JP6492641B2 - 基板 - Google Patents

基板 Download PDF

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Publication number
JP6492641B2
JP6492641B2 JP2014263125A JP2014263125A JP6492641B2 JP 6492641 B2 JP6492641 B2 JP 6492641B2 JP 2014263125 A JP2014263125 A JP 2014263125A JP 2014263125 A JP2014263125 A JP 2014263125A JP 6492641 B2 JP6492641 B2 JP 6492641B2
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JP
Japan
Prior art keywords
land
substrate
screw
hole
surface portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014263125A
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English (en)
Japanese (ja)
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JP2016122787A (ja
Inventor
賢一 竹島
賢一 竹島
孝広 杵鞭
孝広 杵鞭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2014263125A priority Critical patent/JP6492641B2/ja
Priority to DE102015226707.5A priority patent/DE102015226707A1/de
Publication of JP2016122787A publication Critical patent/JP2016122787A/ja
Application granted granted Critical
Publication of JP6492641B2 publication Critical patent/JP6492641B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142—Spacers not being card guides

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2014263125A 2014-12-25 2014-12-25 基板 Active JP6492641B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014263125A JP6492641B2 (ja) 2014-12-25 2014-12-25 基板
DE102015226707.5A DE102015226707A1 (de) 2014-12-25 2015-12-23 Elektronische Vorrichtung und Substrat

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014263125A JP6492641B2 (ja) 2014-12-25 2014-12-25 基板

Publications (2)

Publication Number Publication Date
JP2016122787A JP2016122787A (ja) 2016-07-07
JP6492641B2 true JP6492641B2 (ja) 2019-04-03

Family

ID=56116866

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014263125A Active JP6492641B2 (ja) 2014-12-25 2014-12-25 基板

Country Status (2)

Country Link
JP (1) JP6492641B2 (de)
DE (1) DE102015226707A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016212528B4 (de) 2015-07-15 2022-05-05 Denso Corporation Elektronische Vorrichtung
CN214754244U (zh) 2017-02-03 2021-11-16 株式会社村田制作所 内插件以及电子设备
JP2019121747A (ja) * 2018-01-11 2019-07-22 三洋テクノソリューションズ鳥取株式会社 回路基板
JP2019121746A (ja) * 2018-01-11 2019-07-22 三洋テクノソリューションズ鳥取株式会社 回路基板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06310819A (ja) * 1993-04-26 1994-11-04 Hitachi Telecom Technol Ltd 印刷配線板構造
JPH08236878A (ja) * 1995-02-24 1996-09-13 Sony Tektronix Corp 回路基板のビス穴構体
JP3432361B2 (ja) * 1996-07-08 2003-08-04 株式会社三協精機製作所 スピンドルモータ
JP4113969B2 (ja) * 2002-11-08 2008-07-09 株式会社豊田自動織機 プリント配線板
JP5254752B2 (ja) * 2008-11-11 2013-08-07 株式会社カネカ 多層ポリイミドフィルム
JP2013015508A (ja) 2011-06-06 2013-01-24 Ricoh Co Ltd 基板検査用治具及び基板検査方法
JP5307278B2 (ja) * 2012-07-18 2013-10-02 株式会社東海理化電機製作所 回路基板

Also Published As

Publication number Publication date
DE102015226707A1 (de) 2016-06-30
JP2016122787A (ja) 2016-07-07

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