JP6413694B2 - 脆性基板の分断方法 - Google Patents
脆性基板の分断方法 Download PDFInfo
- Publication number
- JP6413694B2 JP6413694B2 JP2014237467A JP2014237467A JP6413694B2 JP 6413694 B2 JP6413694 B2 JP 6413694B2 JP 2014237467 A JP2014237467 A JP 2014237467A JP 2014237467 A JP2014237467 A JP 2014237467A JP 6413694 B2 JP6413694 B2 JP 6413694B2
- Authority
- JP
- Japan
- Prior art keywords
- trench line
- line
- substrate
- glass substrate
- trench
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014237467A JP6413694B2 (ja) | 2014-11-25 | 2014-11-25 | 脆性基板の分断方法 |
TW104136383A TWI678343B (zh) | 2014-11-25 | 2015-11-04 | 脆性基板之分斷方法 |
KR1020150161659A KR20160062695A (ko) | 2014-11-25 | 2015-11-18 | 취성 기판의 분단 방법 |
CN201510801190.1A CN105621876B (zh) | 2014-11-25 | 2015-11-19 | 脆性基板的切断方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014237467A JP6413694B2 (ja) | 2014-11-25 | 2014-11-25 | 脆性基板の分断方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016098153A JP2016098153A (ja) | 2016-05-30 |
JP6413694B2 true JP6413694B2 (ja) | 2018-10-31 |
Family
ID=56037277
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014237467A Expired - Fee Related JP6413694B2 (ja) | 2014-11-25 | 2014-11-25 | 脆性基板の分断方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6413694B2 (zh) |
KR (1) | KR20160062695A (zh) |
CN (1) | CN105621876B (zh) |
TW (1) | TWI678343B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI605024B (zh) * | 2015-08-07 | 2017-11-11 | Mitsuboshi Diamond Ind Co Ltd | Breaking method of brittle substrate |
JP6555002B2 (ja) * | 2015-08-19 | 2019-08-07 | 三星ダイヤモンド工業株式会社 | スクライブラインの検査方法 |
JP2018150191A (ja) * | 2017-03-13 | 2018-09-27 | 日本電気硝子株式会社 | ガラス板の製造方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6402004B1 (en) * | 1998-09-16 | 2002-06-11 | Hoya Corporation | Cutting method for plate glass mother material |
JP3792508B2 (ja) * | 2000-12-19 | 2006-07-05 | 三星ダイヤモンド工業株式会社 | 貼り合わせ脆性基板の分断方法 |
KR100549099B1 (ko) | 2001-06-14 | 2006-02-02 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 유기이엘 디스플레이 제조장치 및 유기이엘 디스플레이의제조방법 |
TWI226877B (en) | 2001-07-12 | 2005-01-21 | Mitsuboshi Diamond Ind Co Ltd | Method of manufacturing adhered brittle material substrates and method of separating adhered brittle material substrates |
JP2007039302A (ja) * | 2005-08-05 | 2007-02-15 | Matsushita Electric Ind Co Ltd | ガラス基板割断方法およびガラス基板割断装置 |
JP2008195571A (ja) * | 2007-02-13 | 2008-08-28 | Shiraitekku:Kk | 基板の分断装置 |
JP5076662B2 (ja) * | 2007-06-13 | 2012-11-21 | 澁谷工業株式会社 | 脆性材料の割断方法およびその装置 |
JP4730345B2 (ja) * | 2007-06-18 | 2011-07-20 | ソニー株式会社 | ガラス基板対を有する表示装置及びその切断方法 |
JP5476063B2 (ja) * | 2009-07-28 | 2014-04-23 | 浜松ホトニクス株式会社 | 加工対象物切断方法 |
JP5686291B2 (ja) * | 2011-03-04 | 2015-03-18 | 旭硝子株式会社 | 矩形板状物の切断装置及び製造方法 |
JP2012193060A (ja) * | 2011-03-15 | 2012-10-11 | Asahi Glass Co Ltd | 脆性板の切断装置および脆性板の切断方法 |
CN103359925B (zh) * | 2012-03-27 | 2016-04-27 | 三星钻石工业股份有限公司 | 强化玻璃基板的刻划方法及刻划装置 |
JP2014051415A (ja) * | 2012-09-07 | 2014-03-20 | Mitsuboshi Diamond Industrial Co Ltd | 脆性材料基板のスクライブ方法 |
US20150299021A1 (en) * | 2012-11-09 | 2015-10-22 | Nippon Electric Glass Co., Ltd. | Initial crack formation device, and formation method |
JP6311798B2 (ja) * | 2014-11-25 | 2018-04-18 | 三星ダイヤモンド工業株式会社 | 脆性基板の分断方法 |
-
2014
- 2014-11-25 JP JP2014237467A patent/JP6413694B2/ja not_active Expired - Fee Related
-
2015
- 2015-11-04 TW TW104136383A patent/TWI678343B/zh not_active IP Right Cessation
- 2015-11-18 KR KR1020150161659A patent/KR20160062695A/ko not_active Application Discontinuation
- 2015-11-19 CN CN201510801190.1A patent/CN105621876B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2016098153A (ja) | 2016-05-30 |
KR20160062695A (ko) | 2016-06-02 |
CN105621876A (zh) | 2016-06-01 |
TW201628983A (zh) | 2016-08-16 |
TWI678343B (zh) | 2019-12-01 |
CN105621876B (zh) | 2020-03-10 |
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