KR20160055693A - 점착 테이프 부착 방법 및 점착 테이프 부착 장치 - Google Patents

점착 테이프 부착 방법 및 점착 테이프 부착 장치 Download PDF

Info

Publication number
KR20160055693A
KR20160055693A KR1020150151767A KR20150151767A KR20160055693A KR 20160055693 A KR20160055693 A KR 20160055693A KR 1020150151767 A KR1020150151767 A KR 1020150151767A KR 20150151767 A KR20150151767 A KR 20150151767A KR 20160055693 A KR20160055693 A KR 20160055693A
Authority
KR
South Korea
Prior art keywords
adhesive tape
holding
wafer
convex portion
semiconductor wafer
Prior art date
Application number
KR1020150151767A
Other languages
English (en)
Korean (ko)
Inventor
쵸헤이 오쿠노
마사유키 야마모토
Original Assignee
닛토덴코 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛토덴코 가부시키가이샤 filed Critical 닛토덴코 가부시키가이샤
Publication of KR20160055693A publication Critical patent/KR20160055693A/ko

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836Wafer tapes, e.g. grinding or dicing support tapes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H37/00Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
    • B65H37/04Article or web delivery apparatus incorporating devices for performing specified auxiliary operations for securing together articles or webs, e.g. by adhesive, stitching or stapling
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00Handling processes for sheets or webs
    • B65H2301/50Auxiliary process performed during handling process
    • B65H2301/51Modifying a characteristic of handled material
    • B65H2301/516Securing handled material to another material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Textile Engineering (AREA)
KR1020150151767A 2014-11-10 2015-10-30 점착 테이프 부착 방법 및 점착 테이프 부착 장치 KR20160055693A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-227956 2014-11-10
JP2014227956A JP6375209B2 (ja) 2014-11-10 2014-11-10 粘着テープ貼付け方法および粘着テープ貼付け装置

Publications (1)

Publication Number Publication Date
KR20160055693A true KR20160055693A (ko) 2016-05-18

Family

ID=55930362

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150151767A KR20160055693A (ko) 2014-11-10 2015-10-30 점착 테이프 부착 방법 및 점착 테이프 부착 장치

Country Status (4)

Country Link
JP (1) JP6375209B2 (zh)
KR (1) KR20160055693A (zh)
CN (1) CN105590891A (zh)
TW (1) TW201633438A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230076358A (ko) 2021-11-24 2023-05-31 주식회사 두오텍 다이싱 테이프 마운터 장치

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020172785A1 (en) * 2019-02-26 2020-09-03 Yangtze Memory Technologies Co., Ltd. Method and device for wafer taping
JP7464472B2 (ja) 2020-07-17 2024-04-09 株式会社ディスコ 加工装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004158768A (ja) * 2002-11-08 2004-06-03 Disco Abrasive Syst Ltd 半導体ウエーハおよびサブストレート
CN101116182B (zh) * 2005-02-18 2010-10-06 三井化学株式会社 半导体晶片表面保护薄片及使用其的半导体晶片保护方法
JP5049485B2 (ja) * 2005-11-08 2012-10-17 ソマール株式会社 粘着剤組成物及び粘着シート
JP4711904B2 (ja) * 2006-07-31 2011-06-29 日東電工株式会社 半導体ウエハへの粘着テープ貼付け方法および半導体ウエハからの保護テープ剥離方法
JP4773419B2 (ja) * 2007-12-20 2011-09-14 リンテック株式会社 シート貼付装置及び貼付方法
JP5117934B2 (ja) * 2008-06-06 2013-01-16 リンテック株式会社 マウント装置及びマウント方法
JP2013232582A (ja) * 2012-05-01 2013-11-14 Nitto Denko Corp 粘着テープ貼付け方法および粘着テープ貼付け装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230076358A (ko) 2021-11-24 2023-05-31 주식회사 두오텍 다이싱 테이프 마운터 장치

Also Published As

Publication number Publication date
TW201633438A (zh) 2016-09-16
CN105590891A (zh) 2016-05-18
JP2016092329A (ja) 2016-05-23
JP6375209B2 (ja) 2018-08-15

Similar Documents

Publication Publication Date Title
TWI433220B (zh) 黏著帶切斷方法及利用此方法之裝置
TWI420583B (zh) 黏著帶切斷方法及利用此方法之黏著帶貼附裝置
KR20160055693A (ko) 점착 테이프 부착 방법 및 점착 테이프 부착 장치
JP2011109008A (ja) 粘着テープ貼付け装置および粘着テープ貼付け方法
JP2010135436A (ja) 基板への接着テープ貼り付け装置
JP2013232582A (ja) 粘着テープ貼付け方法および粘着テープ貼付け装置
KR20140029313A (ko) 점착 테이프 부착 방법 및 점착 테이프 부착 장치
JP6636696B2 (ja) 半導体ウエハのマウント方法および半導体ウエハのマウント装置
JP2015167205A (ja) 保護テープ剥離装置及び保護テープ剥離方法
JP2015162634A (ja) ウエハへの保護テープの貼付装置およびウエハの製造方法
KR20140029312A (ko) 점착 테이프 부착 방법 및 점착 테이프 부착 장치
JP2011109007A (ja) マウント装置およびマウント方法
CN108687587B (zh) 磨削装置
KR20170021202A (ko) 보호 테이프 부착 방법
CN105390415A (zh) 粘合带剥离方法和粘合带剥离装置
KR20170027289A (ko) 보호 테이프 부착 방법 및 보호 테이프 부착 장치
US20160071751A1 (en) Sheet attachment device and attachment method
JP2013184269A (ja) 板状ワークの保持解除方法及び加工装置
TW201622042A (zh) 黏著帶貼附方法及黏著帶貼附裝置
JP5319539B2 (ja) テープ接着方法および電子部品製造方法
JP2010067782A (ja) 表面保護フィルム剥離装置
JP2011233697A (ja) シート剥離装置及び剥離方法
JP2008066478A (ja) テープ接着方法および電子部品製造方法
WO2017065005A1 (ja) 粘着テープ貼付け方法および粘着テープ貼付け装置
TW201711131A (zh) 支持裝置及支持方法