KR20160055693A - 점착 테이프 부착 방법 및 점착 테이프 부착 장치 - Google Patents
점착 테이프 부착 방법 및 점착 테이프 부착 장치 Download PDFInfo
- Publication number
- KR20160055693A KR20160055693A KR1020150151767A KR20150151767A KR20160055693A KR 20160055693 A KR20160055693 A KR 20160055693A KR 1020150151767 A KR1020150151767 A KR 1020150151767A KR 20150151767 A KR20150151767 A KR 20150151767A KR 20160055693 A KR20160055693 A KR 20160055693A
- Authority
- KR
- South Korea
- Prior art keywords
- adhesive tape
- holding
- wafer
- convex portion
- semiconductor wafer
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
- B65H37/04—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations for securing together articles or webs, e.g. by adhesive, stitching or stapling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2301/00—Handling processes for sheets or webs
- B65H2301/50—Auxiliary process performed during handling process
- B65H2301/51—Modifying a characteristic of handled material
- B65H2301/516—Securing handled material to another material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
- Textile Engineering (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2014-227956 | 2014-11-10 | ||
JP2014227956A JP6375209B2 (ja) | 2014-11-10 | 2014-11-10 | 粘着テープ貼付け方法および粘着テープ貼付け装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20160055693A true KR20160055693A (ko) | 2016-05-18 |
Family
ID=55930362
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020150151767A KR20160055693A (ko) | 2014-11-10 | 2015-10-30 | 점착 테이프 부착 방법 및 점착 테이프 부착 장치 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6375209B2 (zh) |
KR (1) | KR20160055693A (zh) |
CN (1) | CN105590891A (zh) |
TW (1) | TW201633438A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20230076358A (ko) | 2021-11-24 | 2023-05-31 | 주식회사 두오텍 | 다이싱 테이프 마운터 장치 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020172785A1 (en) * | 2019-02-26 | 2020-09-03 | Yangtze Memory Technologies Co., Ltd. | Method and device for wafer taping |
JP7464472B2 (ja) | 2020-07-17 | 2024-04-09 | 株式会社ディスコ | 加工装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004158768A (ja) * | 2002-11-08 | 2004-06-03 | Disco Abrasive Syst Ltd | 半導体ウエーハおよびサブストレート |
TWI298741B (en) * | 2005-02-18 | 2008-07-11 | Mitsui Chemicals Inc | Surface protecting sheet for semiconductor wafer and method for protecting semiconductor wafer using the protecting sheet |
JP5049485B2 (ja) * | 2005-11-08 | 2012-10-17 | ソマール株式会社 | 粘着剤組成物及び粘着シート |
JP4711904B2 (ja) * | 2006-07-31 | 2011-06-29 | 日東電工株式会社 | 半導体ウエハへの粘着テープ貼付け方法および半導体ウエハからの保護テープ剥離方法 |
JP4773419B2 (ja) * | 2007-12-20 | 2011-09-14 | リンテック株式会社 | シート貼付装置及び貼付方法 |
JP5117934B2 (ja) * | 2008-06-06 | 2013-01-16 | リンテック株式会社 | マウント装置及びマウント方法 |
JP2013232582A (ja) * | 2012-05-01 | 2013-11-14 | Nitto Denko Corp | 粘着テープ貼付け方法および粘着テープ貼付け装置 |
-
2014
- 2014-11-10 JP JP2014227956A patent/JP6375209B2/ja not_active Expired - Fee Related
-
2015
- 2015-10-30 KR KR1020150151767A patent/KR20160055693A/ko unknown
- 2015-11-09 TW TW104136784A patent/TW201633438A/zh unknown
- 2015-11-09 CN CN201510759775.1A patent/CN105590891A/zh active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20230076358A (ko) | 2021-11-24 | 2023-05-31 | 주식회사 두오텍 | 다이싱 테이프 마운터 장치 |
Also Published As
Publication number | Publication date |
---|---|
CN105590891A (zh) | 2016-05-18 |
JP2016092329A (ja) | 2016-05-23 |
TW201633438A (zh) | 2016-09-16 |
JP6375209B2 (ja) | 2018-08-15 |
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