JP6460689B2 - 積層体の作製装置 - Google Patents

積層体の作製装置 Download PDF

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Publication number
JP6460689B2
JP6460689B2 JP2014187212A JP2014187212A JP6460689B2 JP 6460689 B2 JP6460689 B2 JP 6460689B2 JP 2014187212 A JP2014187212 A JP 2014187212A JP 2014187212 A JP2014187212 A JP 2014187212A JP 6460689 B2 JP6460689 B2 JP 6460689B2
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JP
Japan
Prior art keywords
layer
light
support
adhesive layer
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2014187212A
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English (en)
Japanese (ja)
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JP2015083373A5 (https=
JP2015083373A (ja
Inventor
平形　吉晴
吉晴 平形
瀬尾　哲史
哲史 瀬尾
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Priority to JP2014187212A priority Critical patent/JP6460689B2/ja
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Publication of JP2015083373A5 publication Critical patent/JP2015083373A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B2038/0052—Other operations not otherwise provided for
    • B32B2038/0076—Curing, vulcanising, cross-linking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B32B2309/62—Inert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B32B2309/68—Vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/22—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1858—Handling of layers or the laminate using vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1875—Tensioning

Landscapes

  • Electroluminescent Light Sources (AREA)
  • Laminated Bodies (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
JP2014187212A 2013-09-18 2014-09-16 積層体の作製装置 Expired - Fee Related JP6460689B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014187212A JP6460689B2 (ja) 2013-09-18 2014-09-16 積層体の作製装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013193314 2013-09-18
JP2013193314 2013-09-18
JP2014187212A JP6460689B2 (ja) 2013-09-18 2014-09-16 積層体の作製装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018240869A Division JP6732002B2 (ja) 2013-09-18 2018-12-25 積層体の作製装置

Publications (3)

Publication Number Publication Date
JP2015083373A JP2015083373A (ja) 2015-04-30
JP2015083373A5 JP2015083373A5 (https=) 2017-10-26
JP6460689B2 true JP6460689B2 (ja) 2019-01-30

Family

ID=52666884

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2014187212A Expired - Fee Related JP6460689B2 (ja) 2013-09-18 2014-09-16 積層体の作製装置
JP2018240869A Active JP6732002B2 (ja) 2013-09-18 2018-12-25 積層体の作製装置
JP2020117076A Withdrawn JP2020184090A (ja) 2013-09-18 2020-07-07 表示装置

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2018240869A Active JP6732002B2 (ja) 2013-09-18 2018-12-25 積層体の作製装置
JP2020117076A Withdrawn JP2020184090A (ja) 2013-09-18 2020-07-07 表示装置

Country Status (3)

Country Link
US (1) US9981457B2 (https=)
JP (3) JP6460689B2 (https=)
KR (1) KR102302067B1 (https=)

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US9229481B2 (en) 2013-12-20 2016-01-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
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JP6378530B2 (ja) 2014-05-03 2018-08-22 株式会社半導体エネルギー研究所 フィルム吸着機構
WO2015170208A1 (en) 2014-05-03 2015-11-12 Semiconductor Energy Laboratory Co., Ltd. Film-like member support apparatus
JP6548871B2 (ja) 2014-05-03 2019-07-24 株式会社半導体エネルギー研究所 積層体の基板剥離装置
JP6603486B2 (ja) 2014-06-27 2019-11-06 株式会社半導体エネルギー研究所 発光装置の作製方法
WO2017115484A1 (ja) * 2015-12-28 2017-07-06 鴻海精密工業股▲ふん▼有限公司 有機ｅｌ表示装置の製造方法
US10259207B2 (en) 2016-01-26 2019-04-16 Semiconductor Energy Laboratory Co., Ltd. Method for forming separation starting point and separation method
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IT201600087263A1 (it) * 2016-08-25 2018-02-25 Automatic Lamination Tech S R L Apparecchiatura per la realizzazione di un pannello composito comprendente una pellicola biadesiva interposta tra due sottili lastre metalliche
CN107120875B (zh) * 2017-05-09 2022-05-20 澳柯玛股份有限公司 一种使内冷凝器贴合箱壳的装置及方法
CN110216975B (zh) * 2019-07-09 2025-03-11 安吉八塔机器人有限公司 一种多功能复合机器人系统
CN110881252B (zh) * 2019-11-26 2021-02-19 南通深南电路有限公司 印制电路板生产设备的控制方法及印制电路板生产设备
CN111683460A (zh) * 2020-05-26 2020-09-18 江西源盛泰电子科技有限公司 一种fpc钢片生产设备

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Also Published As

Publication number Publication date
KR20150032486A (ko) 2015-03-26
US20150075720A1 (en) 2015-03-19
KR102302067B1 (ko) 2021-09-13
JP2019091698A (ja) 2019-06-13
JP2015083373A (ja) 2015-04-30
JP2020184090A (ja) 2020-11-12
US9981457B2 (en) 2018-05-29
JP6732002B2 (ja) 2020-07-29

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