JP6486478B2 - ウエハー移送装置 - Google Patents
ウエハー移送装置 Download PDFInfo
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- JP6486478B2 JP6486478B2 JP2017536278A JP2017536278A JP6486478B2 JP 6486478 B2 JP6486478 B2 JP 6486478B2 JP 2017536278 A JP2017536278 A JP 2017536278A JP 2017536278 A JP2017536278 A JP 2017536278A JP 6486478 B2 JP6486478 B2 JP 6486478B2
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- 238000012546 transfer Methods 0.000 title claims description 97
- 235000012431 wafers Nutrition 0.000 claims description 217
- 238000012545 processing Methods 0.000 claims description 84
- 238000001514 detection method Methods 0.000 claims description 25
- 238000005530 etching Methods 0.000 claims description 16
- 238000003672 processing method Methods 0.000 claims description 15
- 238000004140 cleaning Methods 0.000 claims description 12
- 238000005259 measurement Methods 0.000 claims description 12
- 238000001035 drying Methods 0.000 claims description 8
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 238000000034 method Methods 0.000 description 28
- 239000007788 liquid Substances 0.000 description 13
- 238000000926 separation method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 230000005684 electric field Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- B08B3/04—Cleaning involving contact with liquid
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- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Description
実施例はウエハー製造工程中にウエハーを移送する工程に使われることができる。
Claims (12)
- 垂直方向又は水平方向に移動するガイド(guide);
前記ガイドに取り付けられ、互いに離隔したウエハーを装着させる移送アーム;
前記ガイドに配置され、前記移送アームに装着された互いに離隔したウエハーに第1レーザーを放出するレーザー放出部;及び
前記移送アームの下側に配置され、前記第1レーザーのうち前記互いに離隔したウエハーの間の隙間を通過した第2レーザーを捕集するレーザー感知部を含み、
さらに、前記レーザー放出部から照射される第1レーザー、及びレーザー捕集器によって捕集される第2レーザーに基づき、前記互いに離隔したウエハーの厚さを測定する制御部を含む、ウエハー移送装置。 - 前記第1レーザーの水平方向の放出領域の一端は前記ウエハーのうち第1ウエハーのエッジに整列され、前記第1レーザーの水平方向の放出領域の他端は前記ウエハーのうち最後のウエハーのエッジに整列される、請求項1に記載のウエハー移送装置。
- 前記ガイドと前記レーザー感知部の間に連結され、前記レーザー感知部を前記ガイドに固定させるレーザー感知支持部をさらに含む、請求項1または2に記載のウエハー移送装置。
- 前記レーザー感知支持部は前記ガイドと一緒に水平方向又は垂直方向に移動する、請求項3に記載のウエハー移送装置。
- 前記レーザー感知支持部は、
前記ガイドの一端と前記レーザー感知部の一端を連結する第1レーザー感知支持部;及び
前記ガイドの他端と前記レーザー感知部の他端を連結する第2レーザー感知支持部を含む、請求項3に記載のウエハー移送装置。 - レーザーを照射するレーザー放出部及びレーザーを感知するレーザー感知部を備えるウエハー移送装置に装着されたウエハーを加工するウエハー加工方法であって、
前記レーザー放出部によって、前記ウエハー移送装置に装着されたウエハーにレーザーを照射するレーザー照射段階;
前記レーザー感知部によって、前記ウエハー移送装置に装着されたウエハーの間を通過したレーザーを感知するレーザー感知段階;
前記感知された結果によって、前記ウエハー移送装置に装着されたウエハーの厚さを測定する厚さ測定段階;及び
前記測定された厚さに基づき、前記ウエハー移送装置に装着されたウエハーを加工する加工段階を含む、ウエハー加工方法。 - 前記ウエハー移送装置によって前記ウエハーを移送する段階をさらに含み、
前記レーザー照射段階、前記レーザー感知段階、及び前記厚さ測定段階は前記移送する段階中に行う、請求項6に記載のウエハー加工方法。 - 前記測定されたウエハーの厚さを既設定の厚さ値と比較する比較段階をさらに含み、
前記加工段階は、前記比較段階によって比較された結果によって前記ウエハーの加工進行を決定するかあるいは加工時間を制御する、請求項6又は7に記載のウエハー加工方法。 - 前記加工段階は前記ウエハーを食刻する段階である、請求項6ないし8のいずれかに記載のウエハー加工方法。
- 前記加工段階後、前記レーザー照射段階、前記レーザー感知段階、及び前記厚さ測定段階を行うことで、前記加工段階によって加工されたウエハーの厚さを測定する厚さ測定段階;及び
前記加工段階によって加工されたウエハーの測定された厚さが既設定の厚さと同じになるまで、前記レーザー照射段階、前記レーザー感知段階、前記厚さ測定段階、前記比較段階、及び前記加工段階を繰り返し行う段階をさらに含む、請求項8に記載のウエハー加工方法。 - 前記加工段階は、前記食刻段階で食刻されたウエハーを洗浄する洗浄段階をさらに含む、請求項9に記載のウエハー加工方法。
- 前記加工段階は、前記洗浄段階で洗浄されたウエハーを乾燥させる乾燥段階をさらに含む、請求項11に記載のウエハー加工方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150010385A KR101680214B1 (ko) | 2015-01-22 | 2015-01-22 | 웨이퍼 이송 장치 |
KR10-2015-0010385 | 2015-01-22 | ||
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JPH02106830A (ja) | 1988-10-17 | 1990-04-18 | Meidensha Corp | 真空インタラプタ用電極の製造方法 |
JPH07118502B2 (ja) * | 1989-01-27 | 1995-12-18 | 日立電子エンジニアリング株式会社 | カセット内ウェハのハンドリング方法および装置 |
JPH02106830U (ja) * | 1989-02-09 | 1990-08-24 | ||
JPH03250749A (ja) | 1990-02-28 | 1991-11-08 | Mitsubishi Electric Corp | 半導体ウエハ移替装置におけるウエハ検出装置および方法 |
JP3131751B2 (ja) | 1992-11-05 | 2001-02-05 | 東京エレクトロン株式会社 | 被処理体検出装置 |
US5319216A (en) | 1991-07-26 | 1994-06-07 | Tokyo Electron Limited | Substrate detector with light emitting and receiving elements arranged in staggered fashion and a polarization filter |
JP3060394B2 (ja) * | 1991-08-30 | 2000-07-10 | 大日本スクリーン製造株式会社 | 表面処理装置 |
JPH05315309A (ja) * | 1992-05-01 | 1993-11-26 | Kaijo Corp | 半導体基板自動処理装置 |
KR0118207B1 (ko) | 1992-09-25 | 1997-09-30 | 기다오까 다까시 | 반도체 세정장치 및 웨이퍼카세트 |
JP3110218B2 (ja) * | 1992-09-25 | 2000-11-20 | 三菱電機株式会社 | 半導体洗浄装置及び方法、ウエハカセット、専用グローブ並びにウエハ受け治具 |
JPH0837229A (ja) * | 1994-07-25 | 1996-02-06 | Nippon Telegr & Teleph Corp <Ntt> | 基板ティーチング装置 |
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JPH08129353A (ja) | 1994-11-01 | 1996-05-21 | Casio Comput Co Ltd | 表示装置 |
JPH11176912A (ja) | 1997-12-08 | 1999-07-02 | Mitsubishi Electric Corp | 半導体基板処理装置及びその制御方法 |
KR20010014319A (ko) | 1998-05-01 | 2001-02-26 | 히가시 데츠로 | 막 두께 측정 장치, 기판 처리 방법 및 기판 처리 장치 |
JP4389305B2 (ja) * | 1999-10-06 | 2009-12-24 | 東京エレクトロン株式会社 | 処理装置 |
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KR101339002B1 (ko) * | 2006-12-13 | 2013-12-09 | (주)스마트에이스 | 기판식각장치 및 식각방법 |
JP2008177329A (ja) * | 2007-01-18 | 2008-07-31 | Mitsubishi Electric Corp | ウエットエッチング方法 |
US7972969B2 (en) * | 2008-03-06 | 2011-07-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and apparatus for thinning a substrate |
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JP6091193B2 (ja) * | 2011-12-27 | 2017-03-08 | 芝浦メカトロニクス株式会社 | 基板の処理装置及び処理方法 |
JP5871845B2 (ja) * | 2013-03-12 | 2016-03-01 | 東京エレクトロン株式会社 | 基板搬送装置、基板処理装置、基板取出方法および記憶媒体 |
KR101469000B1 (ko) * | 2013-07-17 | 2014-12-04 | 주식회사 엠엠테크 | 글라스 박형화 장치 및 그 방법 |
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KR101680214B1 (ko) | 2016-11-28 |
JP2018509751A (ja) | 2018-04-05 |
KR20160090515A (ko) | 2016-08-01 |
US10192794B2 (en) | 2019-01-29 |
DE112015006031T5 (de) | 2017-09-28 |
US20180005907A1 (en) | 2018-01-04 |
DE112015006031B4 (de) | 2022-05-12 |
CN107210255A (zh) | 2017-09-26 |
WO2016117777A1 (ko) | 2016-07-28 |
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