JP6421169B2 - 疲労特性および破壊特性が改善された強誘電体キャパシタ - Google Patents
疲労特性および破壊特性が改善された強誘電体キャパシタ Download PDFInfo
- Publication number
- JP6421169B2 JP6421169B2 JP2016500720A JP2016500720A JP6421169B2 JP 6421169 B2 JP6421169 B2 JP 6421169B2 JP 2016500720 A JP2016500720 A JP 2016500720A JP 2016500720 A JP2016500720 A JP 2016500720A JP 6421169 B2 JP6421169 B2 JP 6421169B2
- Authority
- JP
- Japan
- Prior art keywords
- polymer
- ferroelectric
- blend
- ferroelectric material
- vdf
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/22—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/22—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
- G11C11/221—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements using ferroelectric capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
- H10D1/682—Capacitors having no potential barriers having dielectrics comprising perovskite structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/50—Bistable switching devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/141—Organic polymers or oligomers comprising aliphatic or olefinic chains, e.g. poly N-vinylcarbazol, PVC or PTFE
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/151—Copolymers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Semiconductor Memories (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Formation Of Insulating Films (AREA)
- Organic Insulating Materials (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361784011P | 2013-03-14 | 2013-03-14 | |
| US61/784,011 | 2013-03-14 | ||
| US201361866882P | 2013-08-16 | 2013-08-16 | |
| US61/866,882 | 2013-08-16 | ||
| US201361876033P | 2013-09-10 | 2013-09-10 | |
| US61/876,033 | 2013-09-10 | ||
| PCT/US2014/021091 WO2014158956A1 (en) | 2013-03-14 | 2014-03-06 | Ferroelectric capacitor with improved fatigue and breakdown properties |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016519690A JP2016519690A (ja) | 2016-07-07 |
| JP2016519690A5 JP2016519690A5 (enExample) | 2017-01-05 |
| JP6421169B2 true JP6421169B2 (ja) | 2018-11-07 |
Family
ID=50424740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016500720A Active JP6421169B2 (ja) | 2013-03-14 | 2014-03-06 | 疲労特性および破壊特性が改善された強誘電体キャパシタ |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10096352B2 (enExample) |
| EP (1) | EP2973775B1 (enExample) |
| JP (1) | JP6421169B2 (enExample) |
| KR (1) | KR102043488B1 (enExample) |
| CN (1) | CN105103322B (enExample) |
| TW (1) | TW201505221A (enExample) |
| WO (1) | WO2014158956A1 (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9368182B2 (en) * | 2013-12-09 | 2016-06-14 | Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. | Memory cell |
| KR101632025B1 (ko) * | 2015-01-09 | 2016-06-20 | 광주과학기술원 | 유기 박막 제조 방법 |
| CN108206239B (zh) * | 2016-12-16 | 2019-10-01 | 同济大学 | 基于金-铁电单晶体系的负微分电阻效应器件及其制备 |
| KR102430668B1 (ko) * | 2018-03-30 | 2022-08-09 | 고쿠리츠다이가쿠호진 히로시마다이가쿠 | 성형체 |
| CN108469586B (zh) * | 2018-06-04 | 2023-08-08 | 沈阳工业大学 | 一种快速接地开关开断特性的检验与判断装置及方法 |
| CN109400929B (zh) * | 2018-10-30 | 2021-07-13 | 郭庆平 | 一种P(VDF-TrFE)铁电薄膜材料的制备方法 |
| JP7211104B2 (ja) * | 2019-01-24 | 2023-01-24 | 日立金属株式会社 | 線状部材及びその製造方法 |
| US20210408367A1 (en) * | 2019-02-27 | 2021-12-30 | National University Corporation Yamagata University | Method for producing ferroelectric polymer element, ferroelectric polymer element and piezoelectric sensor |
| CN109972136B (zh) * | 2019-03-26 | 2020-09-04 | 浙江大学 | 一种取向生长P(VDF-TrFE)薄膜的制备方法 |
| CN110164698A (zh) * | 2019-04-29 | 2019-08-23 | 杭州电子科技大学 | 一种PET-ITO/TiO2/P(VDF/TrFE)透明柔性复合光阳极 |
| JP7200861B2 (ja) * | 2019-07-12 | 2023-01-10 | 味の素株式会社 | 樹脂組成物 |
| CN110444397B (zh) * | 2019-07-26 | 2022-06-21 | 上海工程技术大学 | 一种线电极结构的有机铁电薄膜电容器及其制备方法 |
| US11049541B2 (en) * | 2019-10-24 | 2021-06-29 | Ferroelectric Memory Gmbh | Memory cell arrangement and methods thereof |
| KR102834552B1 (ko) * | 2021-01-05 | 2025-07-14 | 삼성전자주식회사 | 캐패시터 및 캐패시터를 포함하는 반도체 소자를 제조하기 위한 방법들 |
| CN116249338B (zh) * | 2023-03-15 | 2024-03-22 | 潍坊新声悦尔电子科技有限公司 | Ptfe膜覆膜背极板驻极电荷激活老化工艺 |
| CN117169669B (zh) * | 2023-11-02 | 2024-03-12 | 国网江西省电力有限公司供电服务管理中心 | 击穿电容监测方法、装置、电子设备及可读存储介质 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL8701624A (nl) * | 1987-07-10 | 1989-02-01 | Gen Electric | Polymeermengsel dat een polyfenyleenether, een fluor bevattend olefinisch homopolymeer of copolymeer en een vinylaromatischalkyl(meth)acrylaat copolymeer bevat. |
| US5115018A (en) * | 1987-08-24 | 1992-05-19 | Allied-Signal Inc. | High-impact, styrenic polymer/thermoplastic polymer grafted blends |
| JPH01110550A (ja) * | 1987-10-23 | 1989-04-27 | Toagosei Chem Ind Co Ltd | 樹脂組成物 |
| US7034332B2 (en) | 2004-01-27 | 2006-04-25 | Hewlett-Packard Development Company, L.P. | Nanometer-scale memory device utilizing self-aligned rectifying elements and method of making |
| US7139198B2 (en) * | 2004-01-27 | 2006-11-21 | Sandisk Corporation | Efficient verification for coarse/fine programming of non-volatile memory |
| US7045897B2 (en) * | 2004-07-28 | 2006-05-16 | Endicott Interconnect Technologies, Inc. | Electrical assembly with internal memory circuitized substrate having electronic components positioned thereon, method of making same, and information handling system utilizing same |
| US20080248596A1 (en) | 2007-04-04 | 2008-10-09 | Endicott Interconnect Technologies, Inc. | Method of making a circuitized substrate having at least one capacitor therein |
| US20080128682A1 (en) * | 2005-05-11 | 2008-06-05 | University Of Seoul Foundation Of Industry- Academic Cooperation | Ferrodielectric Memory Device And Method For Manufacturing The Same |
| US7989530B2 (en) * | 2005-11-23 | 2011-08-02 | General Electric Company | Nonlinear polymer composites and methods of making the same |
| JP2008147632A (ja) * | 2006-11-13 | 2008-06-26 | Seiko Epson Corp | 有機強誘電体膜の形成方法、記憶素子の製造方法、記憶装置、および電子機器 |
| WO2009005555A2 (en) * | 2007-04-11 | 2009-01-08 | The Penn State Research Foundation | Methods to improve the efficiency and reduce the energy losses in high energy density capacitor films and articles comprising the same |
| JP5135937B2 (ja) * | 2007-07-31 | 2013-02-06 | ダイキン工業株式会社 | 高誘電性フィルム |
| WO2009151694A2 (en) * | 2008-03-13 | 2009-12-17 | Strategic Polymer Sciences, Inc. | High electrric energy density polymeric compositions, methods of the manufacture therefor, and articles comprising the same |
| KR100984182B1 (ko) | 2008-04-14 | 2010-09-28 | 삼성전자주식회사 | 비휘발성 메모리 장치 및 이의 제조 방법 |
| US8611068B2 (en) | 2008-10-16 | 2013-12-17 | Case Western Reserve University | Multilayer polymer dialectric film having a charge-delocalizing interface |
| US20110228442A1 (en) | 2010-03-16 | 2011-09-22 | Strategic Polymer Sciences, Inc. | Capacitor having high temperature stability, high dielectric constant, low dielectric loss, and low leakage current |
-
2014
- 2014-03-06 JP JP2016500720A patent/JP6421169B2/ja active Active
- 2014-03-06 WO PCT/US2014/021091 patent/WO2014158956A1/en not_active Ceased
- 2014-03-06 CN CN201480015331.0A patent/CN105103322B/zh active Active
- 2014-03-06 KR KR1020157028270A patent/KR102043488B1/ko active Active
- 2014-03-06 EP EP14714858.9A patent/EP2973775B1/en active Active
- 2014-03-06 US US14/199,227 patent/US10096352B2/en active Active
- 2014-03-14 TW TW103109293A patent/TW201505221A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN105103322B (zh) | 2019-03-08 |
| EP2973775A1 (en) | 2016-01-20 |
| WO2014158956A1 (en) | 2014-10-02 |
| TW201505221A (zh) | 2015-02-01 |
| US20140268483A1 (en) | 2014-09-18 |
| KR20150129801A (ko) | 2015-11-20 |
| KR102043488B1 (ko) | 2019-11-11 |
| JP2016519690A (ja) | 2016-07-07 |
| CN105103322A (zh) | 2015-11-25 |
| EP2973775B1 (en) | 2017-06-07 |
| US10096352B2 (en) | 2018-10-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6421169B2 (ja) | 疲労特性および破壊特性が改善された強誘電体キャパシタ | |
| EP3146567B1 (en) | Processing of thin film organic ferroelectric materials using pulsed electromagnetic radiation | |
| JP6366824B2 (ja) | 二段階温度プロセスを使用した薄膜強誘電体デバイスの製造方法 | |
| KR101802692B1 (ko) | 강유전체 커패시터-계 메모리 기기 | |
| Khan et al. | All‐polymer bistable resistive memory device based on nanoscale phase‐separated PCBM‐ferroelectric blends | |
| KR101909522B1 (ko) | 앰비언트-로버스트 용액을 이용한 나노단위 유기적 강유전체 막의 제조방법 | |
| EP2859600A1 (en) | Ferroelectric devices, interconnects, and methods of manufacture thereof | |
| US20170233597A1 (en) | Method of fabricating high-performance poly (vinylidenedifluoride-trifluoroethylene), p(vdf-trfe) films | |
| US20140097395A1 (en) | Resistive memory device fabricated from single polymer material | |
| Zhang et al. | How to process P (VDF-TrFE) thin films for controlling short circuits in flexible non-volatile memories | |
| Wang et al. | Development of indigo-based nonvolatile write-once-read-many-times memory device | |
| KR101224768B1 (ko) | 유기 메모리 소자 및 그의 제조방법 | |
| KR101653283B1 (ko) | 자가 응집체를 포함하는 유기 비휘발성 메모리 장치 및 이의 제조 방법 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20161115 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20161115 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20170907 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170926 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20171226 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180226 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180605 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180801 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20181009 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20181015 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 6421169 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |