JP6407832B2 - 処理液供給装置 - Google Patents

処理液供給装置 Download PDF

Info

Publication number
JP6407832B2
JP6407832B2 JP2015202352A JP2015202352A JP6407832B2 JP 6407832 B2 JP6407832 B2 JP 6407832B2 JP 2015202352 A JP2015202352 A JP 2015202352A JP 2015202352 A JP2015202352 A JP 2015202352A JP 6407832 B2 JP6407832 B2 JP 6407832B2
Authority
JP
Japan
Prior art keywords
processing liquid
container
processing
liquid supply
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015202352A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017076669A (ja
Inventor
中島　常長
常長 中島
慎介 ▲高▼木
慎介 ▲高▼木
裕二 木村
裕二 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2015202352A priority Critical patent/JP6407832B2/ja
Priority to KR1020160129703A priority patent/KR102652171B1/ko
Publication of JP2017076669A publication Critical patent/JP2017076669A/ja
Application granted granted Critical
Publication of JP6407832B2 publication Critical patent/JP6407832B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
    • H01L21/02307—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
    • H01L21/02343—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2015202352A 2015-10-13 2015-10-13 処理液供給装置 Active JP6407832B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2015202352A JP6407832B2 (ja) 2015-10-13 2015-10-13 処理液供給装置
KR1020160129703A KR102652171B1 (ko) 2015-10-13 2016-10-07 처리액 공급 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015202352A JP6407832B2 (ja) 2015-10-13 2015-10-13 処理液供給装置

Publications (2)

Publication Number Publication Date
JP2017076669A JP2017076669A (ja) 2017-04-20
JP6407832B2 true JP6407832B2 (ja) 2018-10-17

Family

ID=58549705

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015202352A Active JP6407832B2 (ja) 2015-10-13 2015-10-13 処理液供給装置

Country Status (2)

Country Link
JP (1) JP6407832B2 (ko)
KR (1) KR102652171B1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI763944B (zh) 2017-11-01 2022-05-11 日商東京威力科創股份有限公司 處理液供給系統、處理液供給裝置及載具保管裝置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2507472Y2 (ja) * 1991-03-08 1996-08-14 大日本スクリーン製造株式会社 回転処理装置の余剰塗布液回収装置
JP3680907B2 (ja) * 1998-06-02 2005-08-10 大日本スクリーン製造株式会社 基板処理装置
JP2007234814A (ja) * 2006-02-28 2007-09-13 Dainippon Screen Mfg Co Ltd 基板処理装置および処理液の除電方法
JP2011192775A (ja) * 2010-03-15 2011-09-29 Toppan Printing Co Ltd 現像装置
US9406501B2 (en) 2012-05-31 2016-08-02 Semes Co., Ltd. Apparatus and method for cleaning substrate
KR20140144806A (ko) * 2013-06-11 2014-12-22 삼성전자주식회사 기판 처리 장치
JP6291177B2 (ja) * 2013-07-11 2018-03-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP5987807B2 (ja) 2013-10-08 2016-09-07 東京エレクトロン株式会社 薬液容器交換装置、容器載置モジュール及び薬液容器の交換方法
JP5987808B2 (ja) * 2013-10-08 2016-09-07 東京エレクトロン株式会社 基板処理装置
JP5999073B2 (ja) * 2013-11-20 2016-09-28 東京エレクトロン株式会社 処理液供給装置、処理液供給方法及び記憶媒体

Also Published As

Publication number Publication date
KR102652171B1 (ko) 2024-03-27
JP2017076669A (ja) 2017-04-20
KR20170043452A (ko) 2017-04-21

Similar Documents

Publication Publication Date Title
CN108140598B (zh) 吹净装置、吹净储料器以及吹净方法
KR101197813B1 (ko) 기판 처리 장치, 기판 처리 방법 및 컴퓨터 판독 가능한 기억 매체
JP4697882B2 (ja) 処理液供給装置及び処理液供給方法並びに処理液供給用制御プログラム
JP4940123B2 (ja) 基板処理装置および基板処理方法
JP6414338B2 (ja) 保管装置および保管方法
KR20100110726A (ko) 기판 처리 장치
TWI660786B (zh) 基板處理裝置及基板處理方法
KR102649900B1 (ko) 액 공급 장치 및 액 공급 방법
JP5987807B2 (ja) 薬液容器交換装置、容器載置モジュール及び薬液容器の交換方法
JP2010171258A (ja) 基板処理装置及び基板処理方法
JP2015099883A (ja) 処理液供給装置、処理液供給方法及び記憶媒体
JP2018046269A (ja) 処理液供給装置
JP6407833B2 (ja) 処理液供給装置
JP6407832B2 (ja) 処理液供給装置
JP5987808B2 (ja) 基板処理装置
JP4982292B2 (ja) 塗布装置及び塗布方法
JP6571022B2 (ja) 基板処理装置
JP2009043829A (ja) 塗布装置及び塗布方法
US20240152052A1 (en) Substrate processing apparatus
JP5789416B2 (ja) 塗布装置及び塗布方法
JP7378345B2 (ja) 二重配管の内部洗浄方法及び処理液供給装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20170808

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20180607

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180619

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180817

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20180911

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20180919

R150 Certificate of patent or registration of utility model

Ref document number: 6407832

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250