KR20160055693A - 점착 테이프 부착 방법 및 점착 테이프 부착 장치 - Google Patents

점착 테이프 부착 방법 및 점착 테이프 부착 장치 Download PDF

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Publication number
KR20160055693A
KR20160055693A KR1020150151767A KR20150151767A KR20160055693A KR 20160055693 A KR20160055693 A KR 20160055693A KR 1020150151767 A KR1020150151767 A KR 1020150151767A KR 20150151767 A KR20150151767 A KR 20150151767A KR 20160055693 A KR20160055693 A KR 20160055693A
Authority
KR
South Korea
Prior art keywords
adhesive tape
holding
wafer
convex portion
semiconductor wafer
Prior art date
Application number
KR1020150151767A
Other languages
English (en)
Korean (ko)
Inventor
쵸헤이 오쿠노
마사유키 야마모토
Original Assignee
닛토덴코 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛토덴코 가부시키가이샤 filed Critical 닛토덴코 가부시키가이샤
Publication of KR20160055693A publication Critical patent/KR20160055693A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
    • B65H37/04—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations for securing together articles or webs, e.g. by adhesive, stitching or stapling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/50—Auxiliary process performed during handling process
    • B65H2301/51—Modifying a characteristic of handled material
    • B65H2301/516—Securing handled material to another material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Textile Engineering (AREA)
KR1020150151767A 2014-11-10 2015-10-30 점착 테이프 부착 방법 및 점착 테이프 부착 장치 KR20160055693A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-227956 2014-11-10
JP2014227956A JP6375209B2 (ja) 2014-11-10 2014-11-10 粘着テープ貼付け方法および粘着テープ貼付け装置

Publications (1)

Publication Number Publication Date
KR20160055693A true KR20160055693A (ko) 2016-05-18

Family

ID=55930362

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150151767A KR20160055693A (ko) 2014-11-10 2015-10-30 점착 테이프 부착 방법 및 점착 테이프 부착 장치

Country Status (4)

Country Link
JP (1) JP6375209B2 (zh)
KR (1) KR20160055693A (zh)
CN (1) CN105590891A (zh)
TW (1) TW201633438A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230076358A (ko) 2021-11-24 2023-05-31 주식회사 두오텍 다이싱 테이프 마운터 장치

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020172785A1 (en) * 2019-02-26 2020-09-03 Yangtze Memory Technologies Co., Ltd. Method and device for wafer taping
JP7464472B2 (ja) 2020-07-17 2024-04-09 株式会社ディスコ 加工装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004158768A (ja) * 2002-11-08 2004-06-03 Disco Abrasive Syst Ltd 半導体ウエーハおよびサブストレート
CN101116182B (zh) * 2005-02-18 2010-10-06 三井化学株式会社 半导体晶片表面保护薄片及使用其的半导体晶片保护方法
JP5049485B2 (ja) * 2005-11-08 2012-10-17 ソマール株式会社 粘着剤組成物及び粘着シート
JP4711904B2 (ja) * 2006-07-31 2011-06-29 日東電工株式会社 半導体ウエハへの粘着テープ貼付け方法および半導体ウエハからの保護テープ剥離方法
JP4773419B2 (ja) * 2007-12-20 2011-09-14 リンテック株式会社 シート貼付装置及び貼付方法
JP5117934B2 (ja) * 2008-06-06 2013-01-16 リンテック株式会社 マウント装置及びマウント方法
JP2013232582A (ja) * 2012-05-01 2013-11-14 Nitto Denko Corp 粘着テープ貼付け方法および粘着テープ貼付け装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230076358A (ko) 2021-11-24 2023-05-31 주식회사 두오텍 다이싱 테이프 마운터 장치

Also Published As

Publication number Publication date
TW201633438A (zh) 2016-09-16
CN105590891A (zh) 2016-05-18
JP2016092329A (ja) 2016-05-23
JP6375209B2 (ja) 2018-08-15

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