JP6431420B2 - ペースト塗布装置 - Google Patents

ペースト塗布装置 Download PDF

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JP6431420B2
JP6431420B2 JP2015060574A JP2015060574A JP6431420B2 JP 6431420 B2 JP6431420 B2 JP 6431420B2 JP 2015060574 A JP2015060574 A JP 2015060574A JP 2015060574 A JP2015060574 A JP 2015060574A JP 6431420 B2 JP6431420 B2 JP 6431420B2
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paste
pin
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application
guide
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JP2016179433A5 (enExample
JP2016179433A (ja
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隆郎 根岸
隆郎 根岸
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株式会社小坂研究所
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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
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JP2015060574A 2015-03-24 2015-03-24 ペースト塗布装置 Active JP6431420B2 (ja)

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JP2015060574A JP6431420B2 (ja) 2015-03-24 2015-03-24 ペースト塗布装置

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JP2015060574A JP6431420B2 (ja) 2015-03-24 2015-03-24 ペースト塗布装置

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JP2016179433A JP2016179433A (ja) 2016-10-13
JP2016179433A5 JP2016179433A5 (enExample) 2017-11-24
JP6431420B2 true JP6431420B2 (ja) 2018-11-28

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108513440B (zh) * 2018-04-20 2023-11-21 深圳市动力飞扬智能装备有限公司 一种用于pcb板的上pin包胶设备
CN113953621B (zh) * 2021-10-20 2022-05-27 浙江大彩光电技术有限公司 一种led显示屏模组回流焊定位方法及其装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0738500B2 (ja) * 1985-12-20 1995-04-26 松下電器産業株式会社 塗布装置
JP2625582B2 (ja) * 1990-12-11 1997-07-02 ローム株式会社 外部端子接続用導電性ペーストの塗着装置
JPH1154534A (ja) * 1997-08-04 1999-02-26 Hitachi Ltd ポッティング方法および機構ならびにそれを用いたダイボンダ
JP5196398B2 (ja) * 2007-12-14 2013-05-15 Ｎｔｎ株式会社 基板上の微細パターンに発生した欠陥修正方法
JP2010194490A (ja) * 2009-02-26 2010-09-09 Micronics Japan Co Ltd 塗布装置
JP5009354B2 (ja) * 2009-11-30 2012-08-22 キヤノンマシナリー株式会社 塗布装置
JP5009353B2 (ja) * 2009-10-29 2012-08-22 キヤノンマシナリー株式会社 塗布装置および塗布方法

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