JP6462480B2 - 配線基板及び配線基板の製造方法 - Google Patents

配線基板及び配線基板の製造方法 Download PDF

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Publication number
JP6462480B2
JP6462480B2 JP2015091512A JP2015091512A JP6462480B2 JP 6462480 B2 JP6462480 B2 JP 6462480B2 JP 2015091512 A JP2015091512 A JP 2015091512A JP 2015091512 A JP2015091512 A JP 2015091512A JP 6462480 B2 JP6462480 B2 JP 6462480B2
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JP
Japan
Prior art keywords
insulating layer
layer
wiring
opening
wiring layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015091512A
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English (en)
Japanese (ja)
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JP2016207957A5 (enExample
JP2016207957A (ja
Inventor
小林　和弘
和弘 小林
淳史 佐藤
淳史 佐藤
泰彦 草間
泰彦 草間
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2015091512A priority Critical patent/JP6462480B2/ja
Priority to US15/095,334 priority patent/US9627308B2/en
Publication of JP2016207957A publication Critical patent/JP2016207957A/ja
Publication of JP2016207957A5 publication Critical patent/JP2016207957A5/ja
Application granted granted Critical
Publication of JP6462480B2 publication Critical patent/JP6462480B2/ja
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Classifications

    • H10W70/635—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
    • H10P72/74—
    • H10W70/05—
    • H10W70/095—
    • H10W70/685—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H10P72/7424—
    • H10P72/744—
    • H10W70/60—
    • H10W70/614—
    • H10W70/68—
    • H10W70/695—
    • H10W72/01235—
    • H10W72/01255—
    • H10W72/019—
    • H10W72/072—
    • H10W72/07236—
    • H10W72/073—
    • H10W72/07337—
    • H10W72/07554—
    • H10W72/252—
    • H10W72/29—
    • H10W72/354—
    • H10W72/884—
    • H10W72/90—
    • H10W74/117—
    • H10W74/15—
    • H10W90/701—
    • H10W90/722—
    • H10W90/724—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Ceramic Engineering (AREA)
  • Geometry (AREA)
JP2015091512A 2015-04-28 2015-04-28 配線基板及び配線基板の製造方法 Active JP6462480B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2015091512A JP6462480B2 (ja) 2015-04-28 2015-04-28 配線基板及び配線基板の製造方法
US15/095,334 US9627308B2 (en) 2015-04-28 2016-04-11 Wiring substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015091512A JP6462480B2 (ja) 2015-04-28 2015-04-28 配線基板及び配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2016207957A JP2016207957A (ja) 2016-12-08
JP2016207957A5 JP2016207957A5 (enExample) 2018-02-01
JP6462480B2 true JP6462480B2 (ja) 2019-01-30

Family

ID=57205792

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015091512A Active JP6462480B2 (ja) 2015-04-28 2015-04-28 配線基板及び配線基板の製造方法

Country Status (2)

Country Link
US (1) US9627308B2 (enExample)
JP (1) JP6462480B2 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6393566B2 (ja) * 2014-09-17 2018-09-19 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
CN104657707B (zh) * 2015-01-30 2018-03-20 业成光电（深圳）有限公司 指纹识别装置及其制作方法
KR101672641B1 (ko) * 2015-07-01 2016-11-03 앰코 테크놀로지 코리아 주식회사 반도체 디바이스의 제조 방법 및 이에 따른 반도체 디바이스
US10340155B2 (en) * 2016-04-14 2019-07-02 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor structure and method of forming
US11355427B2 (en) * 2016-07-01 2022-06-07 Intel Corporation Device, method and system for providing recessed interconnect structures of a substrate
FR3060846B1 (fr) * 2016-12-19 2019-05-24 Institut Vedecom Procede d’integration de puces de puissance et de bus barres formant dissipateurs thermiques
KR102356125B1 (ko) 2017-03-31 2022-01-28 티디케이가부시기가이샤 전자 부품 내장 기판
KR101963292B1 (ko) 2017-10-31 2019-03-28 삼성전기주식회사 팬-아웃 반도체 패키지
JP6907898B2 (ja) * 2017-11-20 2021-07-21 Tdk株式会社 電子部品内蔵構造体
KR101912290B1 (ko) 2017-12-06 2018-10-29 삼성전기 주식회사 팬-아웃 반도체 패키지
JP7210191B2 (ja) * 2018-08-30 2023-01-23 京セラ株式会社 電子素子実装用基板、電子装置、および電子モジュール
KR102762887B1 (ko) * 2019-12-10 2025-02-07 삼성전기주식회사 전자부품 내장기판
KR102789024B1 (ko) * 2019-12-17 2025-04-01 삼성전기주식회사 전자부품 내장기판
KR102776276B1 (ko) * 2019-12-19 2025-03-07 삼성전기주식회사 전자부품 내장기판
US11101840B1 (en) * 2020-02-05 2021-08-24 Samsung Electro-Mechanics Co., Ltd. Chip radio frequency package and radio frequency module
US11183765B2 (en) 2020-02-05 2021-11-23 Samsung Electro-Mechanics Co., Ltd. Chip radio frequency package and radio frequency module
JP7589574B2 (ja) * 2021-02-10 2024-11-26 Ｔｏｐｐａｎホールディングス株式会社 多層配線基板
CN115915570A (zh) * 2021-08-12 2023-04-04 庆鼎精密电子（淮安）有限公司 防翘曲电路板及其制造方法、电子装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4826248B2 (ja) * 2005-12-19 2011-11-30 Ｔｄｋ株式会社 Ｉｃ内蔵基板の製造方法
KR20110028951A (ko) * 2009-09-14 2011-03-22 삼성전기주식회사 인쇄회로기판 및 그의 제조방법
JP2013038374A (ja) * 2011-01-20 2013-02-21 Ibiden Co Ltd 配線板及びその製造方法
US8745860B2 (en) * 2011-03-11 2014-06-10 Ibiden Co., Ltd. Method for manufacturing printed wiring board
JP2012216575A (ja) * 2011-03-31 2012-11-08 Nec Toppan Circuit Solutions Inc 部品内蔵印刷配線板及びその製造方法
US9113574B2 (en) * 2012-10-25 2015-08-18 Ibiden Co., Ltd. Wiring board with built-in electronic component and method for manufacturing the same
KR101420526B1 (ko) * 2012-11-29 2014-07-17 삼성전기주식회사 전자부품 내장기판 및 그 제조방법
JP2014116548A (ja) * 2012-12-12 2014-06-26 Ngk Spark Plug Co Ltd 多層配線基板およびその製造方法
JP2014154594A (ja) * 2013-02-05 2014-08-25 Ibiden Co Ltd 電子部品内蔵配線板
JP6173781B2 (ja) * 2013-06-10 2017-08-02 新光電気工業株式会社 配線基板及び配線基板の製造方法
JP2015005612A (ja) * 2013-06-20 2015-01-08 イビデン株式会社 パッケージ基板及びパッケージ基板の製造方法

Also Published As

Publication number Publication date
US20160322294A1 (en) 2016-11-03
US9627308B2 (en) 2017-04-18
JP2016207957A (ja) 2016-12-08

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