JP6375209B2 - 粘着テープ貼付け方法および粘着テープ貼付け装置 - Google Patents

粘着テープ貼付け方法および粘着テープ貼付け装置 Download PDF

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Publication number
JP6375209B2
JP6375209B2 JP2014227956A JP2014227956A JP6375209B2 JP 6375209 B2 JP6375209 B2 JP 6375209B2 JP 2014227956 A JP2014227956 A JP 2014227956A JP 2014227956 A JP2014227956 A JP 2014227956A JP 6375209 B2 JP6375209 B2 JP 6375209B2
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JP
Japan
Prior art keywords
adhesive tape
holding
semiconductor wafer
wafer
back surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2014227956A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016092329A (ja
Inventor
奥野　長平
長平 奥野
山本　雅之
雅之 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP2014227956A priority Critical patent/JP6375209B2/ja
Priority to KR1020150151767A priority patent/KR20160055693A/ko
Priority to TW104136784A priority patent/TW201633438A/zh
Priority to CN201510759775.1A priority patent/CN105590891A/zh
Publication of JP2016092329A publication Critical patent/JP2016092329A/ja
Application granted granted Critical
Publication of JP6375209B2 publication Critical patent/JP6375209B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Textile Engineering (AREA)
JP2014227956A 2014-11-10 2014-11-10 粘着テープ貼付け方法および粘着テープ貼付け装置 Expired - Fee Related JP6375209B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014227956A JP6375209B2 (ja) 2014-11-10 2014-11-10 粘着テープ貼付け方法および粘着テープ貼付け装置
KR1020150151767A KR20160055693A (ko) 2014-11-10 2015-10-30 점착 테이프 부착 방법 및 점착 테이프 부착 장치
TW104136784A TW201633438A (zh) 2014-11-10 2015-11-09 黏著帶貼附方法及黏著帶貼附裝置
CN201510759775.1A CN105590891A (zh) 2014-11-10 2015-11-09 粘合带粘贴方法和粘合带粘贴装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014227956A JP6375209B2 (ja) 2014-11-10 2014-11-10 粘着テープ貼付け方法および粘着テープ貼付け装置

Publications (2)

Publication Number Publication Date
JP2016092329A JP2016092329A (ja) 2016-05-23
JP6375209B2 true JP6375209B2 (ja) 2018-08-15

Family

ID=55930362

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014227956A Expired - Fee Related JP6375209B2 (ja) 2014-11-10 2014-11-10 粘着テープ貼付け方法および粘着テープ貼付け装置

Country Status (4)

Country Link
JP (1) JP6375209B2 (zh)
KR (1) KR20160055693A (zh)
CN (1) CN105590891A (zh)
TW (1) TW201633438A (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110024102B (zh) 2019-02-26 2020-10-30 长江存储科技有限责任公司 用于在晶圆表面贴黏胶膜的方法和装置
JP7464472B2 (ja) 2020-07-17 2024-04-09 株式会社ディスコ 加工装置
KR102696283B1 (ko) 2021-11-24 2024-08-19 주식회사 두오텍 다이싱 테이프 마운터 장치

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004158768A (ja) * 2002-11-08 2004-06-03 Disco Abrasive Syst Ltd 半導体ウエーハおよびサブストレート
JP4603578B2 (ja) * 2005-02-18 2010-12-22 三井化学株式会社 半導体ウェハ表面保護シート及び該保護シートを用いる半導体ウェハの保護方法
JP5049485B2 (ja) * 2005-11-08 2012-10-17 ソマール株式会社 粘着剤組成物及び粘着シート
JP4711904B2 (ja) * 2006-07-31 2011-06-29 日東電工株式会社 半導体ウエハへの粘着テープ貼付け方法および半導体ウエハからの保護テープ剥離方法
JP4773419B2 (ja) * 2007-12-20 2011-09-14 リンテック株式会社 シート貼付装置及び貼付方法
JP5117934B2 (ja) * 2008-06-06 2013-01-16 リンテック株式会社 マウント装置及びマウント方法
JP2013232582A (ja) * 2012-05-01 2013-11-14 Nitto Denko Corp 粘着テープ貼付け方法および粘着テープ貼付け装置

Also Published As

Publication number Publication date
TW201633438A (zh) 2016-09-16
CN105590891A (zh) 2016-05-18
KR20160055693A (ko) 2016-05-18
JP2016092329A (ja) 2016-05-23

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