JP6382039B2 - 切断装置並びに吸着機構及びこれを用いる装置 - Google Patents

切断装置並びに吸着機構及びこれを用いる装置 Download PDF

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Publication number
JP6382039B2
JP6382039B2 JP2014180254A JP2014180254A JP6382039B2 JP 6382039 B2 JP6382039 B2 JP 6382039B2 JP 2014180254 A JP2014180254 A JP 2014180254A JP 2014180254 A JP2014180254 A JP 2014180254A JP 6382039 B2 JP6382039 B2 JP 6382039B2
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Japan
Prior art keywords
suction
holes
objects
cutting
base
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JP2014180254A
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English (en)
Japanese (ja)
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JP2016054256A5 (fr
JP2016054256A (ja
Inventor
純 岡本
純 岡本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
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Towa Corp
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Publication date
Application filed by Towa Corp filed Critical Towa Corp
Priority to JP2014180254A priority Critical patent/JP6382039B2/ja
Priority to CN201510490571.2A priority patent/CN105405805A/zh
Priority to TW104126196A priority patent/TWI566291B/zh
Priority to KR1020150117404A priority patent/KR20160028953A/ko
Priority to MYPI2015002168A priority patent/MY173967A/en
Publication of JP2016054256A publication Critical patent/JP2016054256A/ja
Publication of JP2016054256A5 publication Critical patent/JP2016054256A5/ja
Application granted granted Critical
Publication of JP6382039B2 publication Critical patent/JP6382039B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Jigs For Machine Tools (AREA)
JP2014180254A 2014-09-04 2014-09-04 切断装置並びに吸着機構及びこれを用いる装置 Active JP6382039B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2014180254A JP6382039B2 (ja) 2014-09-04 2014-09-04 切断装置並びに吸着機構及びこれを用いる装置
CN201510490571.2A CN105405805A (zh) 2014-09-04 2015-08-11 切断装置、吸附机构及具备吸附机构的装置
TW104126196A TWI566291B (zh) 2014-09-04 2015-08-12 A cutting device, an adsorption mechanism and a device having an adsorption mechanism
KR1020150117404A KR20160028953A (ko) 2014-09-04 2015-08-20 절단 장치, 흡착 기구 및 흡착 기구를 구비하는 장치
MYPI2015002168A MY173967A (en) 2014-09-04 2015-09-03 Cutting apparatus, sucking mechanism, and apparatus mounted with the sucking mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014180254A JP6382039B2 (ja) 2014-09-04 2014-09-04 切断装置並びに吸着機構及びこれを用いる装置

Publications (3)

Publication Number Publication Date
JP2016054256A JP2016054256A (ja) 2016-04-14
JP2016054256A5 JP2016054256A5 (fr) 2017-08-24
JP6382039B2 true JP6382039B2 (ja) 2018-08-29

Family

ID=55471207

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014180254A Active JP6382039B2 (ja) 2014-09-04 2014-09-04 切断装置並びに吸着機構及びこれを用いる装置

Country Status (5)

Country Link
JP (1) JP6382039B2 (fr)
KR (1) KR20160028953A (fr)
CN (1) CN105405805A (fr)
MY (1) MY173967A (fr)
TW (1) TWI566291B (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101899653B1 (ko) * 2016-10-05 2018-09-18 주식회사 포스코 소재 안착장치
JP6791581B2 (ja) * 2016-11-11 2020-11-25 株式会社ディスコ パッケージ基板切断用治具テーブル
JP6626027B2 (ja) * 2017-03-16 2019-12-25 Ｔｏｗａ株式会社 製造装置および電子部品の製造方法
JP2019016700A (ja) * 2017-07-07 2019-01-31 Ｔｏｗａ株式会社 保持部材、保持部材の製造方法、保持装置、搬送装置及び電子部品の製造装置
JP6886379B2 (ja) * 2017-09-28 2021-06-16 Ｔｏｗａ株式会社 保持部材、保持部材の製造方法、検査装置及び切断装置
JP7102157B2 (ja) * 2018-02-08 2022-07-19 Ｔｏｗａ株式会社 切断装置及び切断品の製造方法
CN108435714B (zh) * 2018-04-12 2023-08-29 环维电子(上海)有限公司 一种新型干冰清洗底座及其清洗方法
JP6746756B1 (ja) * 2019-05-24 2020-08-26 Ｔｏｗａ株式会社 吸着プレート、切断装置および切断方法
JP7390855B2 (ja) * 2019-10-24 2023-12-04 株式会社ディスコ 切削装置のチャックテーブル
JP7423161B2 (ja) 2020-06-30 2024-01-29 株式会社ディスコ チャックテーブル
WO2022195931A1 (fr) * 2021-03-18 2022-09-22 Ｔｏｗａ株式会社 Appareil de traitement et procédé de fabrication d'article traité
US11993066B2 (en) * 2021-03-31 2024-05-28 Taiwan Semiconductor Manufacturing Company, Ltd. Chuck, lamination process, and manufacturing method of semiconductor package using the same
CN118235234A (zh) 2022-10-21 2024-06-21 株式会社东光高岳 工件检查装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62234685A (ja) * 1986-04-02 1987-10-14 Mitsubishi Electric Corp 加工材料の切断方法
JPS62234686A (ja) * 1986-04-02 1987-10-14 Mitsubishi Electric Corp 加工材料の切断方法
KR20040084128A (ko) * 2003-03-26 2004-10-06 한미반도체 주식회사 반도체 쏘잉장치의 척테이블
JP2004330417A (ja) * 2003-04-30 2004-11-25 Towa Corp 基板の切断方法、切断装置および基板吸着固定機構
JP2006229129A (ja) * 2005-02-21 2006-08-31 Fujitsu Ltd 真空吸着装置
JP2006344827A (ja) * 2005-06-09 2006-12-21 Renesas Technology Corp 半導体装置の製造方法
FR2893873B1 (fr) * 2005-11-25 2008-12-12 Air Liquide Procede de coupage avec un laser a fibre d'acier inoxydable
JP2008221391A (ja) * 2007-03-13 2008-09-25 Matsushita Electric Ind Co Ltd 基板吸着固定機構
JP5086690B2 (ja) * 2007-05-18 2012-11-28 日本特殊陶業株式会社 セラミック基板の製造方法
JP5117772B2 (ja) * 2007-06-28 2013-01-16 株式会社ディスコ 切削装置
JP2011040542A (ja) 2009-08-10 2011-02-24 Disco Abrasive Syst Ltd パッケージ基板の分割方法
JP2011216704A (ja) * 2010-03-31 2011-10-27 Furukawa Electric Co Ltd:The 半導体ウェハ加工用粘着テープ

Also Published As

Publication number Publication date
KR20160028953A (ko) 2016-03-14
TWI566291B (zh) 2017-01-11
CN105405805A (zh) 2016-03-16
TW201616566A (zh) 2016-05-01
MY173967A (en) 2020-02-28
JP2016054256A (ja) 2016-04-14

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