JP6386722B2 - 撮像素子、撮像装置及び携帯電話機 - Google Patents

撮像素子、撮像装置及び携帯電話機 Download PDF

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Publication number
JP6386722B2
JP6386722B2 JP2013244331A JP2013244331A JP6386722B2 JP 6386722 B2 JP6386722 B2 JP 6386722B2 JP 2013244331 A JP2013244331 A JP 2013244331A JP 2013244331 A JP2013244331 A JP 2013244331A JP 6386722 B2 JP6386722 B2 JP 6386722B2
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signal
pixel
output
analog
column
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Japanese (ja)
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JP2015104021A5 (https=
JP2015104021A (ja
Inventor
秀太 西沢
秀太 西沢
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Canon Inc
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Canon Inc
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Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2013244331A priority Critical patent/JP6386722B2/ja
Priority to US14/542,006 priority patent/US9866776B2/en
Priority to KR1020140162264A priority patent/KR101745319B1/ko
Priority to CN201410690498.9A priority patent/CN104683712B/zh
Publication of JP2015104021A publication Critical patent/JP2015104021A/ja
Publication of JP2015104021A5 publication Critical patent/JP2015104021A5/ja
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/62—Detection or reduction of noise due to excess charges produced by the exposure, e.g. smear, blooming, ghost image, crosstalk or leakage between pixels
    • H04N25/628—Detection or reduction of noise due to excess charges produced by the exposure, e.g. smear, blooming, ghost image, crosstalk or leakage between pixels for reducing horizontal stripes caused by saturated regions of CMOS sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/79—Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/618—Noise processing, e.g. detecting, correcting, reducing or removing noise for random or high-frequency noise
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H04N25/772—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising A/D, V/T, V/F, I/T or I/F converters

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2013244331A 2013-11-26 2013-11-26 撮像素子、撮像装置及び携帯電話機 Active JP6386722B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013244331A JP6386722B2 (ja) 2013-11-26 2013-11-26 撮像素子、撮像装置及び携帯電話機
US14/542,006 US9866776B2 (en) 2013-11-26 2014-11-14 Image sensor, image capturing apparatus, and cellular phone
KR1020140162264A KR101745319B1 (ko) 2013-11-26 2014-11-20 촬상소자, 촬상장치 및 휴대전화기
CN201410690498.9A CN104683712B (zh) 2013-11-26 2014-11-25 图像传感器、摄像装置、以及蜂窝电话

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013244331A JP6386722B2 (ja) 2013-11-26 2013-11-26 撮像素子、撮像装置及び携帯電話機

Publications (3)

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JP2015104021A JP2015104021A (ja) 2015-06-04
JP2015104021A5 JP2015104021A5 (https=) 2016-12-28
JP6386722B2 true JP6386722B2 (ja) 2018-09-05

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JP2013244331A Active JP6386722B2 (ja) 2013-11-26 2013-11-26 撮像素子、撮像装置及び携帯電話機

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US (1) US9866776B2 (https=)
JP (1) JP6386722B2 (https=)
KR (1) KR101745319B1 (https=)
CN (1) CN104683712B (https=)

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TWI648986B (zh) * 2014-04-15 2019-01-21 Sony Corporation 攝像元件、電子機器
TWI751116B (zh) * 2015-11-12 2022-01-01 日商索尼半導體解決方案公司 攝像元件、攝像方法及電子機器
KR102648189B1 (ko) * 2017-01-12 2024-03-14 에스케이하이닉스 주식회사 아날로그 디지털 변환 장치 및 이를 포함하는 리드 아웃 회로와 씨모스 이미지 센서
JP2019047383A (ja) * 2017-09-04 2019-03-22 ソニーセミコンダクタソリューションズ株式会社 撮像装置、および、固体撮像素子の制御方法
EP3813356B1 (en) 2017-10-30 2025-02-05 Sony Semiconductor Solutions Corporation Solid-state imaging device
US10692179B2 (en) * 2017-11-17 2020-06-23 Semiconductor Components Industries, Llc Methods and apparatus for signal distribution in an image sensor
JP7134782B2 (ja) * 2018-08-20 2022-09-12 キヤノン株式会社 Ａｄ変換装置、撮像装置、撮像システム及び移動体
EP3937483B1 (en) * 2019-03-07 2024-12-11 Sony Semiconductor Solutions Corporation Imaging device
JP7407416B2 (ja) 2019-11-26 2024-01-04 パナソニックＩｐマネジメント株式会社 撮像装置およびカメラ
JP7618393B2 (ja) 2020-05-18 2025-01-21 キヤノン株式会社 信号処理回路、光電変換装置および機器

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JP4640507B2 (ja) 2009-01-06 2011-03-02 ソニー株式会社 固体撮像装置、固体撮像装置の信号処理方法、および撮像装置
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JP6019870B2 (ja) * 2012-07-20 2016-11-02 ソニー株式会社 固体撮像装置、及び、製造方法
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JP2014239289A (ja) * 2013-06-06 2014-12-18 ソニー株式会社 Ａｄ変換器、信号処理方法、固体撮像装置、および電子機器

Also Published As

Publication number Publication date
CN104683712B (zh) 2018-11-16
KR101745319B1 (ko) 2017-06-12
KR20150060544A (ko) 2015-06-03
JP2015104021A (ja) 2015-06-04
CN104683712A (zh) 2015-06-03
US9866776B2 (en) 2018-01-09
US20150146063A1 (en) 2015-05-28

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