JP6464762B2 - 半導体パッケージ基板、および半導体パッケージと、半導体パッケージ基板の製造方法、および半導体パッケージの製造方法 - Google Patents

半導体パッケージ基板、および半導体パッケージと、半導体パッケージ基板の製造方法、および半導体パッケージの製造方法 Download PDF

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JP6464762B2
JP6464762B2 JP2015006564A JP2015006564A JP6464762B2 JP 6464762 B2 JP6464762 B2 JP 6464762B2 JP 2015006564 A JP2015006564 A JP 2015006564A JP 2015006564 A JP2015006564 A JP 2015006564A JP 6464762 B2 JP6464762 B2 JP 6464762B2
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semiconductor package
underfill
package substrate
semiconductor chip
semiconductor
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JP2016134417A5 (https=
JP2016134417A (ja
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石井　智之
智之 石井
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Toppan Inc
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Toppan Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

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JP2015006564A 2015-01-16 2015-01-16 半導体パッケージ基板、および半導体パッケージと、半導体パッケージ基板の製造方法、および半導体パッケージの製造方法 Active JP6464762B2 (ja)

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JP2015006564A JP6464762B2 (ja) 2015-01-16 2015-01-16 半導体パッケージ基板、および半導体パッケージと、半導体パッケージ基板の製造方法、および半導体パッケージの製造方法

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JP2016134417A JP2016134417A (ja) 2016-07-25
JP2016134417A5 JP2016134417A5 (https=) 2018-02-01
JP6464762B2 true JP6464762B2 (ja) 2019-02-06

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020191397A (ja) * 2019-05-23 2020-11-26 凸版印刷株式会社 複合配線基板及びその製造方法
CN112992691B (zh) * 2021-04-23 2021-09-03 度亘激光技术（苏州）有限公司 半导体器件的焊接方法及半导体器件

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001244384A (ja) * 2000-02-28 2001-09-07 Matsushita Electric Works Ltd ベアチップ搭載プリント配線基板
JP4321269B2 (ja) * 2004-01-14 2009-08-26 株式会社デンソー 半導体装置
JP5162226B2 (ja) * 2007-12-12 2013-03-13 新光電気工業株式会社 配線基板及び半導体装置

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