JP6486535B1 - インダクター及びその製造方法 - Google Patents
インダクター及びその製造方法 Download PDFInfo
- Publication number
- JP6486535B1 JP6486535B1 JP2018098322A JP2018098322A JP6486535B1 JP 6486535 B1 JP6486535 B1 JP 6486535B1 JP 2018098322 A JP2018098322 A JP 2018098322A JP 2018098322 A JP2018098322 A JP 2018098322A JP 6486535 B1 JP6486535 B1 JP 6486535B1
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- opening
- coil pattern
- insulator
- inductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 36
- 239000012212 insulator Substances 0.000 claims abstract description 57
- 238000000034 method Methods 0.000 claims description 29
- 239000000758 substrate Substances 0.000 claims description 29
- 239000004020 conductor Substances 0.000 claims description 23
- 239000010409 thin film Substances 0.000 claims description 17
- 238000007747 plating Methods 0.000 claims description 14
- 238000010030 laminating Methods 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 238000000059 patterning Methods 0.000 claims description 8
- 239000000945 filler Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 111
- 239000000463 material Substances 0.000 description 12
- 239000000696 magnetic material Substances 0.000 description 8
- 238000005530 etching Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007730 finishing process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000006249 magnetic particle Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
- H01F27/323—Insulation between winding turns, between winding layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/042—Printed circuit coils by thin film techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/12—Insulating of windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/12—Insulating of windings
- H01F41/122—Insulating between turns or between winding layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F2017/048—Fixed inductances of the signal type with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
【解決手段】インダクターは、貫通孔及びビアホールvを含む支持部材121と、支持部材121により支持され、開口122hを有する絶縁体122と、支持部材121により支持され、開口122h内に配置され、且つ支持部材121と接触するシード層を含む複数層で構成されるコイルパターン123と、を含む本体と、本体の外部面上に配置される外部電極22を含む。支持部材121は少なくとも第1絶縁層1211及び第2絶縁層1212の積層構造を有し、ビアホールvは第1絶縁層1211及び第2絶縁層1212をともに貫通する。
【選択図】図2
Description
図1は本発明の一例によるインダクターの斜視図であり、図2は図1のI−I'線に沿って切断した断面図である。
以下、上記インダクター100の一製造方法について説明する。後述の製造方法は、インダクター100を製造するための製造方法の一例示にすぎない。
21、22 第1及び第2外部電極
1 本体
21、22 第1及び第2外部電極
11 磁性材料
120 コイル部
121 支持部材
122 絶縁体
123 コイルパターン
Claims (19)
- 貫通孔及びビアホールを含む支持部材と、前記支持部材により支持され、第1開口を含む絶縁体と、前記支持部材により支持され、且つ前記第1開口内に配置され、前記支持部材と接触するシード層を含む複数層で構成されるコイルパターンと、を含む本体と、
前記本体の外部面上に配置される外部電極と、を含むインダクターであって、
前記支持部材は少なくとも第1及び第2絶縁層の積層構造を有し、前記ビアホールは前記第1及び第2絶縁層をともに貫通し、
前記第2絶縁層は第2開口を含み、
前記第2絶縁層の第2開口の幅は、前記絶縁体の第1開口の幅より小さい、インダクター。 - 前記第2開口は、前記絶縁体の第1開口に対応する形状を有する、請求項1に記載のインダクター。
- 前記シード層は前記第2開口の内部に配置される、請求項1または2に記載のインダクター。
- 前記第1絶縁層の厚さは10μm以上60μm未満の範囲であり、前記第2絶縁層の厚さは5μm以上20μm以下の範囲である、請求項1から3のいずれか一項に記載のインダクター。
- 前記コイルパターンは、前記支持部材の一面に配置される上部コイルパターンと、前記一面と向い合う他面に配置される下部コイルパターンと、を含む、請求項1から4のいずれか一項に記載のインダクター。
- 前記上部コイルパターンと前記下部コイルパターンは、前記ビアホールに充填されたシード層によって互いに電気的に連結される、請求項5に記載のインダクター。
- 前記上部コイルパターンは、下面の幅が上面の幅より狭いT字状の断面形状を有し、前記下部コイルパターンは、長方形の断面形状を有する、請求項5または6に記載のインダクター。
- 前記下部コイルパターンはシード層を含まない、請求項5から7のいずれか一項に記載のインダクター。
- 前記第1絶縁層は、ガラスフィラー、PID樹脂、ABF、またはFR−4である、請求項1から8のいずれか一項に記載のインダクター。
- 前記第2絶縁層はPID樹脂またはABFを含む、請求項1から9のいずれか一項に記載のインダクター。
- 基板を準備する段階と、
前記基板上に第1絶縁体をラミネートする段階と、
前記基板の一部を露出させることで、前記第1絶縁体が第1開口を有するようにパターニングする段階と、
前記第1開口の内部に第1コイルパターンを形成する段階と、
前記第1コイルパターンと前記第1絶縁体上に第1絶縁層をラミネートする段階と、
前記第1絶縁層上に第2絶縁層をラミネートする段階と、
前記第2絶縁層の少なくとも一部を除去することで、前記第1絶縁層が露出するように前記第2絶縁層の少なくとも一部を開口させる段階と、
前記第1及び第2絶縁層上に薄膜導体層を形成する段階と、
前記薄膜導体層の残部をシード層に転換するように、前記薄膜導体層の少なくとも一部を除去する段階と、
前記シード層を埋め込むように第2絶縁体をラミネートする段階と、
前記シード層を露出させることで、前記第2絶縁体が第2開口を有するようにパターニングする段階と、
前記第2開口の内部にめっき層を形成する段階であって、前記シード層及び前記めっき層を含む第2コイルパターンを形成するように前記めっき層を形成する段階と、
前記第1及び第2コイルパターン、ならびにその間に配置される第1及び第2絶縁層を含むコイル部を形成するように前記基板を除去する段階と、
前記コイル部の前記第1及び第2コイルパターンと連結されることができる外部電極を形成する段階と、を含む、インダクターの製造方法。 - 前記基板は、中心コアと、前記中心コアの上面及び下面にコーティングされた導電性物質と、からなる構造を有する、請求項11に記載のインダクターの製造方法。
- 前記基板の導電性物質は中心コアから除去された後、連続して前記コイル部から除去される、請求項12に記載のインダクターの製造方法。
- 前記第2絶縁層の開口の線幅は前記第2絶縁体の開口の線幅に比べて狭い、請求項11から13のいずれか一項に記載のインダクターの製造方法。
- 前記薄膜導体層を前記シード層に転換した後、前記第2絶縁層の上面の少なくとも一部が前記シード層から露出するようにする、請求項12または13に記載のインダクターの製造方法。
- 前記第1開口は前記第2開口に対応する形状を有する、請求項11から15のいずれか一項に記載のインダクターの製造方法。
- 前記第1絶縁体の第1開口内を充填するコイルパターンは、前記基板の導電性物質をベースとして成長する、請求項11から16のいずれか一項に記載のインダクターの製造方法。
- 前記基板の厚さが、前記第1及び第2絶縁層の厚さより厚い、請求項11から17のいずれか一項に記載のインダクターの製造方法。
- 前記第1絶縁層は、ガラスフィラー、PID樹脂、ABF、またはFR−4を含み、前記第2絶縁層はPID樹脂またはABFを含む、請求項11から18のいずれか一項に記載のインダクターの製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020170169456A KR102047595B1 (ko) | 2017-12-11 | 2017-12-11 | 인덕터 및 그 제조방법 |
KR10-2017-0169456 | 2017-12-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6486535B1 true JP6486535B1 (ja) | 2019-03-20 |
JP2019106523A JP2019106523A (ja) | 2019-06-27 |
Family
ID=65802306
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018098322A Active JP6486535B1 (ja) | 2017-12-11 | 2018-05-22 | インダクター及びその製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US11205538B2 (ja) |
JP (1) | JP6486535B1 (ja) |
KR (1) | KR102047595B1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102064041B1 (ko) | 2017-12-11 | 2020-01-08 | 삼성전기주식회사 | 코일 부품 |
US11958583B2 (en) | 2019-06-06 | 2024-04-16 | Nhk Spring Co., Ltd. | Automatic setting device, automatic setting method, and program |
JP7211323B2 (ja) * | 2019-10-08 | 2023-01-24 | 株式会社村田製作所 | インダクタ部品、及びインダクタ部品の製造方法 |
JP2021082662A (ja) * | 2019-11-15 | 2021-05-27 | Tdk株式会社 | コイル部品 |
CN110993248B (zh) * | 2019-12-10 | 2021-10-26 | 广东电网有限责任公司 | 一种高温超导线圈及其固化方法 |
KR20220033744A (ko) * | 2020-09-10 | 2022-03-17 | 삼성전기주식회사 | 코일 부품 및 그 실장 기판 |
KR102450601B1 (ko) * | 2020-11-23 | 2022-10-07 | 삼성전기주식회사 | 코일 부품 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5615012U (ja) * | 1979-07-16 | 1981-02-09 | ||
JPS61124117A (ja) * | 1984-11-20 | 1986-06-11 | Matsushita Electric Ind Co Ltd | プリントコイルの製造方法 |
JP2006332147A (ja) * | 2005-05-24 | 2006-12-07 | Matsushita Electric Ind Co Ltd | コイル導電体およびその製造方法並びにそれを用いたコイル部品の製造方法 |
JP2009010268A (ja) * | 2007-06-29 | 2009-01-15 | Asahi Kasei Electronics Co Ltd | 平面コイルおよびその製造方法 |
US20160005527A1 (en) * | 2014-07-02 | 2016-01-07 | Samsung Electro-Mechanics Co., Ltd. | Coil unit for thin film inductor, manufacturing method of coil unit for thin film inductor, thin film inductor and manufacturing method of thin film inductor |
JP2017204629A (ja) * | 2016-05-13 | 2017-11-16 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | コイル部品及びその製造方法 |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1979000383A1 (en) * | 1977-12-13 | 1979-06-28 | Fujitsu Ltd | Thin-film coil producing method |
US6600404B1 (en) * | 1998-01-12 | 2003-07-29 | Tdk Corporation | Planar coil and planar transformer, and process of fabricating a high-aspect conductive device |
KR19990066108A (ko) | 1998-01-21 | 1999-08-16 | 구자홍 | 박막 인덕터 및 그 제조방법 |
US8178435B2 (en) * | 1998-12-21 | 2012-05-15 | Megica Corporation | High performance system-on-chip inductor using post passivation process |
US20030122175A1 (en) * | 2001-12-28 | 2003-07-03 | Buskirk Peter Van | Integrated passive devices formed by demascene processing |
JP3842724B2 (ja) * | 2002-11-29 | 2006-11-08 | アルプス電気株式会社 | 磁気ヘッドの製造方法 |
US6852605B2 (en) * | 2003-05-01 | 2005-02-08 | Chartered Semiconductor Manufacturing Ltd. | Method of forming an inductor with continuous metal deposition |
US7194798B2 (en) * | 2004-06-30 | 2007-03-27 | Hitachi Global Storage Technologies Netherlands B.V. | Method for use in making a write coil of magnetic head |
JP2007067214A (ja) | 2005-08-31 | 2007-03-15 | Taiyo Yuden Co Ltd | パワーインダクタ |
US7759776B2 (en) * | 2006-03-28 | 2010-07-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Space transformer having multi-layer pad structures |
US8410576B2 (en) * | 2010-06-16 | 2013-04-02 | National Semiconductor Corporation | Inductive structure and method of forming the inductive structure with an attached core structure |
WO2012053439A1 (ja) * | 2010-10-21 | 2012-04-26 | Tdk株式会社 | コイル部品及びその製造方法 |
JP6215518B2 (ja) | 2011-08-26 | 2017-10-18 | ローム株式会社 | 磁性金属基板およびインダクタンス素子 |
KR101397488B1 (ko) * | 2012-07-04 | 2014-05-20 | 티디케이가부시기가이샤 | 코일 부품 및 그의 제조 방법 |
JP5294288B1 (ja) * | 2012-10-30 | 2013-09-18 | 株式会社Leap | 樹脂基板を用い、電気鋳造によりコイル素子を製造する方法 |
JP6312997B2 (ja) * | 2013-07-31 | 2018-04-18 | 新光電気工業株式会社 | コイル基板及びその製造方法、インダクタ |
KR101973410B1 (ko) * | 2013-08-14 | 2019-09-02 | 삼성전기주식회사 | 박막 인덕터용 코일 유닛, 박막 인덕터용 코일 유닛의 제조방법, 박막 인덕터 및 박막 인덕터의 제조방법 |
KR102069629B1 (ko) * | 2014-05-08 | 2020-01-23 | 삼성전기주식회사 | 칩 전자부품 및 그 제조방법 |
KR101642610B1 (ko) * | 2014-12-30 | 2016-07-25 | 삼성전기주식회사 | 코일 부품 및 그 제조 방법 |
KR102260374B1 (ko) * | 2015-03-16 | 2021-06-03 | 삼성전기주식회사 | 인덕터 및 인덕터의 제조 방법 |
KR101693749B1 (ko) * | 2015-04-06 | 2017-01-06 | 삼성전기주식회사 | 인덕터 소자 및 그 제조방법 |
JP6716865B2 (ja) * | 2015-06-30 | 2020-07-01 | Tdk株式会社 | コイル部品 |
KR102145314B1 (ko) * | 2015-07-31 | 2020-08-18 | 삼성전기주식회사 | 코일 부품 및 그 제조 방법 |
KR102138888B1 (ko) * | 2015-11-18 | 2020-07-28 | 삼성전기주식회사 | 코일 부품 및 그 제조 방법 |
KR101792364B1 (ko) | 2015-12-18 | 2017-11-01 | 삼성전기주식회사 | 코일 부품 및 그 제조 방법 |
JP6738635B2 (ja) * | 2016-03-31 | 2020-08-12 | 太陽誘電株式会社 | コイル部品 |
KR102450603B1 (ko) * | 2016-06-24 | 2022-10-07 | 삼성전기주식회사 | 박막 인덕터 및 그 제조방법 |
KR101952872B1 (ko) * | 2017-06-23 | 2019-05-17 | 삼성전기주식회사 | 코일 부품 및 그의 제조방법 |
-
2017
- 2017-12-11 KR KR1020170169456A patent/KR102047595B1/ko active IP Right Grant
-
2018
- 2018-05-17 US US15/982,645 patent/US11205538B2/en active Active
- 2018-05-22 JP JP2018098322A patent/JP6486535B1/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5615012U (ja) * | 1979-07-16 | 1981-02-09 | ||
JPS61124117A (ja) * | 1984-11-20 | 1986-06-11 | Matsushita Electric Ind Co Ltd | プリントコイルの製造方法 |
JP2006332147A (ja) * | 2005-05-24 | 2006-12-07 | Matsushita Electric Ind Co Ltd | コイル導電体およびその製造方法並びにそれを用いたコイル部品の製造方法 |
JP2009010268A (ja) * | 2007-06-29 | 2009-01-15 | Asahi Kasei Electronics Co Ltd | 平面コイルおよびその製造方法 |
US20160005527A1 (en) * | 2014-07-02 | 2016-01-07 | Samsung Electro-Mechanics Co., Ltd. | Coil unit for thin film inductor, manufacturing method of coil unit for thin film inductor, thin film inductor and manufacturing method of thin film inductor |
JP2017204629A (ja) * | 2016-05-13 | 2017-11-16 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | コイル部品及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US11205538B2 (en) | 2021-12-21 |
US20190180913A1 (en) | 2019-06-13 |
KR20190069076A (ko) | 2019-06-19 |
KR102047595B1 (ko) | 2019-11-21 |
JP2019106523A (ja) | 2019-06-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6486535B1 (ja) | インダクター及びその製造方法 | |
US11551850B2 (en) | Coil component and method for fabricating the same | |
JP4450071B2 (ja) | 電子部品 | |
TW201346951A (zh) | 電磁元件及其線圈結構 | |
JP6560398B2 (ja) | インダクタ | |
CN115458299A (zh) | 线圈组件及其制造方法 | |
CN109903967B (zh) | 线圈组件 | |
KR102430636B1 (ko) | 코일 부품 | |
KR101983190B1 (ko) | 박막 인덕터 | |
WO2021079697A1 (ja) | コイル部品及びその製造方法 | |
US11488762B2 (en) | Chip inductor and method of manufacturing the same | |
CN109903975B (zh) | 线圈组件 | |
US11227716B2 (en) | Inductor | |
JP6485984B1 (ja) | コイル部品 | |
US20230071379A1 (en) | Coil component and manufacturing method therefor | |
US11145457B2 (en) | Coil component and method for manufacturing the same | |
JP7168143B2 (ja) | インダクタ | |
JP2015115515A (ja) | インダクタの製造方法 | |
JP2006310758A (ja) | 回路配線板、及びその製造方法 | |
JP2004221177A (ja) | コイル部品 | |
KR100678420B1 (ko) | 진동모터용 박막코일 및 그 제조방법 | |
JP2004221178A (ja) | コイル部品の製造方法 | |
JP2004193469A (ja) | コイル部品及びその製造方法 | |
JP2004327524A (ja) | コイル部品及びその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180522 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20181009 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190108 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20190122 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20190219 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6486535 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |