JP6457713B2 - 発光素子パッケージ - Google Patents

発光素子パッケージ Download PDF

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Publication number
JP6457713B2
JP6457713B2 JP2013258482A JP2013258482A JP6457713B2 JP 6457713 B2 JP6457713 B2 JP 6457713B2 JP 2013258482 A JP2013258482 A JP 2013258482A JP 2013258482 A JP2013258482 A JP 2013258482A JP 6457713 B2 JP6457713 B2 JP 6457713B2
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Japan
Prior art keywords
ceramic layer
light emitting
electrode
disposed
emitting device
Prior art date
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Expired - Fee Related
Application number
JP2013258482A
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English (en)
Japanese (ja)
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JP2014120778A5 (enExample
JP2014120778A (ja
Inventor
キム，ビョンモク
ノ，ヨンジン
カン，ボヒ
洋 小平
洋 小平
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LG Innotek Co Ltd
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LG Innotek Co Ltd
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Publication of JP2014120778A5 publication Critical patent/JP2014120778A5/ja
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Publication of JP6457713B2 publication Critical patent/JP6457713B2/ja
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
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    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Wire Bonding (AREA)
JP2013258482A 2012-12-14 2013-12-13 発光素子パッケージ Expired - Fee Related JP6457713B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2012-0146331 2012-12-14
KR1020120146331A KR102007404B1 (ko) 2012-12-14 2012-12-14 발광소자 패키지

Publications (3)

Publication Number Publication Date
JP2014120778A JP2014120778A (ja) 2014-06-30
JP2014120778A5 JP2014120778A5 (enExample) 2017-01-26
JP6457713B2 true JP6457713B2 (ja) 2019-01-23

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JP2013258482A Expired - Fee Related JP6457713B2 (ja) 2012-12-14 2013-12-13 発光素子パッケージ

Country Status (5)

Country Link
US (1) US9437791B2 (enExample)
EP (1) EP2744001A3 (enExample)
JP (1) JP6457713B2 (enExample)
KR (1) KR102007404B1 (enExample)
CN (1) CN103872211B (enExample)

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KR20140039740A (ko) * 2012-09-25 2014-04-02 엘지이노텍 주식회사 발광소자 패키지
KR20160017849A (ko) * 2014-08-06 2016-02-17 서울바이오시스 주식회사 고출력 발광 장치 및 그 제조 방법
CN104465950A (zh) * 2014-12-02 2015-03-25 深圳市华星光电技术有限公司 一种发光二极管以及发光二极管的制造方法
JP2016138901A (ja) * 2015-01-26 2016-08-04 株式会社日立エルジーデータストレージ 光モジュール、及び走査型画像表示装置
DE102015205354A1 (de) * 2015-03-24 2016-09-29 Osram Gmbh Optoelektronische Baugruppe und Verfahren zum Herstellen einer optoelektronischen Baugruppe
CN106486590A (zh) * 2015-08-26 2017-03-08 深圳市斯迈得半导体有限公司 一种通用于应用线材焊线技术中的混合焊线装置
US20170356640A1 (en) * 2016-06-10 2017-12-14 Innotec, Corp. Illumination assembly including thermal energy management
CN106601701B (zh) * 2017-01-19 2023-03-28 贵州煜立电子科技有限公司 大功率二端表面引出脚电子元器件立体封装方法及结构
DE102017117165B4 (de) * 2017-07-28 2023-04-27 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Elektronisches Bauteil und Verfahren zur Herstellung eines elektronischen Bauteils
CN107644894B (zh) * 2017-09-18 2023-11-24 京东方科技集团股份有限公司 一种有机电致发光器件、其制备方法及显示装置
JP2020025034A (ja) * 2018-08-08 2020-02-13 ローム株式会社 Ｌｅｄパッケージ、ｌｅｄ表示装置
CN109713107A (zh) * 2018-12-13 2019-05-03 佛山市国星光电股份有限公司 支架结构、led器件和灯组阵列

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CN103872211B (zh) 2018-06-12
KR102007404B1 (ko) 2019-08-05
KR20140077478A (ko) 2014-06-24
EP2744001A2 (en) 2014-06-18
US9437791B2 (en) 2016-09-06
JP2014120778A (ja) 2014-06-30
CN103872211A (zh) 2014-06-18

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