JP6460260B2 - 搬送システム及び搬送方法 - Google Patents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G43/00—Control devices, e.g. for safety, warning or fault-correcting
- B65G43/10—Sequence control of conveyors operating in combination
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
- B65G1/02—Storage devices
- B65G1/04—Storage devices mechanical
- B65G1/0457—Storage devices mechanical with suspended load carriers
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D1/00—Control of position, course or altitude of land, water, air, or space vehicles, e.g. automatic pilot
- G05D1/02—Control of position or course in two dimensions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67733—Overhead conveying
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G35/00—Mechanical conveyors not otherwise provided for
- B65G35/06—Mechanical conveyors not otherwise provided for comprising a load-carrier moving along a path, e.g. a closed path, and adapted to be engaged by any one of a series of traction elements spaced along the path
Description
図1に示されるように、搬送システム1は、軌道10と、天井搬送車(搬送車)20と、コントローラ50と、を備えている。軌道10は、半導体処理装置110を備える半導体製造工場の天井付近に敷設されている。天井搬送車20は、OHT(Overhead Hoist Transfer)であり、軌道10に吊り下げられた状態で軌道10に沿って一方向に走行する。天井搬送車20は、複数の半導体ウェハが収容されたFOUP(Front Opening Unified Pod)90を被搬送物として搬送する。コントローラ50は、各天井搬送車20と通信し、各天井搬送車20の動作を制御する。
第2実施形態の搬送システム1は、軌道10の構成において、上述した第1実施形態の搬送システム1と主に相違している。すなわち、軌道10は、互いに合流、分岐する複数の区間を有している。図5には、軌道10において合流点を含んで構成される区間が示されている。軌道10は、複数の区間10a,10b,10cを含んで構成されている。軌道10は、区間10a及び区間10bが合流する合流点12を有し、合流点12の下流側には、区間10cを有している。
第1実施形態及び第2実施形態の搬送システム1では、コントローラ50は、天井搬送車20に対して以下に説明する削除処理を実施してもよい。
Claims (7)
- 軌道と、
前記軌道に沿って走行し、少なくともステーションに対して被搬送物を搬送する複数の搬送車と、
複数の前記搬送車のそれぞれと通信し、複数の前記搬送車のそれぞれの動作を制御するコントローラと、を備え、
前記コントローラは、
前記ステーションから前記被搬送物を取得する荷つかみ要求が存在する場合には、
前記荷つかみ要求に対応する搬送指令を割り付け可能な状況にあり、且つ、前記ステーションに最も近い前記搬送車を検出したときに、当該搬送車に対して、前記ステーションの上流側における前記軌道の合流点のうち、前記ステーションに最も近い前記合流点である目的地点に走行する走行指令を割り付け、
前記搬送指令を割り付け可能な状況にあり、且つ、前記ステーションに最も近い別の前記搬送車を、前記走行指令を割り付けられた前記搬送車に対して前記搬送指令を割り付ける前に新たに検出したときに、新たに検出された前記搬送車に対して、前記走行指令を割り付け、
前記走行指令を割り付けられた前記搬送車であって前記目的地点に最先に到達する前記搬送車に対して、前記搬送指令を割り付ける、搬送システム。 - 前記コントローラは、
複数の前記搬送車に対して前記走行指令を割り付けた場合には、複数の当該搬送車のうち、前記ステーションに最も近い前記搬送車を除き、他の前記搬送車に対して、前記走行指令を削除する削除指令を送信する、請求項1記載の搬送システム。 - 前記コントローラは、複数の前記搬送車に対して前記走行指令を割り付けた場合には、複数の当該搬送車のそれぞれの状態を監視し、前記状態が削除条件を満たした前記搬送車を検出したときに、当該搬送車に対して、前記走行指令を削除する削除指令を送信する、請求項1又は2記載の搬送システム。
- 前記走行指令を割り付けられた前記搬送車は、前記目的地点から第2距離の到着直前地点に到達したときに、到着直前報告を前記コントローラに送信し、
前記コントローラは、前記到着直前報告を前記搬送車から受信したときに、当該搬送車に対して、前記搬送指令を割り付ける、請求項1〜3のいずれか一項記載の搬送システム。 - 前記走行指令を割り付けられた前記搬送車は、前記目的地点の上流側において、前記目的地点を通過する許可を要求する通過許可要求を前記コントローラに送信し、
前記通過許可要求を前記搬送車から受信した前記コントローラは、当該搬送車が前記目的地点を通過可能な状況にあるときに、当該搬送車に対して、前記目的地点の通過許可を送信し、
前記搬送車は、前記到着直前地点に到達し、且つ、前記通過許可を受信したときに、前記到着直前報告を前記コントローラに送信する、請求項4記載の搬送システム。 - 前記コントローラは、1台のみの前記搬送車に対して前記走行指令を割り付けた場合において、当該搬送車が、前記到着直前地点に到達したにもかかわらず、当該搬送車から前記到着直前報告を受信しないときには、別の少なくとも1台の前記搬送車に対して、前記走行指令を新たに割り付ける、請求項4又は5記載の搬送システム。
- 軌道と、前記軌道に沿って走行し、少なくともステーションに対して被搬送物を搬送する複数の搬送車と、複数の前記搬送車のそれぞれと通信し、複数の前記搬送車のそれぞれの動作を制御するコントローラと、を備える搬送システムにおいて実施される搬送方法であって、
前記ステーションから前記被搬送物を取得する荷つかみ要求が存在する場合において、
前記コントローラが、前記荷つかみ要求に対応する搬送指令を割り付け可能な状況にあり、且つ、前記ステーションに最も近い前記搬送車を検出したときに、当該搬送車に対して、前記ステーションの上流側における前記軌道の合流点のうち、前記ステーションに最も近い前記合流点である目的地点に走行する走行指令を割り付ける第1ステップと、
前記コントローラが、前記搬送指令を割り付け可能な状況にあり、且つ、前記ステーションに最も近い別の前記搬送車を、前記走行指令を割り付けられた前記搬送車に対して前記搬送指令を割り付ける前に新たに検出したときに、新たに検出された前記搬送車に対して、前記走行指令を割り付ける第2ステップと、
前記コントローラが、前記走行指令を割り付けられた前記搬送車であって前記目的地点に最先に到達する前記搬送車に対して、前記搬送指令を割り付ける第3ステップと、を含む、搬送方法。
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JP2015231832 | 2015-11-27 | ||
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PCT/JP2016/080411 WO2017090334A1 (ja) | 2015-11-27 | 2016-10-13 | 搬送システム及び搬送方法 |
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JP (1) | JP6460260B2 (ja) |
CN (1) | CN108290684B (ja) |
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JP6270518B2 (ja) * | 2014-02-05 | 2018-01-31 | 日立建機株式会社 | 作業車両の管制システム |
JP6652084B2 (ja) * | 2017-02-09 | 2020-02-19 | 株式会社ダイフク | 物品搬送設備 |
JP6825532B2 (ja) * | 2017-10-12 | 2021-02-03 | 株式会社ダイフク | 搬送システム |
JP7006775B2 (ja) * | 2018-04-12 | 2022-01-24 | 村田機械株式会社 | 搬送車システム及び搬送車制御方法 |
US11791186B2 (en) * | 2018-05-31 | 2023-10-17 | Murata Machinery, Ltd. | Conveyance system |
CN109292463B (zh) * | 2018-08-28 | 2020-11-13 | 西门子工厂自动化工程有限公司 | 物料转移方法、转移装置、制药系统和存储介质 |
US11952026B2 (en) * | 2018-09-04 | 2024-04-09 | Murata Machinery, Ltd. | Conveyance vehicle system |
JPWO2020049876A1 (ja) * | 2018-09-05 | 2021-08-12 | 村田機械株式会社 | 走行車システム |
US20220223446A1 (en) * | 2019-05-14 | 2022-07-14 | Murata Machinery, Ltd. | Transport system and transport control method |
JP2022125369A (ja) * | 2019-07-04 | 2022-08-29 | 村田機械株式会社 | 走行システム |
KR102303109B1 (ko) | 2019-07-05 | 2021-09-15 | 세메스 주식회사 | 반송체 제어 장치 및 이를 구비하는 반송체 제어 시스템 |
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US5434490A (en) * | 1992-07-31 | 1995-07-18 | Daifuku Co., Ltd. | Article transport system |
JP3355347B2 (ja) * | 1999-09-13 | 2002-12-09 | 村田機械株式会社 | 搬送システム |
WO2002033498A2 (en) * | 2000-10-16 | 2002-04-25 | Matsushita Electric Industrial Co., Ltd. | Automated guided vehicle, operation control system and method for the same, and automotive vehicle |
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JP4329034B2 (ja) * | 2004-08-09 | 2009-09-09 | 株式会社ダイフク | 物品搬送装置 |
JP4172464B2 (ja) | 2005-05-06 | 2008-10-29 | 村田機械株式会社 | 搬送台車システム |
JP2009053937A (ja) * | 2007-08-27 | 2009-03-12 | Asyst Technologies Japan Inc | 搬送システム、及び搬送システムの制御方法 |
JP5309814B2 (ja) | 2008-09-08 | 2013-10-09 | 村田機械株式会社 | 搬送車システム |
JP5374981B2 (ja) | 2008-09-10 | 2013-12-25 | 村田機械株式会社 | 搬送システム |
KR101246280B1 (ko) * | 2008-09-26 | 2013-03-22 | 무라다기카이가부시끼가이샤 | 반송차 시스템 |
JP4766111B2 (ja) * | 2008-12-26 | 2011-09-07 | 村田機械株式会社 | 搬送車システム |
JP4798554B2 (ja) * | 2009-03-05 | 2011-10-19 | 村田機械株式会社 | 走行車の走行制御システムと制御方法 |
JP5472209B2 (ja) * | 2011-05-31 | 2014-04-16 | 株式会社ダイフク | 物品搬送設備 |
WO2015186444A1 (ja) * | 2014-06-04 | 2015-12-10 | 村田機械株式会社 | 搬送車システムと搬送方法 |
JP6698399B2 (ja) * | 2016-03-29 | 2020-05-27 | 北陽電機株式会社 | 搬送制御装置及び搬送台車の合流点通過方法 |
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- 2016-10-13 CN CN201680066744.0A patent/CN108290684B/zh active Active
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- 2016-10-13 WO PCT/JP2016/080411 patent/WO2017090334A1/ja active Application Filing
- 2016-11-22 TW TW105138239A patent/TWI676582B/zh active
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CN108290684A (zh) | 2018-07-17 |
WO2017090334A1 (ja) | 2017-06-01 |
TWI676582B (zh) | 2019-11-11 |
TW201726520A (zh) | 2017-08-01 |
US20180370735A1 (en) | 2018-12-27 |
JPWO2017090334A1 (ja) | 2018-11-01 |
CN108290684B (zh) | 2020-06-23 |
US10479613B2 (en) | 2019-11-19 |
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