503334B2 - 銅ピラー取り付け基板 - Google Patents

銅ピラー取り付け基板 Download PDF

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Publication number
JP6503334B2
JP6503334B2 JP2016500941A JP2016500941A JP6503334B2 JP 6503334 B2 JP6503334 B2 JP 6503334B2 JP 2016500941 A JP2016500941 A JP 2016500941A JP 2016500941 A JP2016500941 A JP 2016500941A JP 6503334 B2 JP6503334 B2 JP 6503334B2
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JP
Japan
Prior art keywords
traces
solder resist
assembly
layer
trace
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JP2016500941A
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English (en)
Japanese (ja)
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JP2016519420A (ja
JP2016519420A5 (enExample
Inventor
シャヒディ ニマ
シャヒディ ニマ
Original Assignee
日本テキサス・インスツルメンツ合同会社
テキサス インスツルメンツ インコーポレイテッド
テキサス インスツルメンツ インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日本テキサス・インスツルメンツ合同会社, テキサス インスツルメンツ インコーポレイテッド, テキサス インスツルメンツ インコーポレイテッド filed Critical 日本テキサス・インスツルメンツ合同会社
Publication of JP2016519420A publication Critical patent/JP2016519420A/ja
Publication of JP2016519420A5 publication Critical patent/JP2016519420A5/ja
Application granted granted Critical
Publication of JP6503334B2 publication Critical patent/JP6503334B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49894—Materials of the insulating layers or coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Ceramic Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP2016500941A 2013-03-13 2014-03-10 銅ピラー取り付け基板 Active JP6503334B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/798,678 2013-03-13
US13/798,678 US8896118B2 (en) 2013-03-13 2013-03-13 Electronic assembly with copper pillar attach substrate
PCT/US2014/022334 WO2014164402A1 (en) 2013-03-13 2014-03-10 Copper pillar attach substrate

Publications (3)

Publication Number Publication Date
JP2016519420A JP2016519420A (ja) 2016-06-30
JP2016519420A5 JP2016519420A5 (enExample) 2017-04-13
JP6503334B2 true JP6503334B2 (ja) 2019-04-17

Family

ID=51523877

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016500941A Active JP6503334B2 (ja) 2013-03-13 2014-03-10 銅ピラー取り付け基板

Country Status (4)

Country Link
US (1) US8896118B2 (enExample)
JP (1) JP6503334B2 (enExample)
CN (1) CN105190879B (enExample)
WO (1) WO2014164402A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6777148B2 (ja) * 2016-07-28 2020-10-28 三菱電機株式会社 半導体装置
JP6691031B2 (ja) * 2016-10-05 2020-04-28 新光電気工業株式会社 配線基板及びその製造方法、半導体パッケージ
CN109729639B (zh) * 2018-12-24 2020-11-20 奥特斯科技(重庆)有限公司 在无芯基板上包括柱体的部件承载件

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11191672A (ja) * 1997-12-25 1999-07-13 Victor Co Of Japan Ltd プリント配線基板
JP3891838B2 (ja) * 2001-12-26 2007-03-14 株式会社ルネサステクノロジ 半導体装置およびその製造方法
JP3829325B2 (ja) * 2002-02-07 2006-10-04 日本電気株式会社 半導体素子およびその製造方法並びに半導体装置の製造方法
KR100722645B1 (ko) * 2006-01-23 2007-05-28 삼성전기주식회사 반도체 패키지용 인쇄회로기판 및 그 제조방법
JP2008098402A (ja) * 2006-10-12 2008-04-24 Renesas Technology Corp 半導体装置およびその製造方法
KR20090080623A (ko) * 2008-01-22 2009-07-27 삼성전기주식회사 포스트 범프 및 그 형성방법
JP5088489B2 (ja) * 2008-03-03 2012-12-05 セイコーエプソン株式会社 半導体モジュール及びその製造方法
US7851345B2 (en) * 2008-03-19 2010-12-14 Stats Chippac, Ltd. Semiconductor device and method of forming oxide layer on signal traces for electrical isolation in fine pitch bonding
WO2010103934A1 (ja) * 2009-03-12 2010-09-16 ナミックス株式会社 アンダーフィル材、及び、電子部品の実装方法
KR101609023B1 (ko) 2009-12-23 2016-04-04 스카이워크스 솔루션즈, 인코포레이티드 표면 마운트 스파크 갭
US8587119B2 (en) * 2010-04-16 2013-11-19 Taiwan Semiconductor Manufacturing Company, Ltd. Conductive feature for semiconductor substrate and method of manufacture
US8367467B2 (en) 2010-04-21 2013-02-05 Stats Chippac, Ltd. Semiconductor method of forming bump on substrate to prevent ELK ILD delamination during reflow process
US9905524B2 (en) * 2011-07-29 2018-02-27 Taiwan Semiconductor Manufacturing Company, Ltd. Bump structures in semiconductor device and packaging assembly

Also Published As

Publication number Publication date
JP2016519420A (ja) 2016-06-30
US8896118B2 (en) 2014-11-25
CN105190879B (zh) 2018-07-03
US20140264829A1 (en) 2014-09-18
CN105190879A (zh) 2015-12-23
WO2014164402A1 (en) 2014-10-09

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