JP6500987B2 - 積層配線基板およびこれを備えるプローブカード - Google Patents

積層配線基板およびこれを備えるプローブカード Download PDF

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Publication number
JP6500987B2
JP6500987B2 JP2017525284A JP2017525284A JP6500987B2 JP 6500987 B2 JP6500987 B2 JP 6500987B2 JP 2017525284 A JP2017525284 A JP 2017525284A JP 2017525284 A JP2017525284 A JP 2017525284A JP 6500987 B2 JP6500987 B2 JP 6500987B2
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Japan
Prior art keywords
layer
electrode
resin
core substrate
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017525284A
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English (en)
Japanese (ja)
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JPWO2016204209A1 (ja
Inventor
竹村　忠治
忠治 竹村
鉄三 原
鉄三 原
正樹 葛西
正樹 葛西
徹 目黒
徹 目黒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of JPWO2016204209A1 publication Critical patent/JPWO2016204209A1/ja
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Publication of JP6500987B2 publication Critical patent/JP6500987B2/ja
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2017525284A 2015-06-19 2016-06-16 積層配線基板およびこれを備えるプローブカード Active JP6500987B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015124027 2015-06-19
JP2015124027 2015-06-19
PCT/JP2016/067878 WO2016204209A1 (ja) 2015-06-19 2016-06-16 積層配線基板およびこれを備えるプローブカード

Publications (2)

Publication Number Publication Date
JPWO2016204209A1 JPWO2016204209A1 (ja) 2018-04-05
JP6500987B2 true JP6500987B2 (ja) 2019-04-17

Family

ID=57545710

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017525284A Active JP6500987B2 (ja) 2015-06-19 2016-06-16 積層配線基板およびこれを備えるプローブカード

Country Status (3)

Country Link
JP (1) JP6500987B2 (ko)
KR (1) KR102014111B1 (ko)
WO (1) WO2016204209A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI663407B (zh) * 2018-06-06 2019-06-21 中華精測科技股份有限公司 探針卡裝置及其立體式信號轉接結構

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007234659A (ja) * 2006-02-27 2007-09-13 Kyocera Corp 基板およびそれを用いた電子装置
JP2009081334A (ja) * 2007-09-27 2009-04-16 Aisin Aw Co Ltd 多層プリント配線基板及びその製造方法。
JP5574917B2 (ja) 2010-03-25 2014-08-20 京セラ株式会社 多層配線基板
JP5764897B2 (ja) * 2010-09-29 2015-08-19 凸版印刷株式会社 半導体パッケージ基板の検査方法
US20140158414A1 (en) * 2012-12-11 2014-06-12 Chris Baldwin Recessed discrete component mounting on organic substrate
JP5958454B2 (ja) * 2013-12-05 2016-08-02 株式会社村田製作所 部品内蔵モジュール

Also Published As

Publication number Publication date
KR20170132267A (ko) 2017-12-01
JPWO2016204209A1 (ja) 2018-04-05
WO2016204209A1 (ja) 2016-12-22
KR102014111B1 (ko) 2019-08-26

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